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Items Tagged with 'space'
NASA’s Green Propellant Infusion Mission (GPIM) has been selected to test an advanced form of thermal insulation, called integrated multi-layer insulation (IMLI) that could become standard on future satellites and cryogenic subsystems. Validating this new insulation in space will help NASA build the technology required for long human spaceflight missions. Under a subcontract from Ball Aerospace & Technologies Corp., Quest Thermal Group LLC will manufacture the new insulation that will fly aboard the 2015 GPIM mission.
It's a bouncing baby . . . star! Combined observations from NASA's Spitzer Space Telescope and the newly completed Atacama Large Millimeter/submillimeter Array (ALMA) in Chile have revealed the throes of stellar birth as never before in the well-studied object known as HH 46/47.
Exelis successfully completed factory acceptance testing for the Global Positioning System (GPS) III navigation payload simulator software. Developed by Exelis, the software will simulate the behavior of GPS signals in space, which will be used for testing the U.S. Air Force's next generation GPS ground station known as the operational control system (OCX). The simulator will be integrated into the
Astrium has delivered the proto-flight model of the microwave radiometer to the prime contractor, Thales Alenia Space, for installation on the Sentinel-3A satellite.
BAE Systems’ new 45 nm ASICs for space environments pack ten times more functionality and performance into the same size as current chips, without adding significant power needs.
Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs), is receiving early reports from NASA’s Goddard Space Flight Center that its UltraCMOS®-based power management solution is delivering uninterrupted high performance while meeting the radiation-hardened and extreme-temperature requirements at the International Space Station.
Thales Alenia Spacehas signed a contract with Telespazio worth more than €120 million, within the scope of a contract for the supply of the European Geostationary Navigation Overlay Service (EGNOS) services.
Pulse Electronics Corp., a leading provider of electronic components, now announces in-house capability to integrate passive surface mount technology (SMT) components on 3D laser direct structuring (LDS) antennas. Incorporating SMT components with the 3D LDS antenna structure saves space on the mobile device's printed circuit board and optimizes the use of available space on the antenna.
It's not easy to simulate millions of miles electronically, but that's what engineers did recently as they tested the all-important communications system the MAVEN spacecraft will use to relay its study results from Mars orbit to Earth-bound researchers.
DiTom Microwave has received a contract from a major U.S. satellite manufacturing company for thermal vacuum (TVAC) compatible X- and Ka-Band isolators. Under the contract agreement, DiTom will supply ferrite isolators for the Wideband Global Satcom (WGS) program.