IMS2023 Show Wrap-Up: Glad to be Back to Normal!
Sunny San Diego marked the first industry conference and exhibition that we have seen that was back to “normal.” With more than 9,200 registrants and 2,700 delegates, IEEE MTT-S IMS 2023 had an attendance and activity level that has not been seen since the pre-COVID days. The event took place June 11-16 with a technical program that had some 360 technical papers, presenting “the Coolest Ideas under the Sun” in the RF and microwave field, in addition to the industry exhibition with about 550 companies demonstrating their latest products and services. It was a great networking event with many re-connecting in person for the first time in a while.
IMS2023 introduced several innovations. The focus themes included:
- Wireless Communications, including 6G developments, Wi-Fi, RF and microwave system-on-chip integration, massive MIMO systems and subsystems and more
- Artificial Intelligence and Machine Learning (AI/ML) Technologies for Microwaves
- Model-Based Systems Engineering, including Digital Twins
- Space and Aerospace
- Wireless Power Transfer
- RF and Microwave Technology in Biomedical Applications.
Each theme had focused technical sessions, workshops, a keynote speaker, a panel session and a technical lecture. Additionally, there was a “Systems Pavilion” in the industry exhibition, showcasing wireless, with demos by the finalists in the ‘MTT-Sat Challenge.’ IMS2023 also featured the “Connected Futures Summit” co-sponsored by the IEEE Communications Society.
With a show as massive as IMS, it can be challenging to see everything the show has to offer. Whether you were unable to make the event, busy meeting with colleagues, participating in the technical program, or a culmination of all, you may not have had the time to walk through the exhibition as much as you'd like to. That's why Microwave Journal has put together this IMS2023 show wrap-up, in case you missed the best of IMS2023 exhibition.
Photo Gallery: https://www.microwavejournal.com/media/photos/122-ims2023
Frequency Matters Updates from the Exhibition Floor Each Day
June 13 Wrap Up
June 14 Wrap Up
June 15 Wrap Up
Aethertek unveiled its latest frequency range 2 (FR2) 5G mmWave technology at IMS, including their antenna-in-module (AiM), transforming lower-frequency radio units into FR2 mmWave 5G-capable devices. The dual polarization AiM has a power output of 47 dBm EIRP with transmission quality of EVM under 5 percent. It mitigates the common challenge of signal loss in FR2 5G caused by obstacles like walls, materials and living organisms. Designed for indoor and semi-outdoor environments, such as train stations, the AiM serves as an solution for the telecommunications. Aethertek is actively working on reducing the module's size and minimizing power consumption.
Altum RF featured products included new components for satcom and radar markets. These K- and Ka-Band power amplifiers, and X-Band low noise/driver amplifiers, integrated front-end and switches reflect Altum RF’s concentration on developing products that offer the increased power, higher frequency, greater bandwidth and increased integration demanded by these markets. Product highlights included:
- ARF1014: 27–31.5 GHz GaN 12 W power amplifier MMIC, 17 dB power gain
- ARF1026Q4: 27–31.5 GHz linear amplifier, 26 dBm P1dB
- ARF1502Q4: 8–12 GHz front end integrated circuit, 26 dB Tx power gain
- ARF1020Q5: 9–11 GHz GaN power amplifier, 10 W output power.
At IMS2023, Analog Devices demonstrated how its RF solutions enable companies to develop disruptive technologies in instrumentation, communications, industrial and aerospace applications by accelerating innovation, enhancing reliability as well as reducing complexity and footprint in RFIC designs. One of the biggest announcements at IMS was the ADI Apollo MxFE. It is the most advanced software-defined, direct RF-sampling, wideband mixed signal front end platform in the market. Apollo MxFE enables next-generation applications such as phased array radar, electronic surveillance, test and measurement, and 6G communications in the Aerospace & Defense, Instrumentation, and Wireless Communications industries. This monolithic 16nm CMOS device utilizes state of the art high dynamic range RF ADC and RF DAC cores has excellent spurious free dynamic range and noise spectral density. The 4T4R product offers four 12-bit RF ADCs with a sample rate up to 20 GSPS, four 16-bit RF DACs with a sample rate up to 28 GSPS, an RF input bandwidth from DC to 18GHz and an instantaneous bandwidth up to 10 GHz. Apollo MxFE is the industry’s first integrated radio that is capable of directly interfacing to the emerging 6G frequency bands from 7 to 15 GHz. The on-chip DSP offers a real-time FFT Sniffer, a full-rate programmable FIR filter, a 128-tap complex FIR filter, fast-hopping NCOs, DDCs/DUCs, and a fractional sample rate converter. The DSP is dynamically configurable, allowing for rapid changes between narrowband and wideband profiles without taking down the JESD link. Apollo MxFE supports JESD 204B/C and a very short reach interface. Apollo MxFE’s 8T8R product offers eight RF ADCs with a sample rate up to 8 GSPS, eight RF DACs with a sample rate up to 16 GSPS, an RF input bandwidth up to 16 GHz, and an instantaneous bandwidth up to 3 GHz. The on-chip DSP offers similar features and functionality to the 4T4R device with double the number of digital blocks, all dynamically configurable.
Also on display was the ADAR3002, a dual beam, four-element dual polarization receive beamforming IC operating from 17.7 to 21.2 GHz and the ADAR3003, a single beam, four element dual polarization transmit beamforming IC operating from 27.7 to 31.5 GHz. Their low power and high level of digital integration make them ideal for applications such as airborne terminals, man-pack radios and satcom-on-the-move.
Anoison Innovation addressed a twenty-first century need. In order to address size and weight issues with traditional D38999 connectors, Anoison developed SMPS Size-16 coax for Amphenol 2M805 (Micro38999) connectors, available in two major cable diameters, 0.086 and 0.047. Micro38999 is 50 percent smaller and 60 percent more contact density than traditional D38999 resulting in up to 70 percent weight savings and 50 percent size savings compared to traditional D38999.
Anokiwave featured their portfolio of mmWave silicon ICs, that are shipping in volume and commercially deployed in working antennas, that enable active antennas across multiple markets, specifically 5G, satcom and aerospace and defense. Anokiwave's satcom Ku- and Ka-Band ICs are used in multiple terminal designs operating live satellite links globally, and their performance, cost-effectiveness and availability in volume enables customers to design, build and deploy satcom systems with confidence in their choice of ICs for commercial success. At the Connected Future Summit, Ryan Jennings, Anokiwave vice president of satcom and systems, discussed ways in which satcom will play a key part in extending terrestrial 5G networks to air, sea and other remote areas not covered by small cell networks and how active antennas are uniquely suited for this growth area.
Anokiwave and Starry Group collaborated to develop Starry’s next-generation customer premises receivers (CPE) to deliver affordable, high-capacity home broadband access across the 24 and 3 GHz spectrum bands. As part of this collaboration, Anokiwave designed a complete Phased Array Antenna Module (PAAM) using its industry leading Gen-4 silicon ICs, to accelerate Starry’s time-to-market for Outdoor CPE units, that met or exceeded all cost and technical specifications and is now ready for production. Starry’s gigabit-capable licensed fixed wireless technology dramatically reduces the cost of providing a home with a gigabit quality signal and low-cost WiFi modem, instead of the traditional 5G modems. This reduces the average total cost of a Fixed Wireless Access point to nearly 1/100th the cost of building fiber to the home. Starry’s technology also enables significant reductions in network build time as compared to wireline networks. Anokiwave’s PAAM helped Starry to meet their aggressive cost, schedule, and performance requirements. The Anokiwave developed 24 and 37 GHz PAAMs allowed Starry to reach production ready design and complete radio in less than 12 months from the start of the project.
Anritsu showcased the new 70 GHz Rubidium™ MG36271A RF/Microwave Signal Generator. Live demonstrations were held of the signal generator integrated with Virginia Diodes frequency extender modules to create a sub-THz solution. In addition, demonstrations on broadband measurements to 220 GHz using the VectorStar™ ME7838G Broadband VNA system featuring mmWave modules from Anritsu and VDI were conducted. The ShockLine™ ME7869A VNA, a fully reversing 2-port VNA solution with guaranteed performance to 43.5 GHz, was shown, as well. The ShockLine™ ME7869A can conduct long-distance full vector S-parameter measurements over wide distances of up to 100 meters. Three models – operating up to 8, 20, and 43.5 GHz, respectively – provide unprecedented cost-efficiency, flexibility, and ease-of-use to a variety of existing and emerging commercial and military antenna design applications. The ME7869A is configured with two MS46131A 1-port VNAs that can each be directly connected to the antenna under test (AUT). Cable length for each VNA module can be equal or different lengths, depending on the application. It eliminates the need for long RF coaxial cables that create high loss, and phase and magnitude instability. The unique design addresses the need to accurately and repeatably measure antennas over long distances, such as in anechoic chambers and antenna test ranges. The Spectrum Master™ MS276xA family of ultraportable USB spectrum analyzers and the Field Master Pro™ MS2090A were also displayed in the booth. Anritsu will also addressed emerging test challenges associated with high speed designs through a series of technical sessions.
Benchmark Lark Technology
In booth 1351, the Lark Technology business unit of Benchmark Electronics showed some of their latest products. This group makes custom RF filters, diplexers and multiplexers from 1 MHz to 40 GHz. They also combine these products, along with other functions into multi-function and integrated millimeter and microwave assemblies. Lark works on customized designs, so they were showcasing some of their products, along with discussing their capabilities.
Among the CML Micro products on show at IMS was the recently-introduced CMX90B701 and CMX90B702 low current low-noise gain blocks for the 17 to 23 GHz and 23 to 29.5 GHz bands, respectively. Both devices have an ultra-low current consumption of 10 mA with a typical P1dB output figure of +7.5 dBm, an IP3 output of +17.5 dBm and a noise figure of 4 dB. The devices are housed in a low-cost 3 x 3 mm QFN package, and are fully matched to 50 Ω.
Connectronics Inc., designer and manufacturer of standard and custom RF connectors, adapters and microwave connectors, showcased its RF connectors and adapters designed for quantum computing at booth 515. Connectronics can modify its extensive product line of 6,000 RF connectors to feature nonmagnetic and cryogenic attributes critical to quantum computing applications. These high frequency, coaxial RF connectors are U.S.-manufactured with base material and plating finish combinations that minimize magnetic signature. Connectronics delivers connectivity solutions, ensuring minimal interference with quantum computing’s applied magnetic fields. A complete range of RF connectors can be produced in large and small quantities, including unique and hard-to-find connectors.
Copper Mountain Technologies
In booth 2335 at the conference, Corning's experts showcased their latest innovations. The G3PO™ Interconnect Series is a high frequency (65 GHz and 100 GHz) connectivity solution for telecommunications, radar systems, shipboard, airborne, ground-based, missile programs, cryogenic and non-magnetic applications. The G3PO™ interconnect series offers a blind mate interconnect that has a center-to-center spacing of 0.085 in and weighs just .016g. This series is designed to accommodate both radial and axial misalignment with negligible voltage standing wave radio (VSWR) change to perform in high-stress environments. Within this series, Corning offers adapters available to SMA, 1.85 mm and 2.4 mm.
The G4PO™ Interconnect Series is their latest innovation, this ultra-high-density connectivity solution enables high frequency (60 GHz) connections even in constrained environments that lack open access. With center-to-center spacing of 0.070 in, board-to-board spacing of 0.090 in., and a weight of .005 g, th is series is 50 percent smaIler than G PPO® and 18 percent smaIler than G3PO™. Within this series, Corning also offers adapters available to SMA, 1.85 mm and 2.92 mm.
In booth 1154, dB Control exhibited microwave power modules (MPMs), RF switches and more. The MPMs are based on a modular design for easy customization and are available with continuous wave or pulsed power. Each MPM is a complete microwave amplifier that uses traveling wave tubes and solid state technologies, along with high-voltage and low-voltage power supplies, to provide the best of both worlds for military and commercial applications. Models displayed include dB-3201, dB-3201H, dB-4150, dB-3202, dB-3205, dB-3758, dB-3774B, dB-4127 and dB-4128 MPMs.
Also on display was a large selection of high-power MIL-standard switches for military, commercial, telecommunications and specialty applications from Charter Engineering. Models displayed include the SPDT – B40 Series, SP6T – H60 Series, SP6T Externally Terminated – C6 Series, SP8T Minature – J8 Series and SP12T – S12 Series.
Doosan Corporation Electro-Materials
Doosan Corporation showcased products and technologies aimed at bringing a “Delightful Life” to customers in the era of 5G and beyond. The company highlighted 5G mmWave antenna modules, a MEMS timing solution and copper clad laminates (CCL) for ‘high speed and high frequency’ applications.
Empower RF Systems
Empower RF Systems, based in Inglewood, CA designs power amplifier solutions for EW radar, SatCom, threat simulation, communications and product testing applications. The company's air and liquid-cooled amplifier products range from tens of watts to hundreds of kilowatts in PA modules to scalable rack systems. These amplifiers use a patented architecture and technologies ranging from GaN and GaAs to silicon-based LDMOS and MOSFET technologies to produce sophisticated and flexible COTS amplifiers to 6 GHz. The company had examples of all its products on display with the recently released model 2245 figuring prominently. This liquid-cooled amplifier delivers a minimum of 4100 W CW from 2 to 4 GHz with 5 kW mid-band performance.
Eravant, MilliBox, Maury Microwave and Copper Mountain Technologies (CMT) joined forces to showcase a complete and affordable system for D-Band over-the-air (OTA) 3D antenna pattern measurement. Each company contributed some of its leading products to the demonstration. The presentation featured a benchtop mmWave anechoic chamber with a 3D antenna positioner from MilliBox and a CMT 2-port 20 GHz VNA. Eravant’s compact transmitter and receiver modules extend the frequency of the VNA to 110 to 170 GHz with low profile flexible cable assemblies from Maury Microwave. This demonstration displayed a live 3D radiation pattern capture of Eravant’s WR-06 20 dBi horn antenna. In addition, Eravant was featuring their waveguide noise source LN2 calibration services up to 220 GHz. They are calibrated in-house using a cold reference termination. A room-temperature or "hot" reference termination is also used. The effective noise temperatures of these terminations are controlled within a fraction of a degree so very accurate. Typical ENR flatness is +/- 2 dB over the entire operating bandwidth.
At booth 1251, ERZIA displayed their low noise amplifiers and power amplifiers, integrated assemblies, substrate filters and ERZIA’s new lineup of equalizers, mixers and switches.
Filtronic launched two new product ranges — Taurus and Hades X2. Hades X2 is a next-generation active diplexer with increased performance with a typical PSAT of 30 dBm and dual high-power amplifiers. It also boasts 2 x GaAs MMICs that are performance-matched and power combined in waveguide to deliver maximum power and linearity. Taurus is a high-power E-Band amplifier with market leading linear mmWave power and unparalleled performance for long range E-Band communications, with a typical PSAT of 38 dBm.
Finwave Semi did not exhibit, but they were holding meetings in a hotel near the convention center. The company began in 2012 at MIT, when the co-founders invented a type of GaN transistor based on a FinFET architecture. They felt that this 3D fin structure was exactly what GaN transistors needed to significantly improve efficiency and linearity. The company has spent the last decade improving device performance, scaling the wafer size to today’s 8” wafers with Si-compatible process and establishing a global network of partnerships. In addition to the co-founders, Finwave brought SOI veteran Jim Cable onboard and just announced that Dr. Pierre-Yves Lesaicherre onboard as CEO. While they weren't displaying products yet, the company has an impressive presentation detailing the performance improvements that their FinFET architecture enable and they have GaN-on-silicon PAs for handset applications squarely in the sights for their product and process development activities.
Fine-Line Circuits exhibited in booth 1713, providing the ideal surface finish for RF microwave PCBs – electrolytic thick gold direct on copper which gives a great skin and no nickel related signal losses giving the designer the precise RF performance that the system is designed for. Fine-Line has built a variety of PCB boards (hybrids, cavities, copper back, oversized PCBs) for a variety of space and defense applications and a variety of systems (satcom, radar, antennas, dividers, amplifier, etc.)
Garlock was highlighting products from their WavePro division in booth 1701 at IMS. In particular, they were showcasing the recently released WavePro® 150 (WP150), a ceramic-filled PTFE dielectric material with a dielectric constant (relative permittivity) of 15.0 and a loss tangent of 0.003 at 6 GHz. WP150 extends the range of PTFE dielectrics to higher dielectric constant values than were previously unavailable, unlocking applications where stability and higher dielectric constants are advantageous. It is available in standard flat panels up to 10 mm thick, as well as made-to-order 3D shapes and conformal surfaces. PTFE is a versatile and durable dielectric that is used in antennas, cables, radomes, RF circuit boards and many other microwave and mmWave applications due to its low loss and high performance and the company had many shapes and sizes of the material on display.
Guerrilla RF, Inc
Guerrilla RF launched their latest linear power amplifiers at IMS. The GRF5526, GRF5526W, GRF5536 and GRF5536W, the latest in a series of ¼ W linear power amplifiers. These InGaP HBT amplifiers were designed specifically for 5G wireless infrastructure applications over large 100 MHz bandwidths and temperature extremes of -40°C to 105°C. Spanning frequency ranges of 2.3 to 2.7 GHz and 3.3 to 4.2 GHz respectively, the GRF5526/GRF5526W and GRF5536/ GRF5536W are tuned to operate within the n7, n30, n38, n40, n41, n48, n53, n77, n88 and n90 5G NR bands. The GRF5607 and GRF5608, the first in a new class of InGaP HBT ½ W linear power amplifiers being developed by the company, were designed specifically for 5G wireless infrastructure applications over temperature extremes of -40°C to 85°C. Spanning frequency ranges of 703 to 748 MHz and 746 to 830 MHz, respectively, the GRF5607 and GRF5608 are tuned to operate within the n12, n14, n18, n20 and n28 5G NR bands.
iCana returnd to IMS with a demo of AMD's ZCU670 platform and iCana's 4T4R FR1 reference board, highlighting impressive performance, power efficiency, and pin-to-pin compatibility. Attendees who visited booth 2350 explored iCana’s latest solutions in action and their FR1 and FR2 product line-up.
IHP is a non-university research establishment institutionally funded by the German federal and state governments and a member of the Leibniz Association. IHP is a research institution for silicon/germanium electronics. They have expertise in semiconductor technology, materials research, high-frequency circuit design and system solutions. The institute has a SiGe:C BiCMOS pilot line that manufactures RF and silicon photonics modules. IHP provides a Multi Project Wafer Service with 0.13 and 0.25 μm SiGe BiCMOS technologies on 8” silicon wafers. Integrated SiGe heterobipolar transistors with 500 GHz fmax are qualified for research and product design, devices with up to 700 GHz fmax are under development. A Cadence-based mixed-signal design kit is available. For high frequency designs an analog Design Kit using Keysight ADS can be used.
IMS Connector Systems
IMS Connector Systems introduced their SmartMod, a standard M12-based connector is the perfect service tool for troubleshooting and machine maintenance when in combination with a smartphone or tablet. The SmartMod enables continuous measurement of functions such as temperature, humidity, air pressure, voltage, current and power. In combination with a smartphone or tablet, it is the perfect service tool for troubleshooting and machine maintenance. It can also be networked with existing control systems. The SmartMod is based on the industry standard connector and is installed exactly where it is needed. Thanks to wireless connection to a smartphone or tablet with a range of 40 m indoors and 100 m outdoors, the connectors can also be used at measuring points that are far away from each other.
IMST is a development center for customer-specific radio technology and microelectronic systems. More than 130 highly qualified engineers develop integrated circuits, hybrid modules and systems, radio modules, antennas, micro-controller circuits, embedded systems and 3D-EM simulation software in Kamp-Lintfort. They guide customers from the first product idea all the way to the finished system.
Indium Corporation featured its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications. Indium Corporation’s AuLTRA™ 75 is an off-eutectic AuSn preform solution (75Au25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA™ 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition, and improving wetting and voiding. The AuLTRA™ product line also comes in 78Au22Sn and 79Au21Sn compositions.
Isola Group's booth offered sampling of its extensive lines of laminates and prepreg materials for RF, microwave, mmWave and photonics circuits. The circuit materials on display include the Astra® MT77, available in laminate and prepreg forms, I-Tera® MT40 laminate and prepreg materials and Tachyon® 100G laminates and prepregs. Isola Group also showed its halogen-free materials at the 2023 IEEE IMS exhibition, with example circuits on its TerraGreen® laminates and TerraGreen® 400G laminates and prepregs.
Junkosha chose IMS2023 to launch their two new (26.5 GHz and 50 GHz) metrology grade microwave/mmWave vector network analyzer (VNA) test cable assemblies for applications including calibration tests.Utilising Junkosha’s precision engineered-EPTFE tape wrapping technology, the new 26.5 GHz and 50 GHz cables exhibit excellent phase (within +/- 4.5 degrees at 50 GHz) and amplitude (within +/- 0.08 dB at 50 GHz) stability in flexure alongside strong phase stability in temperature.
Keysight Technologies, Inc.
Keysight demonstrated its comprehensive portfolio of wireless design, emulation, and test solutions, including the ENA-X, at IMS2023 in booth 835. The new Keysight ENA-X is a midrange VNA that produces fast, accurate EVM measurements and accelerates the characterization of 5G component designs by up to 50 percent.
Keysight's collaboration with Nokia Bell Labs presented their most recent achievement at Keysight's booth. Built on the Keysight PNA-X Vector Component Analyzer solution, the demonstration characterized a Nokia power amplifier (PA) developed for use in 6G D-Band wireless communications systems and designed to operate with a low error vector magnitude (EVM). Using the Keysight N5290A PNA Millimeter Wave System, Nokia Bell Labs can accurately detect the PA's low EVM, which is a measure of the signal distortion introduced into the communications system by the component. With these measurements, Nokia Bell Labs can better understand the PA's performance to optimize its 6G transmission system design. Keysight and Nokia Bell Labs also partnered to showcase an E-Band test solution at IMS2023. The demonstration featured the Keysight N9042B UXA Signal Analyzer used in combination with the V3050A Signal Analyzer Frequency Extender to measure a Nokia transceiver RFIC designed for use in an E-Band system for backhaul applications.
Keysight Technologies also introduced PathWave Advanced Design System (ADS) 2024, an electronic design automation (EDA) software suite giving chip designers new millimeter wave (mmWave) and subterahertz (sub-THz) frequency capabilities that accelerate 5G mmWave product design and anticipate requirements for 6G wireless communications development. The latest version of Keysight’s industry-leading radio frequency and microwave (RF/uW) design software suite addresses these development pain points with algorithm, layout, electro-thermal, and workflow automation enhancements.
Knowles Precision Devices
Knowles Precision Devices focuses on a wide variety of capacitors and components in the microwave to millimeter wave frequency ranges for use in military, medical, electric vehicle and 5G market applications. The company offers a wide range of custom-designed and build-to-print solutions to meet aerospace and defense requirements. The company was showcasing 5G catalog filters at 26 GHz, 28 GHz, and 39 GHz, with each device providing 3 GHz of bandwidth, more than 50 dB rejection, with operating temperatures from -55°C to +125°C. In particular, the company was showcasing a line of C, X, Ku and Ka-Band filters and other passive products for SatCom applications.
MACOM had a large booth presence at IMS. They were showcasing the latest products in their broad portfolio of active and passive RF/microwave, Optical and Broadcast solutions. MACOM's recent acquisition of OMMIC closed a few weeks before IMS, so they were talking about their plans to make OMMIC's facility in France the foundation for their newly established European Semiconductor Center. The center will enable MACOM to offer its customers higher frequency Gallium GaAs and GaN MMICs. MACOM was also showing products and capabilities from recently acquired Linearizer Communications Group. Linearizer specializes in non-linear microwave predistortion for use in terrestrial, avionic and space-based applications and high-performance microwave photonic solutions for use in the industrial and defense markets.
Marvin Test Solutions
Marvin Test Solutions featured their 5G mmWave production test system, the TS-900e-5G, which delivers unrivaled semiconductor production test performance for mmWave devices. The flexible, open-architecture design supports up to 20 independent VNA channels with gap-free performance to 53 GHz for impactful solutions in the production test lab and OSAT alike.
MathWorks participated in four demonstrations, four industry workshops, a technical session and an industry showcase at IMS. Demonstrations held in booth 2541 included PA modeling and DPD with NI instrument, targeting satcom applications with RFSOC and testing over the air with Otava DTRX2, measuring RF filters with Keysight VNA, creating MATLAB behavioral models and tuning filter performance and developing and testing algorithms with radar book.
MCV Microwave had their line of passive RF components on display at booth 1804. MCV provides leading edge technology to military, commercial and wireless providers. The company makes materials, devices and modules using their unique ceramic materials. One example is antenna/LNA modules which can be custom designed precision modules or standard band pass and notch filter operating at GPS, GLONASS, BDS, GALILEO QZSS and NAVIC/IRNSS frequencies. They also provide a variety of products like spiral antennas, low ESR/high Q capacitors, isolators, duplexers and filters for 5G and SATCOM to name a few.
Microwave Development Labs (MDL) was celebrating its 75th year in business at IMS. Established in 1948 in Needham Heights, MA, MDL is a leading supplier of components and assemblies for RF, microwave, and millimeter-wave applications requiring low-loss transmission of electromagnetic (EM) energy. MDL has built an experienced, expert staff of design engineers capable of working closely with each customer’s specific electrical and mechanical specifications to meet the most demanding custom requirements. The company’s rich history includes pioneering the Riblet coupler in 1948 for use at microwave frequencies, before that portion of the frequency spectrum was widely used for transmission of electromagnetic waves. From that innovative first year, the company has never stopped enhancing microwave coupling solutions, leading to such achievements as the thin wall monopulse comparator for the Lunar Excursion Module in the 1960’s and waveguide feed and monopulse networks for F-14 and F-15 fighter aircraft in the 1970’s. Internally milled waveguide technology from MDL developed during the 1980’s helped reduce the size and weight of high-performance waveguide components for radar systems in F-18 fighter and B-1 bomber aircraft, long before new product development for military and aerospace customers required adherence to reduced size, weight, power, and cost (SWaP-C) trends.
MegaPhase had a variety of space rated assemblies on display, including AlumiBend™, HyperFlex™, Phase3™, UltraPhase™, GrooveTube® and Semi-Rigid cables. MegaPhase Phase3™ cable assemblies were recently utilized in the LunIR lunar flyby mission, jointly funded and developed by Lockheed Martin and Terran Orbital, following the company’s AS9100 certification last year. Also on display was the company’s line of ruggedized test and measurement products, including the Survivor™, Warrior®, KillerBee® and RF Orange® cable assemblies.
Menlo Micro announced in May product specifications update for the MM5140 DC-to-8 GHz SP4T switch. This product is positioned to address the globally evolving wireless standards in 5G sub-6 GHz RF network applications and emerging broadband wireless applications up to 8 GHz, which includes the ever-growing O-RAN frequency bands. Built on Menlo Micro’s market-proven Ideal Switch technology, the MM5140 continues to offer +90dBm IP3 linearity, 25W CW RF power handling, ultra-low insertion loss, integrated charge pump with SPI (Serial Peripheral Interface) and GPIO (General Purpose Input Output) interface control, and 3 billion cycles reliability, all in a 5.2 mm x 4.2 mm LGA package.
Mercury Systems, Inc.
Mercury, had their COTS open-architecture board at their booth. It delivers the latest commercial signal processing technology for aerospace and defense applications, driving higher performance from a smaller form factor. The DRF3182 Direct RF Processing Module is the first standard product purpose-built for the aerospace and defense industry that leverages Intel’s new Stratix® 10 AX SoC field programmable gate array (FPGA), which adds a key capability to the Mercury Processing Platform by enabling the direct digitization and processing of broadband RF signals.
Mician was showcasing µWave Wizard. Initially geared toward the space sector and satellite payloads, Mician’s µWave Wizard software offers a combination of advanced hybrid solver and 3D modeler technology in order to speed up the process of accurately analyzing, synthesizing and optimizing RF components. In addition to filters, multiplexers, couplers, and horn antennas, applications also include complex waveguide assemblies such as feed networks. Launched over 20 years ago, and continuously improved, µWave Wizard's hybrid solver technology provides users with the benefits of "several engines under one roof." For large assemblies and complex RF circuits, the solver breaks the problem down into a series of smaller circuits that are simulated and optimized separately. They can subsequently be recombined, analyzed and optimized for final performance. Mician says that the development speed of µWave Wizard is complemented by its accuracy and RF components designed using µWave Wizard can be found in just about every commercial and government satellite launched in the past decade. Mician’s industry-leading software solutions are also utilized for RF circuits on UAVs, VSAT terminal assemblies, TV broadcast, radar systems, automotive, 5G backhaul and for research.
In booth 2435. was showcasing its broad portfolio of smart, connected and secure embedded control solutions. With this portfolio, the company targets applications across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. In particular, Microchip was showcasing their 5071B cesium atomic clock. The unit is available in a three-unit height (3U) 19-inch rackmount enclosure. It has upgraded electronic components to address possible obsolescence or non-RoHS circuitry. The product provides 100 ns holdover for more than two months, maintaining system synchronization when GNSS signals like GPS are denied. As a cesium beam tube product with no deterministic long-term frequency drift, the 5071B provides absolute frequency accuracy of 5E-13 or 500 quadrillionths over all specified environmental conditions for the life of the product. Microchip is targeting telecommunications, data center, metrology, aviation and defense applications with this long-term, precise timing and frequency solution.
With all its acquisitions over the years, the company also was showing an impressive selection of GaAs, GaN and silicon transistors and diodes, in addition to RF MMIC amplifiers, prescalers and control products. Microchip also integrates these semiconductors and functions into higher level amplifiers, modules and assemblies.
Millibox makes mmWave antenna test systems. These systems consist of a mmWave anechoic chamber and a 3D antenna positioner. The anechoic chamber and antenna positioner allows users to quickly and efficiently test the antenna radiation pattern and other key OTA metrics. The company makes five different types of antenna positioners with their GIM04 and GIM05 units in the booth. Millibox makes four different types of anechoic chambers, ranging in size from 4 to 8 feet. The company had one of their two-foot anechoic chamber building blocks, along with their four foot MBX02 on display with antennas on their positioners.
At their first IMS, mmTron exhibited in both 343. mmTron staff discussed how the company’s designers are developing disruptive MMICs that extend output power, linearity, and efficiency — simultaneously — to extend the reach and data capacity of mmWave communications systems. mmTron’s approach to this power, linearity, and efficiency challenge was explained by Seyed Tabatabaei, mmTron’s founder, president, and CEO, in his MicroApps presentation “mmWave PAs: Why Sacrifice High Power for Linearity?” mmTron was highlighting a unique IC module that converts the differential output of a high-speed digital-toanalog converter (DAC) to a clean, low noise, single-ended RF signal. The TMC160 integrates anti-alias filters, quasi-differential low noise amplifiers, and a balun with bias T in a 7 x 7 mm surface-mount package. The TMC160 was demonstrated with a Texas Instruments highspeed DAC. As part of its focus on mmWave, mmTron has designed a family of broadband distributed amplifier MMICs with upper frequencies from 20 to 160 GHz, for applications like instrumentation and EW. To support 6G research programs, the company offers the TMC774, with a frequency response from DC to 160 GHz.
Molex has extended its cable-assembly product line with the addition of innovative solutions from I-PEX. Together, the organizations offer I-PEX MHF® 4L LK and MHF® I LK cable assemblies, which are available in multiple configurations using standard MHF receptacles and Molex RF connector interfaces. The MHF I Series of micro-RF coaxial connector systems takes advantage of I-PEX’s patented locking mechanism to add another layer of connection reliability and security. Designed to keep signals connected through constant shock and vibration, this cutting-edge solution clicks into place seamlessly. Inspired by operation with drones, the patented locking system is ideally suited to address the most rigorous connectivity demands.
MtronPTI showcased a Ku-Band Integrated Microwave Assembly (IMA) to support broadband communication datalinks used in applications like manned and unmanned aircraft, on the move and fixed ground stations, shipboard beyond line-of-sight wideband satellite communications and all unmanned vehicles. This integrated Ku-Band microwave assembly incorporates low insertion loss, high power handling, high isolation between bands, Ku-Band diplexer filters that are interconnected with two wave guide RF switches, a coupler and a lowpass filter for harmonic suppression. RF cables are fed from the diplexers to a separate RF module consisting of an RF board with low noise amplifiers and an RF switch that switches the receive signal between the two paths. The module contains peripheral control and status circuitry for user access
Nullspace spun out as an independent company from IERUS Technologies, an established defense contractor in 2023. They have the goal of becoming a recognized leader in advanced engineering software. The company has developed a set of proprietary solutions built on a specific method of moments (MoM) formulation. They offer Nullspace Prep, a comprehensive CAD and meshing pre-processor that integrates with Nullspace EM, a fast, accurate 3D Electromagnetic simulation tool and Nullspace ES, which they claim is the world’s only commercial electrostatic solver for extremely large-scale, rapid, and accurate design and analysis for quantum computing. The Nullspace solutions use proprietary fast linear algebra algorithms and hybrid multi-CPU and multi-GPU acceleration techniques and differentiate with their ability to solve large, complex problems quickly and accurately.They claim to be able to solve these problems over 25x faster than available solutions.
Nxbeam expanded its mmWave MMIC portfolio with the introduction of a GaN E-band power amplifier MMIC. The NPA7000-DE operates from 65 to 76 GHz and provides an average saturated output power of 1 W, average power added efficiency of 28%, and average linear gain of 13 dB. The chip dimensions are 1.575 x 0.875 x 0.050 mm. The output power level of this MMIC makes it ideal for point-to-point E-band communication links. The small size of this MMIC simplifies power combining schemes and can greatly increase the range of E-band point-to-point links. The design consists of two amplifier stages which are independently controlled, allowing the bias and performance to be tailored to the end-user’s specifications. The RF input and RF output are matched to 50 Ω with DC blocking capacitors for easy system integration. Bond pads and backside metallization are Au-based for compatibility with eutectic die attachment methods.
Otava had three demonstrations at IMS. In their booth, 2514, their digitally tunable 24 to 40 GHz bandpass filter. At MathWorks' booth 2541 the Wideband mmWave Radio Development Kit for AMD RFSoC Gen 3 was demonstrated. Otava’s 64-element 24 to 30 GHz active phased array antenna module could be seen at Samtec's booth, 2627.
Pasquali Microwave Systems
Pasquali Microwave Systems offers full-in-house engineering, manufacturing, surface treatments and QA/testing of µ-Wave and mmWave assemblies (1 to 200 GHz, passive and active) for defense, space, naval and civil/TLC sectors, such as: µ-Wave and mmWave waveguide assemblies and antennas systems: 1 to 150 GHz or higher frequencies; Blackbody RF absorbers for calibration targets and polarizers: 10 to 200 GHz, 4°K to 330°K; and electronics subassemblies and components: on-waveguide integrated parts, microstrip/PCBs (1 to 50 GHz).
PRFI, the UK custom MMIC design specialists, has announced a significant milestone: its 150th custom MMIC design, a low-current mmWave gain block, has moved to production. The company has a reputation for high quality, successful design work, with an impressive list of clients that includes Samsung, Sony, Analog Devices, BAE Systems and Qorvo. The milestone MMIC provides a small-signal gain of 17dB across an operating range of 23 to 29.5GHz from a very low current consumption of just 10mA. It is housed in a low-cost 3mm x 3mm QFN package and is fully matched to 50Ω, making its use very straightforward. The part was designed for CML Microcircuits’ SµRF product range, and is commercially available as the CMX90B702. A companion part has also been designed by PRFI, which has similar gain with the same very low 10mA current consumption and covers 17 to 23GHz.
At IMS, pSemi announced its newest SP4T switches up to 8 GHz and two multi-chip modules featuring dual-channel switches. The new PE42445 and PE42446 switches integrate seamlessly into 4G and 5G base stations and mMIMO architecture, providing digital pre-distortion (DPD) feedback loops and transmitter monitoring signal paths to prevent interference and maintain signal integrity, given massive MIMO applications. Thanks to their high reliability and extended operating temperature range, the new high isolation SP4T switches can be used for a wide variety of applications, including DPD and VSWR monitoring, portable wireless radios, repeaters and E911 systems and test and ATE equipment. Offered in a compact 6×6 mm LGA package, the PE53230 and PE53231 products feature high gain of more than 36 dB and fast switching time of less than 600 nanoseconds. With low power consumption of less than 500 mW/channel, these integrated solutions lead the industry with the highest average input power handling at 20 W. They also announced two multi-chip modules featuring dual-channel switches, the PE53230 for 3.3–3.8 GHz and the PE53231 for 3.5–4.0 GHz. Each module contains two switches and two LNAs for high and low band frequencies. The new module portfolio delivers the lowest noise figure in the industry, at less than 1 dB, enabling best-in-class receiver sensitivity and performance while handling 20W average input power enabling removal of external circuitry.
Q-Tech bills itself as the world's leading manufacturer of high-reliability crystal oscillators. They supply these devices into high-performance applications in high reliability/space, military, avionics and high-temperature markets. They did not have any products released specifically for IMS, but they were showcasing representative examples of their product portfolio.
Attendees who visited Quantic's booth at IMS saw demonstrations of their frequency control components and assemblies under vibration were on display. Quantic Wenzel showed off their world class low phase noise oscillators. They excel in low phase noise oscillator under extreme conditions also. For power products, their patented ceramic capacitors for next-generation RF/ microwave applications, power-dense hybrid tantalum capacitors ideal for pulsed power space applications and thin film resistor foils (OhmegaPly®, TCR® and TCR-EHF®) were exhibited. Quantic X-Microwave was showing off their expanding line of breadboarding products. They now offer modules that plug into larger packaging to make full integrated microwave assemblies and have an A&D customer that recently placed an order. Quantic PMI was featuring a high power amplifier operating from 8 to 12 GHz with high gain of 43 dB and saturated output power of 40 dBm (10 W). It has a noise figure of 3.5 dB and gain flatness of +/- 3.5 db max.
Reactel featured their application-specific filters, multiplexers and multifunction assemblies up to 67 GHz, along with the debut of its new Short Form Catalog for an overview of their extensive filter portfolio. An example product is Reactel model number 7R6-269-X17S11 which is a narrowband high power notch filter. The center of the notch is 269 MHz with a nominal 3 dB bandwidth of 16 MHz. Passband Insertion loss is less than 0.3 dB, notch depth is 85 dB while power handling capability is 100 W CW. This dynamo is housed in a package only 1.5″ x 1.15″ x 3.5″, and is suitable for extremely rugged conditions.
Response Microwave, Inc.
Response Microwave has it's new 3 dB 90-degree quadrature hybrids for use in various antenna and radio applications within the popular UHF band on display at IMS. The new RMHY3.225-400Sf covers the 225 to 400 MHz band offering typical electrical performance of 0.25 dB insertion loss, VSWR of 1.2:1 and isolation of 23 dB minimum. Average power handling is 100 W and the unit is operational over the -40°C to +85°C range. Mechanical package is a small 1.6 x 1.6 x 0.5 in., plus SMA female connectors per MIL-C-39012.
Rohde and Schwarz
Rohde & Schwarz took a new way to experience and demonstrate solutions for RF and microwave applications. Attendees were able to put their design knowledge to test with the Rohde & Schwarz “Are you a genius?” RF Design challenge. The challenge incorporated a series of lab challenges that evaluate attendee’s knowledge in s-parameters, EVM, high power, and baseband measurements. In addition to the RF Design Challenge, Rohde & Schwarz highlighted multiple demonstrations at the company’s booth. These include the new 67 GHz noise figure measurement capability that further enhances the R&S ZNA vector network analyzer to provide a powerful and versatile test system for full characterization of amplifiers and converters. Several highlights at the Rohde & Schwarz booth were the latest solutions for early sub-terahertz and 6G research applications. The R&S FExx external frontends extend the frequency ranges of Rohde & Schwarz signal and spectrum analyzers, and signal generators up to the D-Band (110 to 170 GHz). Additionally, both the R&S ZNA vector network analyzers and the R&S FSWP phase noise analyzer will be demonstrating 6G D-band system and component characterization. There was also the R&S ATS1800C CATR based 5G and 6G mmWave Over-The-Air (OTA) test chamber, which provides the ideal environment for testing antennas, modules and devices from R&D to conformance. When equipped with the two side chamber extensions, a unique 3D quiet zone is formed, with which the test solution supports on a very small footprint RRM measurements, including multiple angles of arrival (AoA).
Samtec was demonstrating their microwave/mm Wave connector and cable systems, including the Magnum RFTM series as well as edge launch and vertical connectors in one comprehensive demo. They used a Keysight 8-port 53 GHz USB VNA to transmit signals to the four mmWave RF systems. In the demo, we see a Samtec Magnum RF edge launch, mated in a perpendicular configuration with a vertical, solderless, compression mount GPPC series. They achieve good performance up to 40 GHz with VSWR better than 1.4 and loss better than 1 dB. The second demo is a Samtec Magnum RF cable assembly system that consists of a Magnum RF edge launch connector and a GC47 cable assembly. In addition to improved density, this ganged cable assembly provides a more secure connection to the mating connector with the housing. Cable performance was VSWR under 1.4, loss is better than 4 dB with the 6 in of cable. The demo also featured two solderless, compression mount 2.40 mm edge launch connectors on the same PCB, connected by a 2” trace. Samtec has a VSWR of better than 1.3 in this demo. And finally, in the same configuration, there were two solderless, compression mount 2.92 mm edge launch connectors, with 2” of trace with VSWR of better than 1.3. Samtec can support frequencies up to 90 GHz (E-band) with loss performance improved over coaxial cables.
Samtec’s next-generation micro waveguide technology offers the near-loss performance of a rigid waveguide while still providing the flexibility and size typically associated with a coaxial cable. Another demo showed both E-band and V-band flexible waveguides. Finally, Samtec did a joint demonstration presented with Otava, Rohde and Schwarz, Taoglas, and Avnet. Wideband 24-30 GHz 5G mmWave capabilities were being demonstrated by establishing an over-the-air communication link between two Otava Phased Array Antenna Modules (PAAMs). The modulated 5G FR2 signal is generated using a Rohde & Schwarz SMW200A vector signal generator which is sent to the transmitting PAAM. The receiving PAAM connects to a Rohde & Schwarz FSW43 Spectrum Analyzer where the signal is then demodulated and characterized. SMPM edge mount connectors are on the antenna in module (AIM) and SMPM surface mount connectors are on the combiner card. Inline bullet adaptors link the connectors on the AiMs and combiner card.
Spectrum Control introduced SCi Blocks™, a family of next-generation, digitally-enabled, plug-and-play RF solutions that address the size, cost, and open architecture requirements of emerging military/aerospace system designs. The open, modular, digitally-enabled products will be available in three distinct tiers – RF Systems-in-Packages (RFSiPs), RF “sticks,” and Sensor Open Systems Architecture (SOSA™)-aligned OpenVPX modules. Spectrum Control unveiled the first products in this new family. The ultra-miniature, high-performance, digitally tunable, wideband downconverters and upconverters are designed to deliver a new level of SWaP-C for electronic warfare (EW), signal intelligence (SIGINT), and Intelligence Surveillance and Reconnaissance (ISR) applications. The other introduction is an OpenVPX RF transceiver offering the full fidelity of RF signal handling with integral digital control and minimal interconnects to create a wide range of design and usage options. These new products deliver total spectrum awareness from 20 MHz to 18 GHz, for up to 16 GHz of contiguous spectral coverage with 2 GHz of instantaneous bandwidth. The integrated digital gateway offers a level of intelligence and connectivity unseen in traditional RF components, significantly reducing system engineering time. The digital gateway has a simple four-wire interface for command and control with health and temperature monitoring. The high-performance downconverter stick offers a gain of 25 dB and noise figure of 14-17 dB across the entire frequency range. Other specifications include third order intercept (IP3) of 25 dBm and single tone spurious of >/=60 dBc, as well as IF calibration features for optimum spectral performance.
SPINNER's passive RF product portfolio includes a wide range of products for test & measurement in R&D and production environments, rotating systems, broadcasting systems, anechoic chambers, 5G and 6G applications up to 150 GHz. Examples are compact and boxed calibration kits, verification kits, ruggedized test port adapters, planar/co-planar connectors, flexible dielectric waveguides, low-PIM switches and self-aligning quick connectors for automated production testing, adapters ranging from 75 Ohm to 50 Ohm and rotary joints. The company showcased new millimeter wave waveguide-to-coaxial adapters for the V-, E-, W- and F-bands (50 to 120 GHz). These products target applications in automotive and industrial radar sensors testing, satcom, 5G mmWave and 6G frequency bands. Different variants combining the waveguide interfaces WR10, WR12 and WR15 with coaxial connectors 1.0 mm and 1.35 mm are available.
The company also featured a 1.35 mm E connector with performance from DC to 90 GHz. This product family was designed to address issues with unwanted unlocking of the 1.00 mm coaxial thread in time-consuming calibrations. This 1.35 mm E Connector is optimized for frequently used bands, allows thru-male“ design with multiple cables and prevents unintended opening of thread and coupling torque.
Tecdia's exhibition at IMS2023 featured their crystal capacitor, boasting high Q, low capacitance values and SMT mounting compatibility that is ideal for high frequency RF applications. Its stable and efficient operation meets the growing demands of modern electronic devices. Also on display was the K4200 Dielectric, a compact yet powerful material can tolerate voltages of up to 200 V, reducing mounting area by an impressive 40 percent. With a permittivity of 4200 and X7R temperature characteristics, K4200 is a high DK material suitable for applications that require EIA class materials to be screened to MIL standards. Also, Tecdia announced the restricted release of its upcoming V Type Varactor, which has tested to have significantly higher Q and tuneability than the H-Series. The V Type Varactor is in its final stages of development.
West Bond had their new 73KF Series Die Bonder on display, an excellent tool for meeting the challenging die attach applications found in the RF, microwave, semiconductor, hybrid and medical device fields. The 73KF Convertible Manual Die Bonder has a capacitive touch screen Interface and is designed with a gantry style chassis enabling virtually unlimited part size capacity. Their exclusive 8:1 ratio, purely orthogonal X-Y-Z micromanipulator allows the operator of the machine to place die with precision and ease.
WIN Semiconductors Corp.
WIN Semiconductors Corp. showcased its compound semiconductor RF and mmWave solutions in booth 235, with the commercial release of a 50 V 0.25 µm-gate RF GaN platform, NP25-20 and targets high performance front-end applications including radio access networks, satellite communications, electronic warfare and radar systems.
WIN also released their next-generation integrated mmWave GaAs platform, PQG3-0C. Targeting mmWave front-ends, the PQG3-0C technology combines individually optimized E-mode low noise and D-mode power pHEMTs to enable best-in-class power amplifier and low noise amplifier performance on the same chip.
Wireless Telecom Group
Wireless Telecom Group's test and measurement brands; Boonton, Holzworth, and Noisecom showcased their instruments in booth 1619. Boonton demonstrated fast-switching, low phase noise RF signal generation enabling accurate component characterization and testing of radar and communications systems. The measurement and analysis demonstration was made with Boonton's true average RF power sensors operating at a rate of 100,000 measurements per second. Higher-order modulation schemes, like those used in advanced communication systems, utilize signals with high peak-to-average power ratios that can strain amplifier performance. A demonstration featured the rapid identification of amplifier compression using crest factor measurements and statistical analysis from Boonton peak power sensor
Holzworth demonstrated broadband, low phase noise signal generation and real-time phase noise analysis, supporting the quick evaluation of a local oscillator’s performance and symbol error contributions in 5G and Wi-Fi communications systems. Noisecom programmable noise generators can produce highly controllable additive white Gaussian noise (AWGN) used to analyze system behavior when operating in real-world noise conditions, with results analyzed by industry-leading peak power sensors from Boonton
Wireless Telecom Group also presented a technical session in the IMS MicroApps theater entitled, “I Know I Need to Measure RF Power – Now What?” The seminar provided practical insight for measuring RF and microwave power, including different sensor technologies and architectures, as well as important sensor considerations to enable modern radar and communications system.
Wolfspeed was exhibiting in booth 1735 and they were big contributors to the overall IMS show. Company representatives participated in a workshop on using modeling, simulation and characterization to improve power RF performance on Monday and presented a paper on modeling GaN-on-SiC device building blocks on Tuesday. In addition, a Wednesday session on power amplifier architectures was dedicated to the late John Palmour, co-founder of Wolfspeed. Wolfspeed demonstrated the CMPA5259100S, a 100 W 50 V GaN MMIC HPA targeting radar applications in the 5.0-5.9 GHz frequency range with 25 dB of large signal gain. They also showcased the CMPA851A050S, an 80W HPA that utilizes Wolfspeed's 0.15 micron GaN-on-SiC process. This device operates from 8.5 - 10.5 GHz and supports both defense and commercial radar applications. Wolfspeed also highlighted the CMPA601J025F, a 25 W GaN-on-SiC MMIC using Wolfspeed's 0.15 micron process. The amplifier operates from 6 to 18 GHz and supports a variety of end applications like electronic warfare, test instrumentation, radar and general amplification.
At IMS, Xpeedic unveiled RF Electronic Design Automation (EDA) Solution 2023 edition, showcasing its ability to accelerate the design of highly integrated RF modules and systems using its differentiating chip-package-system EDA tools and mass-production proven integrated passive devices (IPD) IP. The RF EDA Solution includes XDS, Xpeedic’s RF system-level design and simulation platform, IRIS, its on-chip passive modeling and simulation tool, and iModeler, a passive model generation tool.