EDI CON China 2020, taking place May 13-14, 2020 at the China National Convention Center in Beijing, is accepting nominations for the third annual EDI CON Product Innovation Awards. The awards recognize the best of the best products on display at the annual exhibition.
EDI CON China brings together speakers, exhibitors and engineers who are focused on high frequency analog and high speed digital designs. The EDI CON Product Innovation Awards honor those products introduced in the last year that have had the greatest impact on the industry, providing the tools necessary to bring on the next generation of electronic design innovations.
Nominations are free and open to all EDI CON China 2020 exhibitors. Finalists will be announced in advance of the event and will be awarded with signage to display in their booth. Winners will be announced before the keynote address on the Main Stage on May 12, 2020.
Products must have been released to the market between January 1, 2019 and December 31, 2019. A panel of Microwave Journal and Signal Integrity Journal editors and EDI CON advisory board members will select up to 15 finalists, three in each category. The finalists will be featured in articles on Microwave Journal, Microwave Journal China and Signal Integrity Journal online and will receive signs for display in their booths at EDI CON China 2020. Entries are judged on exceptional innovation, including consideration of product functionality, ease of use, cost effectiveness and other factors.
- Test & Measurement
- Components, Cables, & Connectors
- Materials, PCBs and Packaging
Nominations are accepted through February 28, 2020 and are open to all EDI CON CHINA 2020 exhibitors. Submission information located here: http://bit.ly/AwardEDICON
Engineers interested in speaking at EDI CON China can submit a detailed abstract for consideration as part of the technical program by January 6.
More information, including instructions on how to submit an abstract and an application to exhibit, is available at www.ediconchina.com.