For applications such as reconfigurable and phased array antennas that require density and performance, Integra Devices offers services and custom substrates that allow their customers to include 8, 12 and even 20 GHz relays embedded within the printed circut boards (PCB) and signal path.
This negates the need for complex I/O between the relays and other high frequency circuit elements, improving the overall circuit performance. Additionally, this technology allows for other elements to be mounted above the relay on the PCB, helping increase valuable real estate.
"This is groundbreaking technology that offers designers another toolbox to considerably increase the performance of their products. We are looking forward to working with our customers to help enable a new breed of solutions," commented Sourabh Dhillon, Business Development Manager at Integra Devices.