Indium Corporation’s Brook Sandy-Smith, technical support engineer for PCB Assembly Materials, will present at the Electronic Design Innovation Conference (EDI CON) and Exhibition 2017, September 11-13 in Boston, Mass.
Sandy-Smith will present "Overcoming Assembly Challenges with Bottom Termination Components (BTCs)." This presentation will review the updated recommendations for design and implementation of BTCs, including major changes made to IPC-7093. Sandy-Smith will also share strategies to minimize voiding and ensure robust BTC assemblies.
Sandy-Smith is a technical support engineer specializing in printed circuit board assembly materials, particularly solder paste. She conducts application testing and qualifications for new product introductions. Sandy-Smith earned degrees in chemical engineering (with a focus on materials) and German language from the University of Rhode Island. She previously worked in R&D, developing conductive adhesives for die- and strap-attach, as well as conductive inks for RFID applications. Her areas of expertise include analytical testing of conductive materials, applications such as screen-printing and jet dispensing (jetting), as well as scale-up and pre-production of developmental materials.