TDK Corporation announced its participation in the International Microwave Symposium (IMS), the company will display a variety of products from its portfolio of RF technologies, applicable for industries ranging from automotive, mobile, IoT, communications and industrial equipment at booth 1810 from June 13-15, 2023, at the event in in San Diego, Calif. Products to be showcased include state-of-the-art low temperature co-fired ceramics (LTCC) and time-frequency slicing (TFS) antennas, filters, diplexers, triplexers, couplers, baluns and more.

With the growing demand for RF solutions across industries, TDK’s extensive portfolio of RF technologies aims to complement the leading electronics company’s existing roster of electronic components to provide a comprehensive solution for design engineers.

TDK product highlights include:

  • New RF Components for UWB Applications: With the mainstream adoption of UWB for various applications, TDK has introduced a range of initial products currently targeting UWB channels 5 and  9 – including antennas, diplexers, triplexers and filters. TDK can support either LTCC or TFS technologies. Applications range from consumer to automotive grade.   
  • RF Components for Wi-Fi 7 Applications: With the next generation of Wi-Fi (802.11be) coming, TDK has developed new RF components for either LTCC or TFS technologies. New products to cover the extended frequencies include couplers, splitters, diplexers, triplexers and filters.