SUSS MicroTec has shipped and successfully installed a 300 mm production lithography tool order at Amkor Technology Inc. Singapore. The deal includes a MA300Plus Full Field Exposure System and an ACS300Plus Coating Cluster, equipped with a special GYRSET cover technology that improves coating uniformity. Amkor selected the systems to commence its wafer bumping service in Singapore to support emerging applications on 300 mm wafers.
Amkor's senior vice general manager WLP operations, Daniel Teng, commented, "Recognizing both the increasing adoption of flip chip and wafer level packaging, and strong customer acceptance of our Unitive processes, Amkor is increasing wafer level processing capacity at multiple production sites in North America and Asia. This order is a direct result of our positive experience with SUSS MicroTec lithography tools, and fits our expansion needs perfectly. We also plan to install additional SUSS lithography systems at our factories in Taiwan and North Carolina."
Rolf Wolf, managing director of the SUSS MicroTec Lithography Division, stated, "Lithography for 300 mm wafer-level packaging and wafer bumping is quite different from that for other applications. The packaging process is extremely cost sensitive and requires nearly perfect yield with very thick photoresist and photopolymer layers. We are very pleased to be the lithography partner of choice to Amkor."