Sanan Integrated Circuit Co. Ltd. (Sanan IC) announces its entry into the North American, European and Asia Pacific (APAC) markets with its advanced III-V technology platform. With a broad portfolio of GaAs HBT, pHEMT, BiHEMT, integrated passive device (IPD), filters, GaN power HEMT, SiC and InP double HBT (DHBT) process technologies, Sanan covers a wide range of applications among today’s active microelectronics and photonics markets. Sanan IC is strongly focused on high performance, large scale and high quality III-V semiconductor manufacturing and on serving the RF, millimeter wave, power electronics and optical markets.

Founded in 2014 and headquartered in Xiamen City, in the Fujian province of south China, Sanan IC is a subsidiary of Sanan Optoelectronics Co. Ltd., the leading LED chip manufacturing company based on GaN and GaAs technologies. Leveraging high volume production and years of investment in numerous epitaxial wafer reactors by the parent company for LED lighting and solar photovoltaics, Sanan IC is expanding its market strategy beyond the greater China region as its process technologies and patent portfolio mature. Sanan's vision is to fulfill the needs of independent design manufacturers (IDM) and fabless design houses for high volume compound semiconductor fabrication.

As cellular mobility and wireless connectivity expands to the IoT and sub-6 GHz 5G extends to millimeter wave, III-V technologies will become more critical to support global infrastructure and client device deployments. According to Yole Développement, the GaAs wafer market, comprised of RF, photonics, photovoltaics and LEDs, is expected to grow to over 4 million units in 2023, with photonics having the highest growth at 37 percent compound annual growth rate (CAGR). GaN and SiC for power electronics — for data centers, electric vehicles (EV), battery chargers, power supplies, LiDAR and audio — are predicted to ramp, with GaN reaching up to $460 million in shipments by 2022, with a CAGR of 79 percent. SiC is projected to reach $1.4 billion by 2023, reflecting a 29 percent CAGR. Optical components continue to be in high demand for datacom, telecom, consumer, automotive and industrial markets, leading to increased revenues for photodectors, laser diodes and VCSELs, with expected shipments of $3.5 billion in 2023. As these applications emerge, Sanan IC is poised to support the industry’s needs.

“We see tremendous opportunity in serving the world-wide demand for large scale production of 6-inch III-V epitaxial wafers, driven by continual growth of the RF, millimeter wave, power electronics and optical markets. Our vertically integrated manufacturing services over our broad compound semiconductor technology platform, with in-house epitaxy and substrate capabilities, make us an ideal foundry partner. Given the capital investments made on state-of-the art equipment and facilities, with full support from our parent company, Sanan Optoelectronics, combined with strategic partnerships and a world-class team of scientists and technologists, Sanan IC is well positioned for success in this active compound semiconductor market.” — Raymond Cai, CEO of Sanan IC