TowerJazz announced a production ramp for its 65 nm, RF silicon on insulator (SOI) process running in its 300 mm fab in Uozu, Japan. TowerJazz has signed a contract with SOITEC, a long-term partner and leading semiconductor materials supplier, to guarantee a supply of tens of thousands of 300 mm SOI wafers with secure wafer prices for future years, to ensure supply to its customers despite a very tight SOI wafer market.
With best-in-class metrics, TowerJazz’s 65 nm RF SOI process enables the combination of low insertion loss and high power-handling RF switches, with options for high performance low noise amplifiers and digital integration. The process reduces losses in RF switches, improving battery life and boosting data rates in handsets and IoT terminals.
TowerJazz also announced its relationship with Maxscend, a provider of RF components and IoT integrated circuits ramping in this new RF SOI technology.
Zhihan Xu, Maxscend CEO, said, “We chose TowerJazz for its advanced technology capabilities and its ability to deliver in high volume while continuously innovating with a strong roadmap. We specifically selected its 300 mm, 65 nm RF SOI platform for our next-generation product line due to its superior performance, enabling low insertion loss and high-power handling.”
According to Mobile Experts LLC, a market research firm for mobile communications, the mobile RF front-end market is estimated to reach $22 billion in 2022, from an estimated $16 billion in 2018. TowerJazz’s RF SOI technology supports this high-growth market and is positioned to take advantage of next-generation 5G standards, which will boost data rates and provide further content growth opportunities.
Paul Boudre, SOITEC CEO, said, “We are delighted to see the strong adoption of 300 mm RF SOI through this large capacity and supply agreement with TowerJazz to augment our already significant 200 mm RF SOI partnership. TowerJazz was the first foundry to ramp our RFeSI products to high volume production in 200 mm and continues as one of the industry leaders in innovation in this exciting RF market, with advanced and differentiated offerings.”
Russell Ellwanger, TowerJazz Chief Executive Officer, said “We are thrilled about our continued partnership with Maxscend, as they bring breakthrough products to market, manufactured using our latest 300 mm 65 nm RF SOI platform. Also, we are very pleased with our SOITEC partnership to secure tens of thousands of 300 mm RF SOI wafers to feed the strong demand in our 300 mm Japan factory.”