IMS2023 Show Wrap-Up: Glad to be Back to Normal!

Sunny San Diego marked the first industry conference and exhibition that we have seen that was back to “normal.” With more than 9,200 registrants and 2,700 delegates, IEEE MTT-S IMS 2023 had an attendance and activity level that has not been seen since the pre-COVID days. The event took place June 11-16 with a technical program that had some 360 technical papers, presenting “the Coolest Ideas under the Sun” in the RF and microwave field, in addition to the industry exhibition with about 550 companies demonstrating their latest products and services. It was a great networking event with many re-connecting in person for the first time in a while.

IMS2023 introduced several innovations. The focus themes included:

• Wireless Communications, including 6G developments, Wi-Fi, RF and microwave system-on-chip integration, massive MIMO systems and subsystems and more
• Artificial Intelligence and Machine Learning (AI/ML) Technologies for Microwaves
• Model-Based Systems Engineering, including Digital Twins
• Space and Aerospace
• Wireless Power Transfer
• RF and Microwave Technology in Biomedical Applications.

Each theme had focused technical sessions, workshops, a keynote speaker, a panel session and a technical lecture. Additionally, there was a “Systems Pavilion” in the industry exhibition, showcasing wireless, with demos by the finalists in the ‘MTT-Sat Challenge.’ IMS2023 also featured the “Connected Futures Summit” co-sponsored by the IEEE Communications Society.

With a show as massive as IMS, it can be challenging to see everything the show has to offer. Whether you were unable to make the event, busy meeting with colleagues, participating in the technical program, or a culmination of all, you may not have had the time to walk through the exhibition as much as you'd like to. That's why Microwave Journal has put together this IMS2023 show wrap-up, in case you missed the best of IMS2023 exhibition. 

Video Gallery: https://videos.microwavejournal.com/channel/ieee-mtt-s-international-microwave-symposium-2023

Photo Gallery: https://www.microwavejournal.com/media/photos/122-ims2023

Frequency Matters Updates from the Exhibition Floor Each Day

June 13 Wrap Up

June 14 Wrap Up

June 15 Wrap Up

Aethertek 

Aethertek unveiled its latest frequency range 2 (FR2) 5G mmWave technology at IMS, including their antenna-in-module (AiM), transforming lower-frequency radio units into FR2 mmWave 5G-capable devices. The dual polarization AiM has a power output of 47 dBm EIRP with transmission quality of EVM under 5 percent. It mitigates the common challenge of signal loss in FR2 5G caused by obstacles like walls, materials and living organisms. Designed for indoor and semi-outdoor environments, such as train stations, the AiM serves as an solution for the telecommunications. Aethertek is actively working on reducing the module's size and minimizing power consumption.

Altum RF

Altum RF featured products included new components for satcom and radar markets. These K- and Ka-Band power amplifiers, and X-Band low noise/driver amplifiers, integrated front-end and switches reflect Altum RF’s concentration on developing products that offer the increased power, higher frequency, greater bandwidth and increased integration demanded by these markets. Product highlights included: 

• ARF1014: 27–31.5 GHz GaN 12 W power amplifier MMIC, 17 dB power gain 
• ARF1026Q4: 27–31.5 GHz linear amplifier, 26 dBm P1dB 
• ARF1502Q4: 8–12 GHz front end integrated circuit, 26 dB Tx power gain 
• ARF1020Q5:  9–11 GHz GaN power amplifier, 10 W output power. 

Akoustis

Akoustis Technologies announced that the launch of its cutting-edge foundry and engineering services to target market segments including mobile, Wi-Fi, defense, 5G infrastructure, and automotive. Akoustis’ world class foundry will provide customers with bulk acoustic wave (BAW) fabrication capabilities on 150-mm Si substrates. Strategically located just outside of Rochester, New York, the Company’s 125,000 square-foot, state-of-the-art facility enables the manufacture of high-performance BAW devices based on the MEMS-based XBAW^® process. Akoustis’ foundry will offer distinct XBAW^® technology, catering to different frequency ranges and providing customers with flexibility. The XBAW^® XB1 technology covers a frequency range from 1.6 to 7 GHz, while the next generation XBAW^® XP3F technology is expected to cover frequencies from 7 GHz to 20 GHz. As a part of its comprehensive solution, Akoustis provides automated Process Design Kits (PDKs) leveraging machine learning algorithms to customers, facilitating efficient and accurate design implementations. The PDKs will enable customers to construct intricate designs and optimize their end solutions, leveraging the full potential of Akoustis’ foundry and its advanced fabrication capabilities. Akoustis’ back-end services will be driven by GDSI, a US-based, trusted supplier of premium semiconductor back-end supply chain services, catering to customers’ advanced wafer processing needs with services including wafer dicing, wafer pick and place, and back grinding and polishing.

Analog Devices

At IMS2023, Analog Devices demonstrated how its RF solutions enable companies to develop disruptive technologies in instrumentation, communications, industrial and aerospace applications by accelerating innovation, enhancing reliability as well as reducing complexity and footprint in RFIC designs. One of the biggest announcements at IMS was the ADI Apollo MxFE. It is the most advanced software-defined, direct RF-sampling, wideband mixed signal front end platform in the market. Apollo MxFE enables next-generation applications such as phased array radar, electronic surveillance, test and measurement, and 6G communications in the Aerospace & Defense, Instrumentation, and Wireless Communications industries. This monolithic 16nm CMOS device utilizes state of the art high dynamic range RF ADC and RF DAC cores has excellent spurious free dynamic range and noise spectral density. The 4T4R product offers four 12-bit RF ADCs with a sample rate up to 20 GSPS, four 16-bit RF DACs with a sample rate up to 28 GSPS, an RF input bandwidth from DC to 18GHz and an instantaneous bandwidth up to 10 GHz. Apollo MxFE is the industry’s first integrated radio that is capable of directly interfacing to the emerging 6G frequency bands from 7 to 15 GHz. The on-chip DSP offers a real-time FFT Sniffer, a full-rate programmable FIR filter, a 128-tap complex FIR filter, fast-hopping NCOs, DDCs/DUCs, and a fractional sample rate converter. The DSP is dynamically configurable, allowing for rapid changes between narrowband and wideband profiles without taking down the JESD link. Apollo MxFE supports JESD 204B/C and a very short reach interface. Apollo MxFE’s 8T8R product offers eight RF ADCs with a sample rate up to 8 GSPS, eight RF DACs with a sample rate up to 16 GSPS, an RF input bandwidth up to 16 GHz, and an instantaneous bandwidth up to 3 GHz. The on-chip DSP offers similar features and functionality to the 4T4R device with double the number of digital blocks, all dynamically configurable.

Also on display was the ADAR3002,  a dual beam, four-element dual polarization receive beamforming IC operating from 17.7 to 21.2 GHz and the ADAR3003, a single beam, four element dual polarization transmit beamforming IC operating from 27.7 to 31.5 GHz. Their low power and high level of digital integration make them ideal for applications such as airborne terminals, man-pack radios and satcom-on-the-move.

Anoison Innovation

Anoison Innovation addressed a twenty-first century need. In order to address size and weight issues with traditional D38999 connectors, Anoison developed SMPS Size-16 coax for Amphenol 2M805 (Micro38999) connectors, available in two major cable diameters, 0.086 and 0.047. Micro38999 is 50 percent smaller and 60 percent more contact density than traditional D38999 resulting in up to 70 percent weight savings and 50 percent size savings compared to traditional D38999.

Anokiwave

Anokiwave featured their portfolio of mmWave silicon ICs, that are shipping in volume and commercially deployed in working antennas, that enable active antennas across multiple markets, specifically 5G, satcom and aerospace and defense. Anokiwave's satcom Ku- and Ka-Band ICs are used in multiple terminal designs operating live satellite links globally, and their performance, cost-effectiveness and availability in volume enables customers to design, build and deploy satcom systems with confidence in their choice of ICs for commercial success. At the Connected Future Summit, Ryan Jennings, Anokiwave vice president of satcom and systems, discussed ways in which satcom will play a key part in extending terrestrial 5G networks to air, sea and other remote areas not covered by small cell networks and how active antennas are uniquely suited for this growth area.

Anokiwave and Starry Group collaborated to develop Starry’s next-generation customer premises receivers (CPE) to deliver affordable, high-capacity home broadband access across the 24 and 3 GHz spectrum bands. As part of this collaboration, Anokiwave designed a complete Phased Array Antenna Module (PAAM) using its industry leading Gen-4 silicon ICs, to accelerate Starry’s time-to-market for Outdoor CPE units, that met or exceeded all cost and technical specifications and is now ready for production. Starry’s gigabit-capable licensed fixed wireless technology dramatically reduces the cost of providing a home with a gigabit quality signal and low-cost WiFi modem, instead of the traditional 5G modems. This reduces the average total cost of a Fixed Wireless Access point to nearly 1/100th the cost of building fiber to the home. Starry’s technology also enables significant reductions in network build time as compared to wireline networks. Anokiwave’s PAAM helped Starry to meet their aggressive cost, schedule, and performance requirements. The Anokiwave developed 24 and 37 GHz PAAMs allowed Starry to reach production ready design and complete radio in less than 12 months from the start of the project.

Anritsu Company

Anritsu showcased the new 70 GHz Rubidium™ MG36271A RF/Microwave Signal Generator. Live demonstrations were held of the signal generator integrated with Virginia Diodes frequency extender modules to create a sub-THz solution. In addition, demonstrations on broadband measurements to 220 GHz using the VectorStar™ ME7838G Broadband VNA system featuring mmWave modules from Anritsu and VDI were conducted. The ShockLine™ ME7869A VNA, a fully reversing 2-port VNA solution with guaranteed performance to 43.5 GHz, was shown, as well. The ShockLine™ ME7869A can conduct long-distance full vector S-parameter measurements over wide distances of up to 100 meters. Three models – operating up to 8, 20, and 43.5 GHz, respectively – provide unprecedented cost-efficiency, flexibility, and ease-of-use to a variety of existing and emerging commercial and military antenna design applications. The ME7869A is configured with two MS46131A 1-port VNAs that can each be directly connected to the antenna under test (AUT). Cable length for each VNA module can be equal or different lengths, depending on the application. It eliminates the need for long RF coaxial cables that create high loss, and phase and magnitude instability. The unique design addresses the need to accurately and repeatably measure antennas over long distances, such as in anechoic chambers and antenna test ranges. The Spectrum Master™ MS276xA family of ultraportable USB spectrum analyzers and the  Field Master Pro™ MS2090A were also displayed in the booth. Anritsu will also addressed emerging test challenges associated with high speed designs through a series of technical sessions.

Benchmark Lark Technology

In booth 1351, the Lark Technology business unit of Benchmark Electronics showed some of their latest products. This group makes custom RF filters, diplexers and multiplexers from 1 MHz to 40 GHz. They also combine these products, along with other functions into multi-function and integrated millimeter and microwave assemblies. Lark works on customized designs, so they were showcasing some of their products, along with discussing their capabilities.

Cadence

Cadence Design Systems recently announced the new Cadence® Virtuoso® Studio, a next-generation custom design platform that delivers an optimal design experience and ushers in the future for custom analog design. Virtuoso Studio features a reimagined infrastructure with a unique approach to managing design processes and allows more than a 3X improvement in design throughput for today’s largest designs, enabling customers to meet aggressive time-to-market goals. Virtuoso Studio addresses the challenges customers face with larger, more complex designs, empowering them to analyze and verify designs to ensure that design intent is maintained throughout the design cycle. This new platform features seamless integration with other Cadence solutions, including the Cadence Spectre® Simulation Platform, Cadence Allegro® PCB Design and Cadence Pegasus™ Verification System, removing traditional barriers between different design domains and speeding design closure. Virtuoso Studio is newly integrated with the AWR® Microwave Office® solution, and the Pegasus Design Rule Check Solution is now available from within the Virtuoso Layout Suite.

They also recently announced the new Cadence® EMX® Designer, a passive device synthesis and optimization technology that delivers, in split seconds, design rule check (DRC)-clean parametric cells (PCells) and accurate electromagnetic (EM) models of passive devices, such as inductors, transformers, T-coils and more. Seamlessly integrated with the Cadence Virtuoso® ADE Product Suite, the EMX Designer solution offers more than 10x faster synthesis times, with significant productivity gains versus other solutions.

CAES

CAES was recently awarded a contract from the US Navy for the initial pre-production phase of the AN/ALQ-99 Low Band Consolidation (LBC) transmitter. The LBC is a modification to the AN/ALQ-99 Low Band Transmitter. Having delivered more than 850 jammers across the last several decades, CAES continues to deliver products at the forefront of US Navy and Royal Australian Air Forces’ EA-18G operations worldwide. CAES transmitters are designed, built and tested to provide high power across multiple octave bandwidths, which allows them to withstand the demanding and severe environment of maritime, Tactical Aviation aircraft operating from US Navy Aircraft Carriers. They also provide high reliability with low maintenance costs. CAES developed, produced and delivered LBT transmitters for the US Navy and RAAF EA-18G Growler Airborne Electronic Attack Fleets. These RF jamming transmitters played a critical role in protecting the lives of US and Coalition forces during Operation Iraqi Freedom, Operation Enduring Freedom and across the Global War on Terror. We were honored to be given a tour of their nearby facility and see all of the manufacturing that is highly controlled by SPC procedures and how they empower their employees to fix problems quickly.

CML Micro

Among the CML Micro products on show at IMS was the recently-introduced CMX90B701 and CMX90B702 low current low-noise gain blocks for the 17 to 23 GHz and 23 to 29.5 GHz bands, respectively. Both devices have an ultra-low current consumption of 10 mA with a typical P1dB output figure of +7.5 dBm, an IP3 output of +17.5 dBm and a noise figure of 4 dB. The devices are housed in a low-cost 3 x 3 mm QFN package, and are fully matched to 50 Ω.

Connectronics Inc.

Connectronics Inc., designer and manufacturer of standard and custom RF connectors, adapters and microwave connectors, showcased its RF connectors and adapters designed for quantum computing at booth 515. Connectronics can modify its extensive product line of 6,000 RF connectors to feature nonmagnetic and cryogenic attributes critical to quantum computing applications. These high frequency, coaxial RF connectors are U.S.-manufactured with base material and plating finish combinations that minimize magnetic signature. Connectronics delivers connectivity solutions, ensuring minimal interference with quantum computing’s applied magnetic fields. A complete range of RF connectors can be produced in large and small quantities, including unique and hard-to-find connectors.

Copper Mountain Technologies

Copper Mountain Technologies and Eravant have partnered to deliver co-branded frequency extender modules covering measurements from 50-110 GHz: FET-WR15, FET-WR12, and FET-WR10. The extenders are anchored by CMT’s 9 GHz CobaltFx VNAs to deliver a cost-effective frequency extension system with options for output power adjustment and high output power.  High-power extender modules are available providing increased (+8 to+10 dBm) test port output power. Users can also incorporate an attenuator into their extender purchase for adjustable output power control (0-30 dB). Available accessories include a waveguide calibration kit, WaveGlide™ rail system, for a simplified easy-to-use setup, Waveguide Quick Connect™ for streamlined calibration, and Proxi-Flanges™ to facilitate a more reliable and accurate test setup. An interesting demo in the booth used was is probably the smallest metrology grade, 2-port VNA operating to 5.5 GHz was used in a ground sensing application to detect metal under the cabinet.

Corning Incorporated 

In booth 2335 at the conference, Corning's experts showcased their latest innovations. The G3PO™ Interconnect Series is a high frequency (65 GHz and 100 GHz) connectivity solution for telecommunications, radar systems, shipboard, airborne, ground-based, missile programs, cryogenic and non-magnetic applications. The G3PO™ interconnect series offers a blind mate interconnect that has a center-to-center spacing of 0.085 in and weighs just .016g. This series is designed to accommodate both radial and axial misalignment with negligible voltage standing wave radio (VSWR) change to perform in high-stress environments. Within this series, Corning offers adapters available to SMA, 1.85 mm and 2.4 mm.

The G4PO™ Interconnect Series is their latest innovation, this ultra-high-density connectivity solution enables high frequency (60 GHz) connections even in constrained environments that lack open access. With center-to-center spacing of 0.070 in, board-to-board spacing of 0.090 in., and a weight of .005 g, th is series is 50 percent smaIler than G PPO® and 18 percent smaIler than G3PO™. Within this series, Corning also offers adapters available to SMA, 1.85 mm and 2.92 mm.

dB Control 

In booth 1154, dB Control exhibited microwave power modules (MPMs), RF switches and more. The MPMs are based on a modular design for easy customization and are available with continuous wave or pulsed power. Each MPM is a complete microwave amplifier that uses traveling wave tubes and solid state technologies, along with high-voltage and low-voltage power supplies, to provide the best of both worlds for military and commercial applications. Models displayed include dB-3201, dB-3201H, dB-4150, dB-3202, dB-3205, dB-3758, dB-3774B, dB-4127 and dB-4128 MPMs.  

Also on display was a large selection of high-power MIL-standard switches for military, commercial, telecommunications and specialty applications from Charter Engineering. Models displayed include the SPDT – B40 Series, SP6T – H60 Series, SP6T Externally Terminated  – C6 Series, SP8T Minature – J8 Series and SP12T  – S12 Series. 

Doosan Corporation Electro-Materials

Doosan Corporation showcased products and technologies aimed at bringing a “Delightful Life” to customers in the era of 5G and beyond.  The company highlighted 5G mmWave antenna modules, a MEMS timing solution and copper clad laminates (CCL) for ‘high speed and high frequency’ applications.

Empower RF Systems

Empower RF Systems, based in Inglewood, CA designs power amplifier solutions for EW radar, SatCom, threat simulation, communications and product testing applications. The company's air and liquid-cooled amplifier products range from tens of watts to hundreds of kilowatts in PA modules to scalable rack systems. These amplifiers use a patented architecture and technologies ranging from GaN and GaAs to silicon-based LDMOS and MOSFET technologies to produce sophisticated and flexible COTS amplifiers to 6 GHz. The company had examples of all its products on display with the recently released model 2245 figuring prominently. This liquid-cooled amplifier delivers a minimum of 4100 W CW from 2 to 4 GHz with 5 kW mid-band performance.

Eravant

Eravant, MilliBox, Maury Microwave and Copper Mountain Technologies (CMT) joined forces to showcase a complete and affordable system for D-Band over-the-air (OTA) 3D antenna pattern measurement. Each company contributed some of its leading products to the demonstration. The presentation featured a benchtop mmWave anechoic chamber with a 3D antenna positioner from MilliBox and a CMT 2-port 20 GHz VNA. Eravant’s compact transmitter and receiver modules extend the frequency of the VNA to 110 to 170 GHz with low profile flexible cable assemblies from Maury Microwave. This demonstration displayed a live 3D radiation pattern capture of Eravant’s WR-06 20 dBi horn antenna. In addition, Eravant was featuring their waveguide noise source LN2 calibration services up to 220 GHz. They are calibrated in-house using a cold reference termination. A room-temperature or "hot" reference termination is also used. The effective noise temperatures of these terminations are controlled within a fraction of a degree so very accurate. Typical ENR flatness is +/- 2 dB over the entire operating bandwidth.

ERZIA 

At booth 1251, ERZIA  displayed their low noise amplifiers and power amplifiers, integrated assemblies, substrate filters and ERZIA’s new lineup of equalizers, mixers and switches.

Filtronic

Filtronic launched two new product ranges — Taurus and Hades X2. Hades X2 is a next-generation active diplexer with increased performance with a typical PSAT of 30 dBm and dual high-power amplifiers. It also boasts 2 x GaAs MMICs that are performance-matched and power combined in waveguide to deliver maximum power and linearity.  Taurus is a high-power E-Band amplifier with market leading linear mmWave power and unparalleled performance for long range E-Band communications, with a typical PSAT of 38 dBm.

Finwave Semiconductor

Finwave Semi did not exhibit, but they were holding meetings in a hotel near the convention center. The company began in 2012 at MIT, when the co-founders invented a type of GaN transistor based on a FinFET architecture. They felt that this 3D fin structure was exactly what GaN transistors needed to significantly improve efficiency and linearity. The company has spent the last decade improving device performance, scaling the wafer size to today’s 8” wafers with Si-compatible process and establishing a global network of partnerships. In addition to the co-founders, Finwave brought SOI veteran Jim Cable onboard and just announced that Dr. Pierre-Yves Lesaicherre onboard as CEO. While they weren't displaying products yet, the company has an impressive presentation detailing the performance improvements that their FinFET architecture enable and they have GaN-on-silicon PAs for handset applications squarely in the sights for their product and process development activities.

Fine-Line Circuits

Fine-Line Circuits exhibited in booth 1713, providing the ideal surface finish for RF microwave PCBs – electrolytic thick gold direct on copper which gives a great skin and no nickel related signal losses giving the designer the precise RF performance that the system is designed for. Fine-Line has built a variety of PCB boards (hybrids, cavities, copper back, oversized PCBs) for a variety of space and defense applications and a variety of systems (satcom, radar, antennas, dividers, amplifier, etc.)

Garlock

Garlock was highlighting products from their WavePro division in booth 1701 at IMS. In particular, they were showcasing the recently released WavePro® 150 (WP150), a ceramic-filled PTFE dielectric material with a dielectric constant (relative permittivity) of 15.0 and a loss tangent of 0.003 at 6 GHz. WP150 extends the range of PTFE dielectrics to higher dielectric constant values than were previously unavailable, unlocking applications where stability and higher dielectric constants are advantageous. It is available in standard flat panels up to 10 mm thick, as well as made-to-order 3D shapes and conformal surfaces. PTFE is a versatile and durable dielectric that is used in antennas, cables, radomes, RF circuit boards and many other microwave and mmWave applications due to its low loss and high performance and the company had many shapes and sizes of the material on display. 

Guerrilla RF, Inc

Guerrilla RF launched their latest  linear power amplifiers at IMS. The GRF5526, GRF5526W, GRF5536 and GRF5536W, the latest in a series of ¼ W linear power amplifiers. These InGaP HBT amplifiers were designed specifically for 5G wireless infrastructure applications over large 100 MHz bandwidths and temperature extremes of -40°C to 105°C. Spanning frequency ranges of 2.3 to 2.7 GHz and 3.3 to 4.2 GHz respectively, the GRF5526/GRF5526W and GRF5536/ GRF5536W are tuned to operate within the n7, n30, n38, n40, n41, n48, n53, n77, n88 and n90 5G  NR bands. The GRF5607 and GRF5608, the first in a new class of InGaP HBT  ½ W linear power amplifiers being developed by the company, were designed specifically for 5G wireless infrastructure applications over temperature extremes of -40°C to 85°C. Spanning frequency ranges of 703 to 748 MHz and 746 to 830 MHz, respectively, the GRF5607 and GRF5608 are tuned to operate within the n12, n14, n18, n20 and n28 5G NR bands. 

Hyperlabs

iCana 

iCana returnd to IMS with a demo of AMD's ZCU670 platform and iCana's 4T4R FR1 reference board, highlighting impressive performance, power efficiency, and pin-to-pin compatibility. Attendees who visited booth 2350 explored iCana’s latest solutions in action and their FR1 and FR2 product line-up.

IHP

IHP is a non-university research establishment institutionally funded by the German federal and state governments and a member of the Leibniz Association. IHP is a research institution for silicon/germanium electronics. They have expertise in semiconductor technology, materials research, high-frequency circuit design and system solutions. The institute has a SiGe:C BiCMOS pilot line that manufactures RF and silicon photonics modules. IHP provides a Multi Project Wafer Service with 0.13 and 0.25 μm SiGe BiCMOS technologies on 8” silicon wafers. Integrated SiGe heterobipolar transistors with 500 GHz f_max are qualified for research and product design, devices with up to 700 GHz f_max are under development.  A Cadence-based mixed-signal design kit is available. For high frequency designs an analog Design Kit using Keysight ADS can be used.

IMS Connector Systems

IMS Connector Systems introduced their SmartMod, a standard M12-based connector is the perfect service tool for troubleshooting and machine maintenance when in combination with a smartphone or tablet. The SmartMod enables continuous measurement of functions such as temperature, humidity, air pressure, voltage, current and power. In combination with a smartphone or tablet, it is the perfect service tool for troubleshooting and machine maintenance. It can also be networked with existing control systems. The SmartMod is based on the industry standard connector and is installed exactly where it is needed. Thanks to wireless connection to a smartphone or tablet with a range of 40 m indoors and 100 m outdoors, the connectors can also be used at measuring points that are far away from each other.

IMST 

IMST is a development center for customer-specific radio technology and microelectronic systems. More than 130 highly qualified engineers develop integrated circuits, hybrid modules and systems, radio modules, antennas, micro-controller circuits, embedded systems and 3D-EM simulation software in Kamp-Lintfort. They guide customers from the first product idea all the way to the finished system. 

Indium Corporation®

Indium Corporation featured its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications. Indium Corporation’s AuLTRA™ 75 is an off-eutectic AuSn preform solution (75Au25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA™ 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition, and improving wetting and voiding. The AuLTRA™ product line also comes in 78Au22Sn and 79Au21Sn compositions.

Isola Group

Isola Group's booth offered sampling of its extensive lines of laminates and prepreg materials for RF, microwave,  mmWave and photonics circuits.  The circuit materials on display include the Astra® MT77, available in laminate and prepreg forms, I-Tera® MT40 laminate and prepreg materials and Tachyon® 100G laminates and prepregs. Isola Group also showed its halogen-free materials at the 2023 IEEE IMS exhibition, with example circuits on its TerraGreen® laminates and TerraGreen® 400G laminates and prepregs. 

Junkosha

Junkosha chose IMS2023 to launch their two new (26.5 GHz and 50 GHz) metrology grade microwave/mmWave vector network analyzer (VNA) test cable assemblies for applications including calibration tests.Utilising Junkosha’s precision engineered-EPTFE tape wrapping technology, the new 26.5 GHz and 50 GHz cables exhibit excellent phase (within +/- 4.5 degrees at 50 GHz) and amplitude (within +/- 0.08 dB at 50 GHz) stability in flexure alongside strong phase stability in temperature. 

Keysight Technologies, Inc. 

Keysight demonstrated its comprehensive portfolio of wireless design, emulation, and test solutions, including the ENA-X, at IMS2023 in booth 835. The new Keysight ENA-X  is a midrange VNA that produces fast, accurate EVM measurements and accelerates the characterization of 5G component designs by up to 50 percent. 

Keysight's collaboration with Nokia Bell Labs presented their most recent achievement at Keysight's booth. Built on the Keysight PNA-X Vector Component Analyzer solution, the demonstration characterized a Nokia power amplifier (PA) developed for use in 6G D-Band wireless communications systems and designed to operate with a low error vector magnitude (EVM). Using the Keysight N5290A PNA Millimeter Wave System, Nokia Bell Labs can accurately detect the PA's low EVM, which is a measure of the signal distortion introduced into the communications system by the component. With these measurements, Nokia Bell Labs can better understand the PA's performance to optimize its 6G transmission system design. Keysight and Nokia Bell Labs also partnered to showcase an E-Band test solution at IMS2023. The demonstration featured the Keysight N9042B UXA Signal Analyzer used in combination with the V3050A Signal Analyzer Frequency Extender to measure a Nokia transceiver RFIC designed for use in an E-Band system for backhaul applications.

Keysight Technologies also introduced PathWave Advanced Design System (ADS) 2024, an electronic design automation (EDA) software suite giving chip designers new millimeter wave (mmWave) and subterahertz (sub-THz) frequency capabilities that accelerate 5G mmWave product design and anticipate requirements for 6G wireless communications development. The latest version of Keysight’s industry-leading radio frequency and microwave (RF/uW) design software suite addresses these development pain points with algorithm, layout, electro-thermal, and workflow automation enhancements.

Knowles Precision Devices

Knowles Precision Devices focuses on a wide variety of capacitors and components in the microwave to millimeter wave frequency ranges for use in military, medical, electric vehicle and 5G market applications. The company offers a wide range of custom-designed and build-to-print solutions to meet aerospace and defense requirements. The company was showcasing 5G catalog filters at 26 GHz, 28 GHz, and 39 GHz, with each device providing 3 GHz of bandwidth, more than 50 dB rejection, with operating temperatures from -55°C to +125°C. In particular, the company was showcasing a line of C, X, Ku and Ka-Band filters and other passive products for SatCom applications.

MACOM

MACOM had a large booth presence at IMS. They were showcasing the latest products in their broad portfolio of active and passive RF/microwave, Optical and Broadcast solutions. MACOM's recent acquisition of OMMIC closed a few weeks before IMS, so they were talking about their plans to make OMMIC's facility in France the foundation for their newly established European Semiconductor Center. The center will enable MACOM to offer its customers higher frequency Gallium GaAs and GaN MMICs. MACOM was also showing products and capabilities from recently acquired Linearizer Communications Group. Linearizer specializes in non-linear microwave predistortion for use in terrestrial, avionic and space-based applications and high-performance microwave photonic solutions for use in the industrial and defense markets. 

Marki Microwave

Marki has developed an interesting new online filter design software that uses machine learning to determine a full MMIC filter design by just inputting the center frequency and percent bandwidth. The program uses data from existing design to determine the layout needed and accurately designs a new filter to the specifications. They are also working on various new packaging technologies to operate at higher frequencies. They have a chip scale packaged limiter that operates from 0 to 40 GHz as an example. Marki has designed more that 100 new products in the last 12 months!

Marvin Test Solutions 

Marvin Test Solutions featured their 5G mmWave production test system, the TS-900e-5G, which delivers unrivaled semiconductor production test performance for mmWave devices. The flexible, open-architecture design supports up to 20 independent VNA channels with gap-free performance to 53 GHz for impactful solutions in the production test lab and OSAT alike.

MathWorks

MathWorks participated in four demonstrations, four industry workshops, a technical session and an industry showcase at IMS. Demonstrations held in booth 2541 included PA modeling and DPD with NI instrument, targeting satcom applications with RFSOC and testing over the air with Otava DTRX2, measuring RF filters with Keysight VNA, creating MATLAB behavioral models and tuning filter performance and developing and testing algorithms with radar book.

MCV Microwave

MCV Microwave had their line of passive RF components on display at booth 1804. MCV provides leading edge technology to military, commercial and wireless providers. The company makes materials, devices and modules using their unique ceramic materials. One example is antenna/LNA modules which can be custom designed precision modules or standard band pass and notch filter operating at GPS, GLONASS, BDS, GALILEO QZSS and NAVIC/IRNSS frequencies. They also provide a variety of products like spiral antennas, low ESR/high Q capacitors, isolators, duplexers and filters for 5G and SATCOM to name a few.

MDL

Microwave Development Labs (MDL) was celebrating its 75^th year in business at IMS. Established in 1948 in Needham Heights, MA, MDL is a leading supplier of components and assemblies for RF, microwave, and millimeter-wave applications requiring low-loss transmission of electromagnetic (EM) energy. MDL has built an experienced, expert staff of design engineers capable of working closely with each customer’s specific electrical and mechanical specifications to meet the most demanding custom requirements. The company’s rich history includes pioneering the Riblet coupler in 1948 for use at microwave frequencies, before that portion of the frequency spectrum was widely used for transmission of electromagnetic waves. From that innovative first year, the company has never stopped enhancing microwave coupling solutions, leading to such achievements as the thin wall monopulse comparator for the Lunar Excursion Module in the 1960’s and waveguide feed and monopulse networks for F-14 and F-15 fighter aircraft in the 1970’s. Internally milled waveguide technology from MDL developed during the 1980’s helped reduce the size and weight of high-performance waveguide components for radar systems in F-18 fighter and B-1 bomber aircraft, long before new product development for military and aerospace customers required adherence to reduced size, weight, power, and cost (SWaP-C) trends.

MegaPhase

MegaPhase had a variety of space rated assemblies on display, including AlumiBend™, HyperFlex™, Phase3™, UltraPhase™, GrooveTube® and Semi-Rigid cables. MegaPhase Phase3™ cable assemblies were recently utilized in the LunIR lunar flyby mission, jointly funded and developed by Lockheed Martin and Terran Orbital, following the company’s AS9100 certification last year. Also on display was the company’s line of ruggedized test and measurement products, including the Survivor™, Warrior®, KillerBee® and RF Orange® cable assemblies.

Menlo Microsystems 

Menlo Micro announced in May product specifications update for the MM5140 DC-to-8 GHz SP4T switch. This product is positioned to address the globally evolving wireless standards in 5G sub-6 GHz RF network applications and emerging broadband wireless applications up to 8 GHz, which includes the ever-growing O-RAN frequency bands. Built on Menlo Micro’s market-proven Ideal Switch technology, the MM5140 continues to offer +90dBm IP3 linearity, 25W CW RF power handling, ultra-low insertion loss, integrated charge pump with SPI (Serial Peripheral Interface) and GPIO (General Purpose Input Output) interface control, and 3 billion cycles reliability, all in a 5.2 mm x 4.2 mm LGA package.

Pickering introduced the first modules in a new MEMS-based RF PXI/PXIe multiplexer family. The new RF multiplexer family is powered by Ideal Switch® from partner, Menlo Microsystems, which are among the first MEMS components on the market with the performance characteristics to support demanding RF testing requirements. The company also announced a product specifications update for the MM5140 DC-to-8 GHz SP4T switch in May. This product is positioned to address the globally evolving wireless standards in 5G New Radio sub-6 GHz RF network applications and emerging broadband wireless applications up to 8 GHz, which includes the ever-growing O-RAN frequency bands. Built on Menlo Micro’s market-proven Ideal Switch technology, the MM5140 continues to offer +90 dBm IP3 linearity, 25 W CW RF power handling, ultra-low insertion loss, integrated charge pump with Serial Peripheral Interface and General Purpose Input Output interface control and 3 billion cycles reliability, all in a 5.2 mm x 4.2 mm LGA package. 

Mercury Systems, Inc.

Mercury, had their COTS open-architecture board at their booth. It delivers the latest commercial signal processing technology for aerospace and defense applications, driving higher performance from a smaller form factor. The DRF3182 Direct RF Processing Module is the first standard product purpose-built for the aerospace and defense industry that leverages Intel’s new Stratix® 10 AX SoC field programmable gate array (FPGA), which adds a key capability to the Mercury Processing Platform by enabling the direct digitization and processing of broadband RF signals.

Mician 

Mician was showcasing µWave Wizard. Initially geared toward the space sector and satellite payloads, Mician’s µWave Wizard software offers a combination of advanced hybrid solver and 3D modeler technology in order to speed up the process of accurately analyzing, synthesizing and optimizing RF components. In addition to filters, multiplexers, couplers, and horn antennas, applications also include complex waveguide assemblies such as feed networks. Launched over 20 years ago, and continuously improved, µWave Wizard's hybrid solver technology provides users with the benefits of "several engines under one roof." For large assemblies and complex RF circuits, the solver breaks the problem down into a series of smaller circuits that are simulated and optimized separately. They can subsequently be recombined, analyzed and optimized for final performance. Mician says that the development speed of µWave Wizard is complemented by its accuracy and RF components designed using µWave Wizard can be found in just about every commercial and government satellite launched in the past decade. Mician’s industry-leading software solutions are also utilized for RF circuits on UAVs, VSAT terminal assemblies, TV broadcast, radar systems, automotive, 5G backhaul and for research.

Microchip

In booth 2435. was showcasing its broad portfolio of smart, connected and secure embedded control solutions. With this portfolio, the company targets applications across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. In particular, Microchip was showcasing their 5071B cesium atomic clock. The unit is available in a three-unit height (3U) 19-inch rackmount enclosure. It has upgraded electronic components to address possible obsolescence or non-RoHS circuitry. The product provides 100 ns holdover for more than two months, maintaining system synchronization when GNSS signals like GPS are denied. As a cesium beam tube product with no deterministic long-term frequency drift, the 5071B provides absolute frequency accuracy of 5E-13 or 500 quadrillionths over all specified environmental conditions for the life of the product. Microchip is targeting telecommunications, data center, metrology, aviation and defense applications with this long-term, precise timing and frequency solution.

With all its acquisitions over the years, the company also was showing an impressive selection of GaAs, GaN and silicon transistors and diodes, in addition to RF MMIC amplifiers, prescalers and control products. Microchip also integrates these semiconductors and functions into higher level amplifiers, modules and assemblies.

Microsanj/MPI

Recognizing that traditional techniques cannot fully assess the thermal behavior of these devices, Microsanj has focused on thermal analysis systems that will meet the challenges posed by today’s most advanced designs. The SanjSCOPE™ EZ-THERM series is a compact bench-mountable thermal imaging system that provides the sensitivity, spatial and temporal resolution for designers to fully understand device thermal behavior. With spectral coverage from 365 nm to 1700 nm, GaN HEMTs can be analyzed with a spatial resolution less than 300 nm, and flip-chip mounted microwave devices can be analyzed with thru-the-substrate imaging above 1000 nm. The capability to do infrared macro analysis with better than 10 mK thermal sensitivity and quickly move to nano-scale analysis with thermoreflectance enables designers to capture the smallest hot spots and analyze its characteristics on a nano-scale level.

MPI has incorporated this capability into their semiconductor probing stations so thermal and electrical data can be gathered together. For example, the MPI TS2000-IFE is automated platform which can be converted since the beginning or at any time later in the field to a fully-automatic probe station. It incorporates MPI advanced technologies, such as PHC™ as a standard feature and mDrive™ or VCE™ optional or as an upgrade. The main applications are  load-pull, RF, mmW,  Silicon Photonics, Design Validation (Product Engineering) or testing of MEMS and other sensors under defined test environment. In combination with WaferWallet® MAX MPI is addressing the transition from Lab to Fab for these specific applications.

Millibox

Millibox makes mmWave antenna test systems. These systems consist of a mmWave anechoic chamber and a 3D antenna positioner. The anechoic chamber and antenna positioner allows users to quickly and efficiently test the antenna radiation pattern and other key OTA metrics. The company makes five different types of antenna positioners with their GIM04 and GIM05 units in the booth. Millibox makes four different types of anechoic chambers, ranging in size from 4 to 8 feet. The company had one of their two-foot anechoic chamber building blocks, along with their four foot MBX02 on display with antennas on their positioners.

Mini-Circuits

Mini-Circuits had a big news as President Ted Heil and Board Chair Alicia Kaylie Yacoby announced that Jin Bains will join Mini-Circuits as CEO starting in July. Heil, who plans to step down as president, will continue in his current role through the remainder of 2023 supporting Bains during the transition. He will remain engaged on special projects and in governance and oversight indefinitely. Bains will serve as the third chief executive in Mini-Circuits' nearly 55-year history, following founder Harvey Kaylie and Ted Heil in leading the company, which is privately held. Mini-Circuits highlighted many products including:

Mini-Circuits’ model ZX60-14LN-S+ is a low noise amplifier (LNA) with bandwidth of 50 MHz to 10 GHz. Noise figure is typically 2.2 dB to 8 GHz and 3.62 dB to 10 GHz. Gain is typically 20.6 dB to 8 GHz and 18.2 dB to 10 GHz with full-band gain flatness of ±2.2 dB and within ±1 dB to 8 GHz. Well suited for communications, radar and test, the LNA features SMA female connectors and operates from a single +6 VDC supply.

Mini-Circuits’ model HFCV-2002+ is a low temperature co-fired ceramic (LTCC) highpass filter with passband from 19.6 to 47.0 GHz. Passband loss is typically 1 dB to 26.5 GHz and 2.2 dB or less to 47.0 GHz. Rejection is 17.8 dB or better across a stopband of 0.1 to 15.0 GHz. Ideal for cellular communications and test applications, the surface-mount technology (SMT) filter handles input power levels to 1 W. The 50 Ω filter measures 0.126 × 0.098 in. (3.20 × 2.50 mm).

Mini-Circuits’ model ZVA-24443G1+ wideband coaxial amplifier covers 24.0 to 43.5 GHz with 43 dB or more typical gain. The typical full-band noise figure is 1.75 dB or better, with output power at 1 dB compression of typically +21 dBm or better. The typical third-order intercept is +27 dBm. Available with or without a heat sink, the rugged amplifier has built-in over-voltage and reverse-voltage protection and incorporates 2.92 mm female coaxial connectors. It operates from a single supply of +9 to +15 VDC.

Mini-Circuits’ model TPCG-183+ SMT thru-line features low loss from DC to 18 GHz. Typical insertion loss is 0.5 dB from DC to 15 GHz rising only to 0.6 dB through 18 GHz. Return loss is typically 10 dB to 15 GHz and 9 dB to 18 GHz. The 50 Ω thru-line is a good fit for communications, radar and test systems and serves as a handy “place holder” in printed circuit boards for 0805 SMT LTCC filters. It handles as much as 7.5 W of power.

Mini-Circuits’ model ZVBP-16R3G-S+ is a cavity bandpass filter with insertion loss of typically 0.5 dB and return loss of typically 21 dB across a passband of 15.9 to 16.7 GHz. It accompanies the outstanding loss characteristics with lower-band rejection of typically 58 dB from DC to 14.7 GHz and upper-band rejection of typically 39 dB from 17.4 to 28.0 GHz. Outfitted with SMA female coaxial connectors, the RoHS-compliant filter is ideal for isolating signals of interest in test setups.

mmTron 

At their first IMS, mmTron exhibited in both 343. mmTron staff discussed how the company’s designers are developing disruptive MMICs that extend output power, linearity, and efficiency — simultaneously — to extend the reach and data capacity of mmWave communications systems. mmTron’s approach to this power, linearity, and efficiency challenge was explained by Seyed Tabatabaei, mmTron’s founder, president, and CEO, in his MicroApps presentation “mmWave PAs: Why Sacrifice High Power for Linearity?” mmTron was highlighting a unique IC module that converts the differential output of a high-speed digital-toanalog converter (DAC) to a clean, low noise, single-ended RF signal. The TMC160 integrates anti-alias filters, quasi-differential low noise amplifiers, and a balun with bias T in a 7 x 7 mm surface-mount package. The TMC160 was demonstrated with a Texas Instruments highspeed DAC. As part of its focus on mmWave, mmTron has designed a family of broadband distributed amplifier MMICs with upper frequencies from 20 to 160 GHz, for applications like instrumentation and EW. To support 6G research programs, the company offers the TMC774, with a frequency response from DC to 160 GHz.

Molex

Molex has extended its cable-assembly product line with the addition of innovative solutions from I-PEX. Together, the organizations offer I-PEX MHF® 4L LK and MHF® I LK cable assemblies, which are available in multiple configurations using standard MHF receptacles and Molex RF connector interfaces. The MHF I Series of micro-RF coaxial connector systems takes advantage of I-PEX’s patented locking mechanism to add another layer of connection reliability and security. Designed to keep signals connected through constant shock and vibration, this cutting-edge solution clicks into place seamlessly. Inspired by operation with drones, the patented locking system is ideally suited to address the most rigorous connectivity demands.

MtronPTI

MtronPTI showcased a Ku-Band Integrated Microwave Assembly (IMA) to support broadband communication datalinks used in applications like manned and unmanned aircraft, on the move and fixed ground stations, shipboard beyond line-of-sight wideband satellite communications and all unmanned vehicles. This integrated Ku-Band microwave assembly incorporates low insertion loss, high power handling, high isolation between bands, Ku-Band diplexer filters that are interconnected with two wave guide RF switches, a coupler and a lowpass filter for harmonic suppression. RF cables are fed from the diplexers to a separate RF module consisting of an RF board with low noise amplifiers and an RF switch that switches the receive signal between the two paths. The module contains peripheral control and status circuitry for user access

Nullspace

Nullspace spun out as an independent company from IERUS Technologies, an established defense contractor in 2023. They have the goal of becoming a recognized leader in advanced engineering software. The company has developed a set of proprietary solutions built on a specific method of moments (MoM)  formulation. They offer Nullspace Prep, a comprehensive CAD and meshing pre-processor that integrates with Nullspace EM, a fast, accurate 3D Electromagnetic simulation tool and Nullspace ES, which they claim is the world’s only commercial electrostatic solver for extremely large-scale, rapid, and accurate design and analysis for quantum computing. The Nullspace solutions use proprietary fast linear algebra algorithms and hybrid multi-CPU and multi-GPU acceleration techniques and differentiate with their ability to solve large, complex problems quickly and accurately.They claim to be able to solve these problems over 25x faster than available solutions.

Nxbeam

Nxbeam expanded its mmWave MMIC portfolio with the introduction of a GaN E-band power amplifier MMIC. The NPA7000-DE operates from 65 to 76 GHz and provides an average saturated output power of 1 W, average power added efficiency of 28%, and average linear gain of 13 dB. The chip dimensions are 1.575 x 0.875 x 0.050 mm. The output power level of this MMIC makes it ideal for point-to-point E-band communication links. The small size of this MMIC simplifies power combining schemes and can greatly increase the range of E-band point-to-point links. The design consists of two amplifier stages which are independently controlled, allowing the bias and performance to be tailored to the end-user’s specifications. The RF input and RF output are matched to 50 Ω with DC blocking capacitors for easy system integration. Bond pads and backside metallization are Au-based for compatibility with eutectic die attachment methods.

Otava 

Otava had three demonstrations at IMS. In their booth, 2514, their digitally tunable 24 to 40 GHz bandpass filter. At MathWorks' booth 2541 the Wideband mmWave Radio Development Kit for AMD RFSoC Gen 3 was demonstrated. Otava’s 64-element 24 to 30 GHz active phased array antenna module could be seen at Samtec's booth, 2627. 

Pasquali Microwave Systems 

Pasquali Microwave Systems offers full-in-house engineering, manufacturing, surface treatments and QA/testing of µ-Wave and mmWave assemblies (1 to 200 GHz, passive and active) for defense, space, naval and civil/TLC sectors, such as: µ-Wave and mmWave waveguide assemblies and antennas systems: 1 to 150 GHz or higher frequencies; Blackbody RF absorbers for calibration targets and polarizers: 10 to 200 GHz, 4°K to 330°K; and electronics subassemblies and components: on-waveguide integrated parts, microstrip/PCBs (1 to 50 GHz).

Pickering Interfaces

Pickering introduced the first modules in a new MEMS-based RF PXI/PXIe multiplexer family. The new RF multiplexer family is powered by Ideal Switch® from partner, Menlo Microsystems, which are among the first MEMS components on the market with the performance characteristics to support demanding RF testing requirements. Steve Edwards, Switching Product Manager at Pickering, comments: “The new MEMS-based RF multiplexers deliver vastly increased operational life (up to 300x), faster operating speed (up to 60x), and higher bandwidth (with no reduction in RF power handling) versus traditional EMR (electromechanical relay) alternatives. Insertion loss also remains comparable with EMR switches and much lower than solid-state.”

In addition to the new RF multiplexer family in PXI/PXIe, Pickering also highlighted the following RF and microwave switching innovations:

• New 110 GHz PXI/PXIe microwave switch – supporting 5G and semiconductor test
• New Microwave Design Tool – a free online tool for configuring flexible LXI microwave switch products
• Flexible LXI microwave switch platform and turnkey services for LXI microwave switch and signal routing subsystems – including a custom 12x12 LXI microwave switching matrix demo
• Also on show will be a selection from Pickering’s broad portfolio of other switches, along with its PXI, PXIe and LXI/USB modular chassis, simulation products and cables and connectors.

PRFI

PRFI, the UK custom MMIC design specialists, has announced a significant milestone: its 150th custom MMIC design, a low-current mmWave gain block, has moved to production. The company has a reputation for high quality, successful design work, with an impressive list of clients that includes Samsung, Sony, Analog Devices, BAE Systems and Qorvo. The milestone MMIC provides a small-signal gain of 17dB across an operating range of 23 to 29.5GHz from a very low current consumption of just 10mA. It is housed in a low-cost 3mm x 3mm QFN package and is fully matched to 50Ω, making its use very straightforward. The part was designed for CML Microcircuits’ SµRF product range, and is commercially available as the CMX90B702. A companion part has also been designed by PRFI, which has similar gain with the same very low 10mA current consumption and covers 17 to 23GHz.

pSemi

At IMS, pSemi announced its newest SP4T switches up to 8 GHz and two multi-chip modules featuring dual-channel switches. The new PE42445 and PE42446 switches integrate seamlessly into 4G and 5G base stations and mMIMO architecture, providing digital pre-distortion (DPD) feedback loops and transmitter monitoring signal paths to prevent interference and maintain signal integrity, given massive MIMO applications. Thanks to their high reliability and extended operating temperature range, the new high isolation SP4T switches can be used for a wide variety of applications, including DPD and VSWR monitoring, portable wireless radios, repeaters and E911 systems and test and ATE equipment. Offered in a compact 6×6 mm LGA package, the PE53230 and PE53231 products feature high gain of more than 36 dB and fast switching time of less than 600 nanoseconds. With low power consumption of less than 500 mW/channel, these integrated solutions lead the industry with the highest average input power handling at 20 W. They also announced two multi-chip modules featuring dual-channel switches, the PE53230 for 3.3–3.8 GHz and the PE53231 for 3.5–4.0 GHz. Each module contains two switches and two LNAs for high and low band frequencies. The new module portfolio delivers the lowest noise figure in the industry, at less than 1 dB, enabling best-in-class receiver sensitivity and performance while handling 20W average input power enabling removal of external circuitry.

Q-Tech Corporation

Q-Tech bills itself as the world's leading manufacturer of high-reliability crystal oscillators. They supply these devices into high-performance applications in high reliability/space, military, avionics and high-temperature markets. They did not have any products released specifically for IMS, but they were showcasing representative examples of their product portfolio.

Qorvo

Qorvo introduced three best-in-class solid-state power amplifiers (SSPAs) for commercial and defense communications, radar, electronic warfare (EW) and other wideband applications just before IMS. The QPB2040N, QPB0220N and QPB0618N, part of Qorvo's innovative Spatium® SSPA portfolio, provide an excellent alternative to traveling wave tube amplifiers (TWTAs). Qorvo's QPB2040N SSPA operates in the frequency range of 18 to 40 GHz, spanning the K- and Ka-Bands. With its wideband output power performance (100 W CW) in a compact size of less than 50 in.³, it is the ideal building block for various millimeter-wave subsystems in wide-ranging applications. The new QPB0220N and QPB0618N SSPAs are solid-state, spatial combining amplifiers operating in the S, C, X and Ku bands. With their optimized output power, gain and power-added efficiency over their respective frequency ranges, these Spatium SSPAs further expand Qorvo's family of products to support a growing industry need for modular, scalable, reliable and fully tested products.

Quantic® Electronics

Attendees who visited Quantic's booth at IMS saw demonstrations of their frequency control components and assemblies under vibration were on display. Quantic Wenzel showed off their world class low phase noise oscillators. They excel in low phase noise oscillator under extreme conditions also. For power products, their patented ceramic capacitors for next-generation RF/ microwave applications, power-dense hybrid tantalum capacitors ideal for pulsed power space applications and thin film resistor foils (OhmegaPly®, TCR® and TCR-EHF®) were exhibited. Quantic X-Microwave was showing off their expanding line of breadboarding products. They now offer modules that plug into larger packaging to make full integrated microwave assemblies and have an A&D customer that recently placed an order. Quantic PMI was featuring a high power amplifier operating from 8 to 12 GHz with high gain of 43 dB and saturated output power of 40 dBm (10 W). It has a noise figure of 3.5 dB and gain flatness of +/- 3.5 db max.

Reactel

Reactel featured their application-specific filters, multiplexers and multifunction assemblies up to 67 GHz, along with the debut of its new Short Form Catalog for an overview of their extensive filter portfolio. An example product is Reactel model number 7R6-269-X17S11 which is a narrowband high power notch filter. The center of the notch is 269 MHz with a nominal 3 dB bandwidth of 16 MHz. Passband Insertion loss is less than 0.3 dB, notch depth is 85 dB while power handling capability is 100 W CW. This dynamo is housed in a package only 1.5″ x 1.15″ x 3.5″, and is suitable for extremely rugged conditions.

Response Microwave, Inc.

Response Microwave has it's new 3 dB 90-degree quadrature hybrids for use in various antenna and radio applications within the popular UHF band on display at  IMS. The new RMHY3.225-400Sf covers the 225 to 400 MHz band offering typical electrical performance of 0.25 dB insertion loss, VSWR of 1.2:1 and isolation of 23 dB minimum. Average power handling is 100 W and the unit is operational over the -40°C to +85°C range. Mechanical package is a small 1.6 x 1.6 x 0.5 in., plus SMA female connectors per MIL-C-39012.

RF Microtech Electronics

RF Microtech Electronics announced the launch of its latest line-up of cutting-edge products. Key highlights of the new product offerings include: RF modules and components; wireless development kits with development boards, wireless modules, documentation and software tools; and wireless modules Test Kit for IoT testing applications.

Rohde and Schwarz

Rohde & Schwarz took a new way to experience and demonstrate solutions for RF and microwave applications. Attendees were able to put their design knowledge to test with the Rohde & Schwarz “Are you a genius?” RF Design challenge. The challenge incorporated a series of lab challenges that evaluate attendee’s knowledge in s-parameters, EVM, high power, and baseband measurements. In addition to the RF Design Challenge, Rohde & Schwarz highlighted multiple demonstrations at the company’s booth. These include the new 67 GHz noise figure measurement capability that further enhances the R&S ZNA vector network analyzer to provide a powerful and versatile test system for full characterization of amplifiers and converters. Several highlights at the Rohde & Schwarz booth were the latest solutions for early sub-terahertz and 6G research applications. The R&S FExx external frontends extend the frequency ranges of Rohde & Schwarz signal and spectrum analyzers, and signal generators up to the D-Band (110 to 170 GHz). Additionally, both the R&S ZNA vector network analyzers and the R&S FSWP phase noise analyzer will be demonstrating 6G D-band system and component characterization. There was also the R&S ATS1800C CATR based 5G and 6G mmWave Over-The-Air (OTA) test chamber, which provides the ideal environment for testing antennas, modules and devices from R&D to conformance. When equipped with the two side chamber extensions, a unique 3D quiet zone is formed, with which the test solution supports on a very small footprint RRM measurements, including multiple angles of arrival (AoA).

Rogers Corporation 

In addition to giving two presentations in the MicroApps theater, Rogers showcased their products at booth 1635. These products included Radix™ 3D Printable Dielectrics and new Anteo™ low loss laminates. Rogers new family of Anteo laminates is designed to offer low loss RF performance as an alternative to FR-4 in commercial and consumer applications. With a dielectric constant of 4.07 +/- 0.08 and a dissipation factor of .005 at 10 GHz, Anteo laminates offer two benefits in comparison to thicker grades of FR-4. For a comparable price, it offers superior performance and enables greater antenna gain and efficiency. But the lower dissipation factor also enables similar or marginally improved performance at 1/3^rd to ½ the thickness of FR-4, thus providing a significant cost savings and improvement in packaging. Radix™ 3D Printable Dielectric is the first 3D material featuring a dielectric constant of 2.8 and low loss characteristics at microwave frequencies. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints. Rogers Corporation’s Radix 3D Printable Dielectric is a proprietary composite material designed for Digital Light Processing (DLP) 3D printing, enabling a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. This printable dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured. The material is intended for use as RF material in applications where new geometric freedom can enhance the figure of merits of an RF system, such as gradient dielectric constant (GRIN) structures and other complex three-dimensional parts. The Radix 3D Printable Dielectric offers the industry a way to manufacture systems and components at scale that could not be made with traditional fabrication methods. 

Samtec

Samtec was demonstrating their microwave/mm Wave connector and cable systems, including the Magnum RFTM series as well as edge launch and vertical connectors in one comprehensive demo. They used a Keysight 8-port 53 GHz USB VNA to transmit signals to the four mmWave RF systems. In the demo, we see a Samtec Magnum RF edge launch, mated in a perpendicular configuration with a vertical, solderless, compression mount GPPC series. They achieve good performance up to 40 GHz with VSWR better than 1.4 and loss better than 1 dB. The second demo is a Samtec Magnum RF cable assembly system that consists of a Magnum RF edge launch connector and a GC47 cable assembly.  In addition to improved density, this ganged cable assembly provides a more secure connection to the mating connector with the housing. Cable performance was VSWR under 1.4, loss is better than 4 dB with the 6 in of cable. The demo also featured two solderless, compression mount 2.40 mm edge launch connectors on the same PCB, connected by a 2” trace.  Samtec has a VSWR of better than 1.3 in this demo. And finally, in the same configuration, there were two solderless, compression mount 2.92 mm edge launch connectors, with 2” of trace with VSWR of better than 1.3. Samtec can support frequencies up to 90 GHz (E-band) with loss performance improved over coaxial cables.

Samtec’s next-generation micro waveguide technology offers the near-loss performance of a rigid waveguide while still providing the flexibility and size typically associated with a coaxial cable. Another demo showed both E-band and V-band flexible waveguides. Finally, Samtec did a joint demonstration presented with Otava, Rohde and Schwarz, Taoglas, and Avnet. Wideband 24-30 GHz 5G mmWave capabilities were being demonstrated by establishing an over-the-air communication link between two Otava Phased Array Antenna Modules (PAAMs). The modulated 5G FR2 signal is generated using a Rohde & Schwarz SMW200A vector signal generator which is sent to the transmitting PAAM. The receiving PAAM connects to a Rohde & Schwarz FSW43 Spectrum Analyzer where the signal is then demodulated and characterized. SMPM edge mount connectors are on the antenna in module (AIM) and SMPM surface mount connectors are on the combiner card. Inline bullet adaptors link the connectors on the AiMs and combiner card.

San-tron

San-tron is a Massachusetts-based, family-owned business with over six decades of experience. The have an extensive line of RF and microwave coaxial connectors and adapters, cable assemblies, along with what they call innovations in these areas. With these products, they target A&D, industrial and medical, space, telecommunication and test and measurement applications. At IMS, San-tron unveiled a new line of 1.85 mm field-replaceable connectors available in 3/8 in. and 1/2 in. square, 2-hole .550 in. flange and 2-hole .625 in. flange configurations for 0.009 in. launch pin diameters. Other mounting options are available upon request.  1.85mm connectors are also inter-mateable with 2.4 mm connectors. Typical VSWR performance is below 1.15:1 to 50 GHz and 1.25:1 to 65 GHz. These 1.85 mm connectors are made with gold-plated beryllium copper contacts, polyetherimide (PEI) capture bead and 303 stainless steel bodies. 

Signal Hound 

Signal Hound engineers debuted it's SP145 Spectrum Analyzer at booth 2049. The SP145 is specialized for accurate remote spectrum monitoring and analysis in a portable, durable format. It features 200 GHz/sec sweep speed, 40 MHz streaming bandwidth and -160 dBm displayed noise average. An included internal GPS adds a critical dimension of spectrum analysis when out in the field. It is USB-C powered for fast and accurate RF data acquisition in a continuously changing environment. With specific application toward field use, the SP145 excels at drive test, vector signal analysis, RF survey and even airborne measurement functionality. Additional features include Programmable API/SCIPI Automation and Real-Time Analysis.

Spectrum Control 

Spectrum Control introduced SCi Blocks™, a family of next-generation, digitally-enabled, plug-and-play RF solutions that address the size, cost, and open architecture requirements of emerging military/aerospace system designs. The open, modular, digitally-enabled products will be available in three distinct tiers – RF Systems-in-Packages (RFSiPs), RF “sticks,” and Sensor Open Systems Architecture (SOSA™)-aligned OpenVPX modules. Spectrum Control unveiled the first products in this new family. The ultra-miniature, high-performance, digitally tunable, wideband downconverters and upconverters are designed to deliver a new level of SWaP-C for electronic warfare (EW), signal intelligence (SIGINT), and Intelligence Surveillance and Reconnaissance (ISR) applications. The other introduction is an OpenVPX RF transceiver offering the full fidelity of RF signal handling with integral digital control and minimal interconnects to create a wide range of design and usage options. These new products deliver total spectrum awareness from 20 MHz to 18 GHz, for up to 16 GHz of contiguous spectral coverage with 2 GHz of instantaneous bandwidth. The integrated digital gateway offers a level of intelligence and connectivity unseen in traditional RF components, significantly reducing system engineering time. The digital gateway has a simple four-wire interface for command and control with health and temperature monitoring. The high-performance downconverter stick offers a gain of 25 dB and noise figure of 14-17 dB across the entire frequency range. Other specifications include third order intercept (IP3) of 25 dBm and single tone spurious of >/=60 dBc, as well as IF calibration features for optimum spectral performance.

SPINNER

SPINNER's passive RF product portfolio includes a wide range of products for test & measurement in R&D and production environments, rotating systems, broadcasting systems, anechoic chambers, 5G and 6G applications up to 150 GHz. Examples are compact and boxed calibration kits, verification kits, ruggedized test port adapters, planar/co-planar connectors, flexible dielectric waveguides, low-PIM switches and self-aligning quick connectors for automated production testing, adapters ranging from 75 Ohm to 50 Ohm and rotary joints. The company showcased new millimeter wave waveguide-to-coaxial adapters for the V-, E-, W- and F-bands (50 to 120 GHz). These products target applications in automotive and industrial radar sensors testing, satcom, 5G mmWave and 6G frequency bands. Different variants combining the waveguide interfaces WR10, WR12 and WR15 with coaxial connectors 1.0 mm and 1.35 mm are available. 

The company also featured a 1.35 mm E connector with performance from DC to 90 GHz. This product family was designed to address issues with unwanted unlocking of the 1.00 mm coaxial thread in time-consuming calibrations. This 1.35 mm E Connector is optimized for frequently used bands, allows thru-male“ design with multiple cables and prevents unintended opening of thread and coupling torque.

SV Microwave

SV Microwave had a variety of products samples such as the Collaborative VITA Kit Aligned to the Sensor Open Systems Architecture group (SOSA) Technical Standard™. SV Microwave offers VITA 67.1, VITA 67.2 and 67.3 RF connectors, contacts and cable assemblies. Designed for side-by-side implementation with other standards like VITA 46 and VITA 66, VITA 67 SMPM and SMPS interconnects are a high-density RF addition to the VPX platform. The interconnects are easy to install and feature cable assembly plug-in modules that mate to backplane connector modules. 

Tabor Electronics

At IMS, Tabor Electronics introduced the Lucid-X Series Microwave Signal Generators. The Lucid-X family of signal generators have 8 GHz, 20 GHz and 40 GHz frequency ranges. With phase noise of -120 dBc/Hz at 1 GHz (10 kHz offset), fast and high-resolution frequency switching, with +15 dBm of standard output power, these instruments outperform some of the market’s most challenging requirements. Built on Tabor’s modular technology platform, the LS-X family is available in PXIe, USB-module, rack, benchtop and portable form factors.

Tagore Technology

Tagore Technology was founded in January 2011 to pioneer GaN-on-silicon semiconductor technology for RF and power management applications. At IMS, Tagore announced the TSL8029N, a high-power receiver module with an integrated receiver protection switch and low noise amplifier in a single package. The receiver module is designed to address many of the challenges in 5G macro base station implementation. The company is a fabless semiconductor company with design centers in Arlington Heights, Illinois and Kolkata, India. The company focuses on wide bandgap technologies to address RF and power design challenges in 5G cellular infrastructure, consumer, automotive and defense and security applications.

TDK Corporation 

TDK had a variety of products from its portfolio of RF technologies, applicable for industries ranging from automotive, mobile, IoT, communications and industrial equipment at booth 1810. Products showcased included state-of-the-art LTCC and TFS antennas, filters, diplexers, triplexers, couplers, baluns and more. 

Tecdia Inc. 

Tecdia's exhibition at IMS2023 featured their crystal capacitor, boasting high Q, low capacitance values and SMT mounting compatibility that is ideal for high frequency RF applications. Its stable and efficient operation meets the growing demands of modern electronic devices. Also on display was the K4200 Dielectric, a compact yet powerful material can tolerate voltages of up to 200 V, reducing mounting area by an impressive 40 percent. With a permittivity of 4200 and X7R temperature characteristics, K4200 is a high DK material suitable for applications that require EIA class materials to be screened to MIL standards. Also, Tecdia announced the restricted release of its upcoming V Type Varactor, which has tested to have significantly higher Q and tuneability than the H-Series. The V Type Varactor is in its final stages of development.

Teledyne

Teledyne e2v HiRel announced the release of a new space COTS (Commercial-Off-The-Shelf) phase locked loop (PLL) designed to deliver exceptional performance and reliability in space applications. The TDPL97240 is packaged in a small, 7x7 mm, non-hermetic, epoxy sealed, ceramic quad, no-leads, (QFN) flat package that offers 75% board size reduction vs. the standard space grade ceramic part. It is radiation tolerant to 100 krad (Si) total ionizing dose (TID) and built on silicon-on-sapphire (SOS) technology. This gives the PLL natural radiation tolerance and immunity to single-event latch-up (SEL) effects. It also has a lock frequency range of 50 MHz - 5 GHz, dual modulus prescaler (5/6 & 10/11) for greater frequency flexibility and capability of either serial interface or direct pin programming.Times Microwave

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Times Microwave

Times Microwave was showcasing recent product examples of their broad portfolio of cables and assemblies, connectors, test and measurement products, tools and accessories and lightning protection and grounding products. The company supplies these products to a wide variety of commercial, defense and medical markets. 

West Bond

West Bond had their new 73KF Series Die Bonder on display, an excellent tool for meeting the challenging die attach applications found in the RF, microwave, semiconductor, hybrid and medical device fields. The 73KF Convertible Manual Die Bonder has a capacitive touch screen Interface and is designed with a gantry style chassis enabling virtually unlimited part size capacity. Their exclusive 8:1 ratio, purely orthogonal X-Y-Z micromanipulator allows the operator of the machine to place die with precision and ease.

WIN Semiconductors Corp.

WIN Semiconductors Corp. showcased its compound semiconductor RF and mmWave solutions in booth 235, with the commercial release of a 50 V 0.25 µm-gate RF GaN platform, NP25-20 and targets high performance front-end applications including radio access networks, satellite communications, electronic warfare and radar systems.

WIN also released their next-generation integrated mmWave GaAs platform, PQG3-0C. Targeting mmWave front-ends, the PQG3-0C technology combines individually optimized E-mode low noise and D-mode power pHEMTs to enable best-in-class power amplifier and low noise amplifier performance on the same chip.

Wireless Telecom Group

Wireless Telecom Group's test and measurement brands; Boonton, Holzworth, and Noisecom showcased their instruments in booth 1619. Boonton demonstrated fast-switching, low phase noise RF signal generation enabling accurate component characterization and testing of radar and communications systems. The measurement and analysis demonstration was made with Boonton's true average RF power sensors operating at a rate of 100,000 measurements per second. Higher-order modulation schemes, like those used in advanced communication systems, utilize signals with high peak-to-average power ratios that can strain amplifier performance. A demonstration featured the rapid identification of amplifier compression using crest factor measurements and statistical analysis from Boonton peak power sensor

Holzworth demonstrated broadband, low phase noise signal generation and real-time phase noise analysis, supporting the quick evaluation of a local oscillator’s performance and symbol error contributions in 5G and Wi-Fi communications systems. Noisecom programmable noise generators can produce highly controllable additive white Gaussian noise (AWGN) used to analyze system behavior when operating in real-world noise conditions, with results analyzed by industry-leading peak power sensors from Boonton

Wireless Telecom Group also presented a technical session in the IMS MicroApps theater entitled, “I Know I Need to Measure RF Power – Now What?” The seminar provided practical insight for measuring RF and microwave power, including different sensor technologies and architectures, as well as important sensor considerations to enable modern radar and communications system.

Wolfspeed

Wolfspeed was exhibiting in booth 1735 and they were big contributors to the overall IMS show. Company representatives participated in a workshop on using modeling, simulation and characterization to improve power RF performance on Monday and presented a paper on modeling GaN-on-SiC device building blocks on Tuesday. In addition, a Wednesday session on power amplifier architectures was dedicated to the late John Palmour, co-founder of Wolfspeed. Wolfspeed demonstrated the CMPA5259100S, a 100 W 50 V GaN MMIC HPA targeting radar applications in the 5.0-5.9 GHz frequency range with 25 dB of large signal gain. They also showcased the CMPA851A050S, an 80W HPA that utilizes Wolfspeed's 0.15 micron GaN-on-SiC process. This device operates from 8.5 - 10.5 GHz and supports both defense and commercial radar applications. Wolfspeed also highlighted the CMPA601J025F, a 25 W GaN-on-SiC MMIC using Wolfspeed's 0.15 micron process. The amplifier operates from 6 to 18 GHz and supports a variety of end applications like electronic warfare, test instrumentation, radar and general amplification. 

Xpeedic 

At IMS, Xpeedic unveiled RF Electronic Design Automation (EDA) Solution 2023 edition, showcasing its ability to accelerate the design of highly integrated RF modules and systems using its differentiating chip-package-system EDA tools and mass-production proven integrated passive devices (IPD) IP. The RF EDA Solution includes XDS, Xpeedic’s RF system-level design and simulation platform, IRIS, its on-chip passive modeling and simulation tool, and iModeler, a passive model generation tool.

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