The Advanced Dielectric Division of Taconic will feature a variety of unique products that offer low loss and high reliability for conventional and multilayer RF and high speed digital board fabrication at the MTT-S International Microwave Symposium in Honolulu, HI June 5th – 7th. Taconic’s TacPreg prepregs, constructed with BT epoxy/woven fiberglass/PTFE components, offer reduced electrical loss and ease of fabrication for high speed digital and RF commercial and military applications. These dimensionally stable laminates, available with a Dk of 3.00 – 3.5, enable production of 20+ layer boards at FR-4 laminating temperatures and pressures. HyRelex thin flexible interconnect materials offer exceptional thermal, mechanical, electrical and moisture resistant properties for multilayer, double sided and rigid flex circuits. Low dissipation factor, excellent peel strength and smooth surface profile make HyRelex ideal for applications involving high frequencies, high temperatures and harsh environments. TSM-30, designed for consistent performance over broad temperatures and frequencies, offers the unique properties of both low loss and low moisture and solvent absorption. For heat dissipation in multilayer boards, Taconic’s heavy metal clad laminates provide thick layers of copper, brass and aluminum for reliability in temperature management. For nearly fifty years, Taconic has been an industry leader in the development of advanced engineered composite materials for the global marketplace. The Company offers a wide range of high frequency laminates and prepregs used for fabrication of antennas, multilayer RF and high speed digital boards, interconnections and devices. For more information regarding the Company’s high performance materials, please visit Taconic at IEEE MTT-S 2007 at the Hawaii Convention Center in Booth #1632 or visit the Taconic Advanced Dielectric Division website at