Peregrine Semiconductor Corp. announced from Mobile World Congress in Barcelona that the company is collaborating with Intel on the latest generation of its popular DuNE™ tuning technology offering for Intel’s LTE platform reference design. 

The tuning solution utilizes Peregrine’s third generation tuning products, which feature multidimensional tuning capabilities, for full coverage of the 41 available LTE bands. The solution introduces a monolithic full tuning network that integrates three DuNE Digitally Tunable Capacitors (DTCs), a MIPI serial interface, and all tuning functions in a single device. These functions include bias generation, integrated RF filtering and bypassing, control interface, and ESD protection. The solution eliminates the need for external components and circuitry that would otherwise be required in the LTE platform. It is the next step in Peregrine’s high-performance RFFE tuning product roadmap, which began with the Company’s firstgeneration discrete DTCs that launched in 2010.

“We are proud that Intel selected Peregrine’s unique tuning technology as the multidimensional antenna-tuning solution for this latest LTE platform,” said Jim Cable, Chief Executive Officer of Peregrine Semiconductor Corporation. “We worked closely with Intel to develop this highly-integrated solution, which utilizes the best of what our UltraCMOS process and DuNE innovations offer—optimized handset efficiency, data rate, call integrity, and battery life. This win demonstrates confidence in our RF Front End tuning solutions and in our ability to solve the broad, highly-complex challenges of 4G LTE designs.”

Stefan Wolff, vice president and general manager of Multi-Com for Intel’s Mobile and Communications Group continued, “The implementation of a highly-integrated RF Front End in support of the 4G LTE standard requires very high-performance, advanced RF components. Peregrine Semiconductor’s DuNE tuning technology addresses many important LTE requirements, such as broadband performance and tuning range, and it fully covers the Smith chart. Further, the device delivers the ideal combination of performance, small size, and integration that LTE chipsets demand.”