NI Week, the annual confab in Austin held by National Instruments, is an inspiring mix of new products, customer testimonials, LabVIEW developer conference and engineering geek out, blended with NI’s high energy enthusiasm and Austin’s “weird” charm. Here's a recap of this year's event.
Cadence Design Systems Inc. and NI announced a broad-ranging collaboration to improve the overall semiconductor development and test process for next-generation wireless, automotive and mobile ICs and modules.
NI announced the release of its InstrumentStudio software for NI PXI modular instruments. InstrumentStudio improves the live, interactive-use model for modular instruments and makes debugging while running tests more intuitive.
With the completed acquisition of optical simulation leader OPTIS, ANSYS now delivers the industry's most comprehensive solution for simulating autonomous vehicles. By adding OPTIS' optical sensor and closed-loop, real-time simulation to ANSYS's leading multiphysics portfolio, ANSYS offers the broadest toolset for validating the safety and reliability of autonomous vehicles — speeding time to market for these vehicles by mitigating the need for billions of miles of road testing.
Rescale and Remcom are pleased to announce that XFdtd®, Remcom’s electromagnetic (EM) simulation software, is now available on Rescale’s ScaleX platform for HPC in the cloud, allowing engineers to quickly and easily run complex, high-fidelity EM simulation models from any web browser.
EM-Supreme is used for EM modeling of power amplifiers, switches, filters, active antennas and complete RF modules such as antenna-switch, switch-filter, switch-filter-amplifier and front-end modules with no approximations
This NI AWR Design Environment(TM) white paper describes co-simulation capabilities of Visual System Simulator(TM) (VSS) system design software and LabVIEW, enabling system designers to better analyze, optimize, and verify complex RF systems inclusive of digital signal processing (DSP) blocks.
RF record and playback is an important method used to validate real-world GNSS (GPS, Galileo, GLONASS, and Beidou) systems. The sheer volume of data that these systems create necessitates being able to stream data to disk and analyze it later. Engineers and researchers are now recording and playing back real-world signals for all types of RF systems. They are simple to install and use and can be driven around in a vehicleâ??s trunk or backseat. These devices can record data including the exact location of a vehicle when important situations occur and precise weather and road conditions.
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductors dies, and other discrete components within a unifying substrate for use as a single component. This two-part white paper outlines the steps for implementing an integrated design flow within the AWR Microwave OfficeÂ® design environment for MMICs, MCMs and modules.Â Design flow considerations for both a GaAs PHEMT power amplifier design as well as for an MCM microwave monolithic integrated circuit (MMIC) design on a microwave laminate module are discussed.Â
The evolution of integrated circuit technology demands that designers in this field adapt to ever-changing manufacturing techniques driven by performance, cost, benefit, and risk demands. Today’s power amplifier (PA) designer working in solid state technologies must navigate a plethora of available processes, including gallium arsenide (GaAs), gallium nitride (GaN) and silicon carbide (SiC) pseudomorphic high electron mobility transistor (PHEMT), radio-frequency complementary metal oxide semiconductor (RF CMOS), and GaAs or silicon germanium (SiGe) heterojunction bipolar transistor (HBT), to name just a few. Similarly, different design challenges demand different amplifier classes and/or topologies like Class AB, Darlingtons, switch-mode PAs, and digital predistortion.
Traditional modeling methods such as rules of thumb and spreadsheet calculations (Friis equations) give limited insight on the full performance of an RF link in next-generation wireless products. This white paper highlights the advantages of using specialized RF system simulation software to accurately predict critical metrics for wireless RF links.
Optimizing a PA design for one parameter invariably requires sacrifi cing the
performance of another. This delicate balance between performance and
effi ciency is not the only conundrum, because designers of 4G PAs must also
contend with demands for greater instantaneous bandwidth. As a result,
designers of next-generation PAs are relying on simulation more than ever
before, and their tasks include frequency domain simulation, time domain
simulation, and now circuit envelope simulation.