Avishtech’s Gauss Stack provides industry-leading stack-up design and transmission line signal integrity capabilities. It also enables users to simulate and address critical printed circuit board (PCB) reliability failure modes, including board and package-level warpage, reliability issues in plated through holes and solder joints and resin starvation and delamination risks. Gauss Stack also allows users to simulate the reliability of microvias through reflow, thermal cycling testing, service life and/or any set of thermal excursions.

This capability has become critically important with emerging requirements for high-density interconnect boards. The rapid simulations, coupled with the fully integrated materials library, allow users to assess the reliability of a given stack-up and rapidly make modifications and iterate through to an optimal solution without needing to build and test prototype boards. This can substantially decrease the time and cost required for a development cycle.

In the latest version of Gauss Stack Pro, the enhanced version of Gauss Stack that extends these capabilities to the layout, users can perform advanced simulations that couple local, layout-specific, dielectric variations within each layer with delamination risks and microvia reliability.

All the results generated by Gauss Stack and Gauss Stack Pro have undergone rigorous validation and demonstrate excellent agreement with real-world measurements. This level of accuracy allows users to precisely evaluate reliability risks right at the design stage, fostering a sense of trust and confidence in the software.

Avishtech serves the PCB industry with design and simulation software. Learn how Gauss Stack, Gauss Stack Pro and Avishtech’s other Gauss offerings can help you computationally prototype your PCBs.

Avishtech
San Jose, Calif.
www.avishtech.com