Response Microwave, Inc.

Response Microwave has it's new 3 dB 90-degree quadrature hybrids for use in various antenna and radio applications within the popular UHF band on display at  IMS. The new RMHY3.225-400Sf covers the 225 to 400 MHz band offering typical electrical performance of 0.25 dB insertion loss, VSWR of 1.2:1 and isolation of 23 dB minimum. Average power handling is 100 W and the unit is operational over the -40°C to +85°C range. Mechanical package is a small 1.6 x 1.6 x 0.5 in., plus SMA female connectors per MIL-C-39012.

RF Microtech Electronics

RF Microtech Electronics announced the launch of its latest line-up of cutting-edge products. Key highlights of the new product offerings include: RF modules and components; wireless development kits with development boards, wireless modules, documentation and software tools; and wireless modules Test Kit for IoT testing applications.

Rohde and Schwarz

IMG_5273.jpgRohde & Schwarz took a new way to experience and demonstrate solutions for RF and microwave applications. Attendees were able to put their design knowledge to test with the Rohde & Schwarz “Are you a genius?” RF Design challenge. The challenge incorporated a series of lab challenges that evaluate attendee’s knowledge in s-parameters, EVM, high power, and baseband measurements. In addition to the RF Design Challenge, Rohde & Schwarz highlighted multiple demonstrations at the company’s booth. These include the new 67 GHz noise figure measurement capability that further enhances the R&S ZNA vector network analyzer to provide a powerful and versatile test system for full characterization of amplifiers and converters. Several highlights at the Rohde & Schwarz booth were the latest solutions for early sub-terahertz and 6G research applications. The R&S FExx external frontends extend the frequency ranges of Rohde & Schwarz signal and spectrum analyzers, and signal generators up to the D-Band (110 to 170 GHz). Additionally, both the R&S ZNA vector network analyzers and the R&S FSWP phase noise analyzer will be demonstrating 6G D-band system and component characterization. There was also the R&S ATS1800C CATR based 5G and 6G mmWave Over-The-Air (OTA) test chamber, which provides the ideal environment for testing antennas, modules and devices from R&D to conformance. When equipped with the two side chamber extensions, a unique 3D quiet zone is formed, with which the test solution supports on a very small footprint RRM measurements, including multiple angles of arrival (AoA).

Rogers Corporation 

In addition to giving two presentations in the MicroApps theater, Rogers showcased their products at booth 1635. These products included Radix™ 3D Printable Dielectrics and new Anteo™ low loss laminates. Rogers new family of Anteo laminates is designed to offer low loss RF performance as an alternative to FR-4 in commercial and consumer applications. With a dielectric constant of 4.07 +/- 0.08 and a dissipation factor of .005 at 10 GHz, Anteo laminates offer two benefits in comparison to thicker grades of FR-4. For a comparable price, it offers superior performance and enables greater antenna gain and efficiency. But the lower dissipation factor also enables similar or marginally improved performance at 1/3rd to ½ the thickness of FR-4, thus providing a significant cost savings and improvement in packaging. Radix™ 3D Printable Dielectric is the first 3D material featuring a dielectric constant of 2.8 and low loss characteristics at microwave frequencies. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints. Rogers Corporation’s Radix 3D Printable Dielectric is a proprietary composite material designed for Digital Light Processing (DLP) 3D printing, enabling a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. This printable dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured. The material is intended for use as RF material in applications where new geometric freedom can enhance the figure of merits of an RF system, such as gradient dielectric constant (GRIN) structures and other complex three-dimensional parts. The Radix 3D Printable Dielectric offers the industry a way to manufacture systems and components at scale that could not be made with traditional fabrication methods. 


IMG_5363.jpgSamtec was demonstrating their microwave/mm Wave connector and cable systems, including the Magnum RFTM series as well as edge launch and vertical connectors in one comprehensive demo. They used a Keysight 8-port 53 GHz USB VNA to transmit signals to the four mmWave RF systems. In the demo, we see a Samtec Magnum RF edge launch, mated in a perpendicular configuration with a vertical, solderless, compression mount GPPC series. They achieve good performance up to 40 GHz with VSWR better than 1.4 and loss better than 1 dB. The second demo is a Samtec Magnum RF cable assembly system that consists of a Magnum RF edge launch connector and a GC47 cable assembly.  In addition to improved density, this ganged cable assembly provides a more secure connection to the mating connector with the housing. Cable performance was VSWR under 1.4, loss is better than 4 dB with the 6 in of cable. The demo also featured two solderless, compression mount 2.40 mm edge launch connectors on the same PCB, connected by a 2” trace.  Samtec has a VSWR of better than 1.3 in this demo. And finally, in the same configuration, there were two solderless, compression mount 2.92 mm edge launch connectors, with 2” of trace with VSWR of better than 1.3. Samtec can support frequencies up to 90 GHz (E-band) with loss performance improved over coaxial cables.

Samtec’s next-generation micro waveguide technology offers the near-loss performance of a rigid waveguide while still providing the flexibility and size typically associated with a coaxial cable. Another demo showed both E-band and V-band flexible waveguides. Finally, Samtec did a joint demonstration presented with Otava, Rohde and Schwarz, Taoglas, and Avnet. Wideband 24-30 GHz 5G mmWave capabilities were being demonstrated by establishing an over-the-air communication link between two Otava Phased Array Antenna Modules (PAAMs). The modulated 5G FR2 signal is generated using a Rohde & Schwarz SMW200A vector signal generator which is sent to the transmitting PAAM. The receiving PAAM connects to a Rohde & Schwarz FSW43 Spectrum Analyzer where the signal is then demodulated and characterized. SMPM edge mount connectors are on the antenna in module (AIM) and SMPM surface mount connectors are on the combiner card. Inline bullet adaptors link the connectors on the AiMs and combiner card.


San-tron is a Massachusetts-based, family-owned business with over six decades of experience. The have an extensive line of RF and microwave coaxial connectors and adapters, cable assemblies, along with what they call innovations in these areas. With these products, they target A&D, industrial and medical, space, telecommunication and test and measurement applications. At IMS, San-tron unveiled a new line of 1.85 mm field-replaceable connectors available in 3/8 in. and 1/2 in. square, 2-hole .550 in. flange and 2-hole .625 in. flange configurations for 0.009 in. launch pin diameters. Other mounting options are available upon request.  1.85mm connectors are also inter-mateable with 2.4 mm connectors. Typical VSWR performance is below 1.15:1 to 50 GHz and 1.25:1 to 65 GHz. These 1.85 mm connectors are made with gold-plated beryllium copper contacts, polyetherimide (PEI) capture bead and 303 stainless steel bodies. 

Signal Hound 

IMG_5268.jpgSignal Hound engineers debuted it's SP145 Spectrum Analyzer at booth 2049. The SP145 is specialized for accurate remote spectrum monitoring and analysis in a portable, durable format. It features 200 GHz/sec sweep speed, 40 MHz streaming bandwidth and -160 dBm displayed noise average. An included internal GPS adds a critical dimension of spectrum analysis when out in the field. It is USB-C powered for fast and accurate RF data acquisition in a continuously changing environment. With specific application toward field use, the SP145 excels at drive test, vector signal analysis, RF survey and even airborne measurement functionality. Additional features include Programmable API/SCIPI Automation and Real-Time Analysis.

Spectrum Control 

Spectrum Control introduced SCi Blocks™, a family of next-generation, digitally-enabled, plug-and-play RF solutions that address the size, cost, and open architecture requirements of emerging military/aerospace system designs. The open, modular, digitally-enabled products will be available in three distinct tiers – RF Systems-in-Packages (RFSiPs), RF “sticks,” and Sensor Open Systems Architecture (SOSA™)-aligned OpenVPX modules. Spectrum Control unveiled the first products in this new family. The ultra-miniature, high-performance, digitally tunable, wideband downconverters and upconverters are designed to deliver a new level of SWaP-C for electronic warfare (EW), signal intelligence (SIGINT), and Intelligence Surveillance and Reconnaissance (ISR) applications. The other introduction is an OpenVPX RF transceiver offering the full fidelity of RF signal handling with integral digital control and minimal interconnects to create a wide range of design and usage options. These new products deliver total spectrum awareness from 20 MHz to 18 GHz, for up to 16 GHz of contiguous spectral coverage with 2 GHz of instantaneous bandwidth. The integrated digital gateway offers a level of intelligence and connectivity unseen in traditional RF components, significantly reducing system engineering time. The digital gateway has a simple four-wire interface for command and control with health and temperature monitoring. The high-performance downconverter stick offers a gain of 25 dB and noise figure of 14-17 dB across the entire frequency range. Other specifications include third order intercept (IP3) of 25 dBm and single tone spurious of >/=60 dBc, as well as IF calibration features for optimum spectral performance.


SPINNER's passive RF product portfolio includes a wide range of products for test & measurement in R&D and production environments, rotating systems, broadcasting systems, anechoic chambers, 5G and 6G applications up to 150 GHz. Examples are compact and boxed calibration kits, verification kits, ruggedized test port adapters, planar/co-planar connectors, flexible dielectric waveguides, low-PIM switches and self-aligning quick connectors for automated production testing, adapters ranging from 75 Ohm to 50 Ohm and rotary joints. The company showcased new millimeter wave waveguide-to-coaxial adapters for the V-, E-, W- and F-bands (50 to 120 GHz). These products target applications in automotive and industrial radar sensors testing, satcom, 5G mmWave and 6G frequency bands. Different variants combining the waveguide interfaces WR10, WR12 and WR15 with coaxial connectors 1.0 mm and 1.35 mm are available. 

The company also featured a 1.35 mm E connector with performance from DC to 90 GHz. This product family was designed to address issues with unwanted unlocking of the 1.00 mm coaxial thread in time-consuming calibrations. This 1.35 mm E Connector is optimized for frequently used bands, allows thru-male“ design with multiple cables and prevents unintended opening of thread and coupling torque.

SV Microwave

SV Microwave had a variety of products samples such as the Collaborative VITA Kit Aligned to the Sensor Open Systems Architecture group (SOSA) Technical Standard™. SV Microwave offers VITA 67.1, VITA 67.2 and 67.3 RF connectors, contacts and cable assemblies. Designed for side-by-side implementation with other standards like VITA 46 and VITA 66, VITA 67 SMPM and SMPS interconnects are a high-density RF addition to the VPX platform. The interconnects are easy to install and feature cable assembly plug-in modules that mate to backplane connector modules. 

Tabor Electronics

At IMS, Tabor Electronics introduced the Lucid-X Series Microwave Signal Generators. The Lucid-X family of signal generators have 8 GHz, 20 GHz and 40 GHz frequency ranges. With phase noise of -120 dBc/Hz at 1 GHz (10 kHz offset), fast and high-resolution frequency switching, with +15 dBm of standard output power, these instruments outperform some of the market’s most challenging requirements. Built on Tabor’s modular technology platform, the LS-X family is available in PXIe, USB-module, rack, benchtop and portable form factors.

Tagore Technology

Tagore Technology was founded in January 2011 to pioneer GaN-on-silicon semiconductor technology for RF and power management applications. At IMS, Tagore announced the TSL8029N, a high-power receiver module with an integrated receiver protection switch and low noise amplifier in a single package. The receiver module is designed to address many of the challenges in 5G macro base station implementation. The company is a fabless semiconductor company with design centers in Arlington Heights, Illinois and Kolkata, India. The company focuses on wide bandgap technologies to address RF and power design challenges in 5G cellular infrastructure, consumer, automotive and defense and security applications.

TDK Corporation 

TDK had a variety of products from its portfolio of RF technologies, applicable for industries ranging from automotive, mobile, IoT, communications and industrial equipment at booth 1810. Products showcased included state-of-the-art LTCC and TFS antennas, filters, diplexers, triplexers, couplers, baluns and more. 

Tecdia Inc. 

Tecdia's exhibition at IMS2023 featured their crystal capacitor, boasting high Q, low capacitance values and SMT mounting compatibility that is ideal for high frequency RF applications. Its stable and efficient operation meets the growing demands of modern electronic devices. Also on display was the K4200 Dielectric, a compact yet powerful material can tolerate voltages of up to 200 V, reducing mounting area by an impressive 40 percent. With a permittivity of 4200 and X7R temperature characteristics, K4200 is a high DK material suitable for applications that require EIA class materials to be screened to MIL standards. Also, Tecdia announced the restricted release of its upcoming V Type Varactor, which has tested to have significantly higher Q and tuneability than the H-Series. The V Type Varactor is in its final stages of development.


IMG_5312.jpgTeledyne e2v HiRel announced the release of a new space COTS (Commercial-Off-The-Shelf) phase locked loop (PLL) designed to deliver exceptional performance and reliability in space applications. The TDPL97240 is packaged in a small, 7x7 mm, non-hermetic, epoxy sealed, ceramic quad, no-leads, (QFN) flat package that offers 75% board size reduction vs. the standard space grade ceramic part. It is radiation tolerant to 100 krad (Si) total ionizing dose (TID) and built on silicon-on-sapphire (SOS) technology. This gives the PLL natural radiation tolerance and immunity to single-event latch-up (SEL) effects. It also has a lock frequency range of 50 MHz - 5 GHz, dual modulus prescaler (5/6 & 10/11) for greater frequency flexibility and capability of either serial interface or direct pin programming.Times Microwave


TMYTEK collaborated with NI to conduct a live demonstration of wireless communication utilizing their new  XRifle Reflector and 5G mmW-Coverage solution . By strategically configuring the XRifle's eight reflectors with varying incidence and reflection angles, and combining TMYTEK's BBox, beamformer, and UD Box up/down converter along with NI SDR technology, the demonstration emulates a gNB and UE with an SDR-based testbed, redistributes FR2 mmWave signals using RIS technology, and constructs optimal coverage at a reasonable cost. This is an interesting solution that is totally passive and focuses the beam so that the signal strength is not lost. The reflectors are available in various angles and low cost.

Times Microwave

Times Microwave was showcasing recent product examples of their broad portfolio of cables and assemblies, connectors, test and measurement products, tools and accessories and lightning protection and grounding products. The company supplies these products to a wide variety of commercial, defense and medical markets. 

West Bond

West Bond had their new 73KF Series Die Bonder on display, an excellent tool for meeting the challenging die attach applications found in the RF, microwave, semiconductor, hybrid and medical device fields. The 73KF Convertible Manual Die Bonder has a capacitive touch screen Interface and is designed with a gantry style chassis enabling virtually unlimited part size capacity. Their exclusive 8:1 ratio, purely orthogonal X-Y-Z micromanipulator allows the operator of the machine to place die with precision and ease.

WIN Semiconductors Corp.

WIN Semiconductors Corp. showcased its compound semiconductor RF and mmWave solutions in booth 235, with the commercial release of a 50 V 0.25 µm-gate RF GaN platform, NP25-20 and targets high performance front-end applications including radio access networks, satellite communications, electronic warfare and radar systems.

WIN also released their next-generation integrated mmWave GaAs platform, PQG3-0C. Targeting mmWave front-ends, the PQG3-0C technology combines individually optimized E-mode low noise and D-mode power pHEMTs to enable best-in-class power amplifier and low noise amplifier performance on the same chip.

Wireless Telecom Group

Wireless Telecom Group's test and measurement brands; Boonton, Holzworth, and Noisecom showcased their instruments in booth 1619. Boonton demonstrated fast-switching, low phase noise RF signal generation enabling accurate component characterization and testing of radar and communications systems. The measurement and analysis demonstration was made with Boonton's true average RF power sensors operating at a rate of 100,000 measurements per second. Higher-order modulation schemes, like those used in advanced communication systems, utilize signals with high peak-to-average power ratios that can strain amplifier performance. A demonstration featured the rapid identification of amplifier compression using crest factor measurements and statistical analysis from Boonton peak power sensor

Holzworth demonstrated broadband, low phase noise signal generation and real-time phase noise analysis, supporting the quick evaluation of a local oscillator’s performance and symbol error contributions in 5G and Wi-Fi communications systems. Noisecom programmable noise generators can produce highly controllable additive white Gaussian noise (AWGN) used to analyze system behavior when operating in real-world noise conditions, with results analyzed by industry-leading peak power sensors from Boonton

Wireless Telecom Group also presented a technical session in the IMS MicroApps theater entitled, “I Know I Need to Measure RF Power – Now What?” The seminar provided practical insight for measuring RF and microwave power, including different sensor technologies and architectures, as well as important sensor considerations to enable modern radar and communications system.


Wolfspeed was exhibiting in booth 1735 and they were big contributors to the overall IMS show. Company representatives participated in a workshop on using modeling, simulation and characterization to improve power RF performance on Monday and presented a paper on modeling GaN-on-SiC device building blocks on Tuesday. In addition, a Wednesday session on power amplifier architectures was dedicated to the late John Palmour, co-founder of Wolfspeed. Wolfspeed demonstrated the CMPA5259100S, a 100 W 50 V GaN MMIC HPA targeting radar applications in the 5.0-5.9 GHz frequency range with 25 dB of large signal gain. They also showcased the CMPA851A050S, an 80W HPA that utilizes Wolfspeed's 0.15 micron GaN-on-SiC process. This device operates from 8.5 - 10.5 GHz and supports both defense and commercial radar applications. Wolfspeed also highlighted the CMPA601J025F, a 25 W GaN-on-SiC MMIC using Wolfspeed's 0.15 micron process. The amplifier operates from 6 to 18 GHz and supports a variety of end applications like electronic warfare, test instrumentation, radar and general amplification. 


At IMS, Xpeedic unveiled RF Electronic Design Automation (EDA) Solution 2023 edition, showcasing its ability to accelerate the design of highly integrated RF modules and systems using its differentiating chip-package-system EDA tools and mass-production proven integrated passive devices (IPD) IP. The RF EDA Solution includes XDS, Xpeedic’s RF system-level design and simulation platform, IRIS, its on-chip passive modeling and simulation tool, and iModeler, a passive model generation tool.


YTTEK was featuring liquid crystal reconfigurable intelligent surfaces where the reflection angle can be actively changed by changing the orientation of the liquid crystals since that changes the impedance. They operate at 29.4 GHz with power consumption of less than 500 mW using a 400 unit cell (120 mm square). They also featured a software defined payload for LEO satellites and UAVs. Cubesat size, space qualified hardware operating at X-Band using a Xilinx Zynq FPGA. Finally, they had a Ka-Band UT antenna array for LEO satellites that is a discrete LTCC ship antenna in a 1024 array with 34 dBi antenna gain.