Carl Sheffres  Microwave Journal Publisher

We embark on the New Year with our traditional “Radar and Antennas” themed issue, highlighted by a cover feature contributed by MACOM and entitled, “Tile Arrays Accelerate the Evolution to Next-Generation Radar.” ADI furthers discussion on this topic with their technical feature “Digital Beamforming Accelerates the Evolution to Next-Generation Radar.” Keysight Technologies authors a special report on “Addressing the Challenges Facing IoT Adoption,” while the RF Energy Alliance discusses “The Challenges of SSRFE Design: Residential and Industrial Cooking Applications.” Rogers Corp. discusses “Opportunities for High Frequency Materials in 5G and the IoT” in their technical feature. You’ll find exciting advances on legacy technologies and continued coverage of emerging technologies in this issue, along with the latest industry news, products and event coverage.

You’ll also notice an updated look to the magazine, with new fonts and other subtle changes to enhance your reading pleasure. Watch for additional improvements to the print/digital edition in the coming months.

Speaking of changes, we’ll be rolling out a redesigned website early this year, with a new look and new features that can be easily viewed on all devices. This follows the launch of our Signal Integrity Journal website ( this past September. This unique site covers the Signal Integrity, Power Integrity and EMC/EMI world with the same high quality technical content that you’ve grown accustomed to from Microwave Journal. Industry icon Eric Bogatin leads a distinguished group of experts in directing this new venture. I encourage you to check out the site and Eric’s latest blog, entitled, “When Worlds Collide: Why RF Design Is Very Different from High-Speed Digital Design.”

SI and RF/microwave professionals checked out the debut of the Electronic Design Innovation Conference (EDI CON USA) this past September in Boston and found an impressive group of exhibitors and speakers during the three-day event. Mark your calendar for September 11-13 in Boston this year, where high frequency and high-speed design engineers will once again converge to learn, network and enjoy fall in New England.

The fifth annual EDI CON China event takes place April 25-27 in Shanghai, after a record-setting event in Beijing last year. Attendees will find over 100 exhibiting companies from China and around the globe, along with more than 100 technical sessions and workshops covering RF, microwave, EMC/EMI, radar and high-speed digital design topics. EDI CON has evolved to become the premier event for our industry in China and I encourage you to join the growing global audience of professionals.

European Microwave Week enjoyed record-setting attendance and its largest exhibition ever in its return to London in 2016. This year’s event takes place in Nuremberg, Germany on October 8-13, with paper submissions accepted through February 13.

Our video coverage of these events and many others continues to grow. You can view hundreds of videos by event or company on our website, providing product demos and tutorials at your convenience. You can also view the “Frequency Matters” series, the popular bi-weekly program covering the latest industry news and exclusive interviews with industry executives.

The RF/microwave community on LinkedIn continues to grow, topping 32,000 members and serving as a platform for discussion and networking. The signal and power integrity community has been launched to provide similar discourse for that sector.

Lastly, I ask you to take a few minutes to renew your subscription to Microwave Journal.  The publication is free, but you must renew each year for audit purposes and if you do so now, we won’t need to bother you later.

I hope that you had an enjoyable holiday season and wish you a prosperous and Happy New Year.