Response Microwave, Inc.
Response Microwave has it's new 3 dB 90-degree quadrature hybrids for use in various antenna and radio applications within the popular UHF band on display at IMS. The new RMHY3.225-400Sf covers the 225 to 400 MHz band offering typical electrical performance of 0.25 dB insertion loss, VSWR of 1.2:1 and isolation of 23 dB minimum. Average power handling is 100 W and the unit is operational over the -40°C to +85°C range. Mechanical package is a small 1.6 x 1.6 x 0.5 in., plus SMA female connectors per MIL-C-39012.
Rohde and Schwarz
Rohde & Schwarz took a new way to experience and demonstrate solutions for RF and microwave applications. Attendees were able to put their design knowledge to test with the Rohde & Schwarz “Are you a genius?” RF Design challenge. The challenge incorporated a series of lab challenges that evaluate attendee’s knowledge in s-parameters, EVM, high power, and baseband measurements. In addition to the RF Design Challenge, Rohde & Schwarz highlighted multiple demonstrations at the company’s booth. These include the new 67 GHz noise figure measurement capability that further enhances the R&S ZNA vector network analyzer to provide a powerful and versatile test system for full characterization of amplifiers and converters. Several highlights at the Rohde & Schwarz booth were the latest solutions for early sub-terahertz and 6G research applications. The R&S FExx external frontends extend the frequency ranges of Rohde & Schwarz signal and spectrum analyzers, and signal generators up to the D-Band (110 to 170 GHz). Additionally, both the R&S ZNA vector network analyzers and the R&S FSWP phase noise analyzer will be demonstrating 6G D-band system and component characterization. There was also the R&S ATS1800C CATR based 5G and 6G mmWave Over-The-Air (OTA) test chamber, which provides the ideal environment for testing antennas, modules and devices from R&D to conformance. When equipped with the two side chamber extensions, a unique 3D quiet zone is formed, with which the test solution supports on a very small footprint RRM measurements, including multiple angles of arrival (AoA).
Samtec was demonstrating their microwave/mm Wave connector and cable systems, including the Magnum RFTM series as well as edge launch and vertical connectors in one comprehensive demo. They used a Keysight 8-port 53 GHz USB VNA to transmit signals to the four mmWave RF systems. In the demo, we see a Samtec Magnum RF edge launch, mated in a perpendicular configuration with a vertical, solderless, compression mount GPPC series. They achieve good performance up to 40 GHz with VSWR better than 1.4 and loss better than 1 dB. The second demo is a Samtec Magnum RF cable assembly system that consists of a Magnum RF edge launch connector and a GC47 cable assembly. In addition to improved density, this ganged cable assembly provides a more secure connection to the mating connector with the housing. Cable performance was VSWR under 1.4, loss is better than 4 dB with the 6 in of cable. The demo also featured two solderless, compression mount 2.40 mm edge launch connectors on the same PCB, connected by a 2” trace. Samtec has a VSWR of better than 1.3 in this demo. And finally, in the same configuration, there were two solderless, compression mount 2.92 mm edge launch connectors, with 2” of trace with VSWR of better than 1.3. Samtec can support frequencies up to 90 GHz (E-band) with loss performance improved over coaxial cables.
Samtec’s next-generation micro waveguide technology offers the near-loss performance of a rigid waveguide while still providing the flexibility and size typically associated with a coaxial cable. Another demo showed both E-band and V-band flexible waveguides. Finally, Samtec did a joint demonstration presented with Otava, Rohde and Schwarz, Taoglas, and Avnet. Wideband 24-30 GHz 5G mmWave capabilities were being demonstrated by establishing an over-the-air communication link between two Otava Phased Array Antenna Modules (PAAMs). The modulated 5G FR2 signal is generated using a Rohde & Schwarz SMW200A vector signal generator which is sent to the transmitting PAAM. The receiving PAAM connects to a Rohde & Schwarz FSW43 Spectrum Analyzer where the signal is then demodulated and characterized. SMPM edge mount connectors are on the antenna in module (AIM) and SMPM surface mount connectors are on the combiner card. Inline bullet adaptors link the connectors on the AiMs and combiner card.
Spectrum Control introduced SCi Blocks™, a family of next-generation, digitally-enabled, plug-and-play RF solutions that address the size, cost, and open architecture requirements of emerging military/aerospace system designs. The open, modular, digitally-enabled products will be available in three distinct tiers – RF Systems-in-Packages (RFSiPs), RF “sticks,” and Sensor Open Systems Architecture (SOSA™)-aligned OpenVPX modules. Spectrum Control unveiled the first products in this new family. The ultra-miniature, high-performance, digitally tunable, wideband downconverters and upconverters are designed to deliver a new level of SWaP-C for electronic warfare (EW), signal intelligence (SIGINT), and Intelligence Surveillance and Reconnaissance (ISR) applications. The other introduction is an OpenVPX RF transceiver offering the full fidelity of RF signal handling with integral digital control and minimal interconnects to create a wide range of design and usage options. These new products deliver total spectrum awareness from 20 MHz to 18 GHz, for up to 16 GHz of contiguous spectral coverage with 2 GHz of instantaneous bandwidth. The integrated digital gateway offers a level of intelligence and connectivity unseen in traditional RF components, significantly reducing system engineering time. The digital gateway has a simple four-wire interface for command and control with health and temperature monitoring. The high-performance downconverter stick offers a gain of 25 dB and noise figure of 14-17 dB across the entire frequency range. Other specifications include third order intercept (IP3) of 25 dBm and single tone spurious of >/=60 dBc, as well as IF calibration features for optimum spectral performance.
SPINNER's passive RF product portfolio includes a wide range of products for test & measurement in R&D and production environments, rotating systems, broadcasting systems, anechoic chambers, 5G and 6G applications up to 150 GHz. Examples are compact and boxed calibration kits, verification kits, ruggedized test port adapters, planar/co-planar connectors, flexible dielectric waveguides, low-PIM switches and self-aligning quick connectors for automated production testing, adapters ranging from 75 Ohm to 50 Ohm and rotary joints. The company showcased new millimeter wave waveguide-to-coaxial adapters for the V-, E-, W- and F-bands (50 to 120 GHz). These products target applications in automotive and industrial radar sensors testing, satcom, 5G mmWave and 6G frequency bands. Different variants combining the waveguide interfaces WR10, WR12 and WR15 with coaxial connectors 1.0 mm and 1.35 mm are available.
The company also featured a 1.35 mm E connector with performance from DC to 90 GHz. This product family was designed to address issues with unwanted unlocking of the 1.00 mm coaxial thread in time-consuming calibrations. This 1.35 mm E Connector is optimized for frequently used bands, allows thru-male“ design with multiple cables and prevents unintended opening of thread and coupling torque.
Tecdia's exhibition at IMS2023 featured their crystal capacitor, boasting high Q, low capacitance values and SMT mounting compatibility that is ideal for high frequency RF applications. Its stable and efficient operation meets the growing demands of modern electronic devices. Also on display was the K4200 Dielectric, a compact yet powerful material can tolerate voltages of up to 200 V, reducing mounting area by an impressive 40 percent. With a permittivity of 4200 and X7R temperature characteristics, K4200 is a high DK material suitable for applications that require EIA class materials to be screened to MIL standards. Also, Tecdia announced the restricted release of its upcoming V Type Varactor, which has tested to have significantly higher Q and tuneability than the H-Series. The V Type Varactor is in its final stages of development.
West Bond had their new 73KF Series Die Bonder on display, an excellent tool for meeting the challenging die attach applications found in the RF, microwave, semiconductor, hybrid and medical device fields. The 73KF Convertible Manual Die Bonder has a capacitive touch screen Interface and is designed with a gantry style chassis enabling virtually unlimited part size capacity. Their exclusive 8:1 ratio, purely orthogonal X-Y-Z micromanipulator allows the operator of the machine to place die with precision and ease.
WIN Semiconductors Corp.
WIN Semiconductors Corp. showcased its compound semiconductor RF and mmWave solutions in booth 235, with the commercial release of a 50 V 0.25 µm-gate RF GaN platform, NP25-20 and targets high performance front-end applications including radio access networks, satellite communications, electronic warfare and radar systems.
WIN also released their next-generation integrated mmWave GaAs platform, PQG3-0C. Targeting mmWave front-ends, the PQG3-0C technology combines individually optimized E-mode low noise and D-mode power pHEMTs to enable best-in-class power amplifier and low noise amplifier performance on the same chip.
Wireless Telecom Group
Wireless Telecom Group's test and measurement brands; Boonton, Holzworth, and Noisecom showcased their instruments in booth 1619. Boonton demonstrated fast-switching, low phase noise RF signal generation enabling accurate component characterization and testing of radar and communications systems. The measurement and analysis demonstration was made with Boonton's true average RF power sensors operating at a rate of 100,000 measurements per second. Higher-order modulation schemes, like those used in advanced communication systems, utilize signals with high peak-to-average power ratios that can strain amplifier performance. A demonstration featured the rapid identification of amplifier compression using crest factor measurements and statistical analysis from Boonton peak power sensor
Holzworth demonstrated broadband, low phase noise signal generation and real-time phase noise analysis, supporting the quick evaluation of a local oscillator’s performance and symbol error contributions in 5G and Wi-Fi communications systems. Noisecom programmable noise generators can produce highly controllable additive white Gaussian noise (AWGN) used to analyze system behavior when operating in real-world noise conditions, with results analyzed by industry-leading peak power sensors from Boonton
Wireless Telecom Group also presented a technical session in the IMS MicroApps theater entitled, “I Know I Need to Measure RF Power – Now What?” The seminar provided practical insight for measuring RF and microwave power, including different sensor technologies and architectures, as well as important sensor considerations to enable modern radar and communications system.
Wolfspeed was exhibiting in booth 1735 and they were big contributors to the overall IMS show. Company representatives participated in a workshop on using modeling, simulation and characterization to improve power RF performance on Monday and presented a paper on modeling GaN-on-SiC device building blocks on Tuesday. In addition, a Wednesday session on power amplifier architectures was dedicated to the late John Palmour, co-founder of Wolfspeed. Wolfspeed demonstrated the CMPA5259100S, a 100 W 50 V GaN MMIC HPA targeting radar applications in the 5.0-5.9 GHz frequency range with 25 dB of large signal gain. They also showcased the CMPA851A050S, an 80W HPA that utilizes Wolfspeed's 0.15 micron GaN-on-SiC process. This device operates from 8.5 - 10.5 GHz and supports both defense and commercial radar applications. Wolfspeed also highlighted the CMPA601J025F, a 25 W GaN-on-SiC MMIC using Wolfspeed's 0.15 micron process. The amplifier operates from 6 to 18 GHz and supports a variety of end applications like electronic warfare, test instrumentation, radar and general amplification.
At IMS, Xpeedic unveiled RF Electronic Design Automation (EDA) Solution 2023 edition, showcasing its ability to accelerate the design of highly integrated RF modules and systems using its differentiating chip-package-system EDA tools and mass-production proven integrated passive devices (IPD) IP. The RF EDA Solution includes XDS, Xpeedic’s RF system-level design and simulation platform, IRIS, its on-chip passive modeling and simulation tool, and iModeler, a passive model generation tool.