Laser Cutting Epoxy Film

The RF Microwave and microelectronics industry has been using epoxy film for circuit board attachment to carriers and housings for years as an effective method to achieve electrical ground plane and mechanical attachment requirements. Historically, the epoxy preforms have been die cut to match the circuit board layout, ensure critical tolerances are met, and aid in the assembly process. In recent years the advantage of laser cutting epoxy film has become widely accepted in the defense electronics, and commercial RF Microwave and microelectronics industries. This paper will discuss the basic fundamentals of laser cutting and the advantages over the die cutting process.

AR's Complete Product Catalog for EMC, Wireless & RF Testing

AR has completed another revision of our sought after full line product catalog. Many new products have been included and various sections were updated to provide you with the information required to make your equipment research more in depth. The catalog is easy to use, with "find-it-fast" charts and color coding to help get right to whatever you need for RF & EMC testing. Please contact your local AR sales associate for a hard copy or visit our website at www.arworld.us for a free download, either in full or by section.

Measurement of Harmonics Using Spectrum Analyzers

This Application Note focuses on measurement of harmonics using modern spectrum analyzers. It highlights the source of harmonics before focusing on their measurement using a spectrum analyzer. The Application Note also explains the benefits of the R&S FSW's high pass filter option for harmonic measurements.

Interaction of Intermodulation Products between DUT and Spectrum Analyzer

This white paper describes the interaction between intermodulation products generated by a device under test (DUT) and intermodulation products generated internally in a spectrum analyzer. The overall intermodulation distortion may be too optimistic or pessimistic. Examples demonstrating cancelling IM products and necessary steps to avoid an influence of the spectrum analyzer on the measurement results are outlined.

Troubleshooting EMI in Embedded Designs

Today, engineers need reliable data fast, and to ensure compliance with regulations for electromagnetic compatibility in the most economical way, appropriate measures must be taken early in the design phase. This paper provides a brief introduction to embedded EMI troubleshooting challenges and how to use a digital oscilloscope to debug the two key culprits of EMI - switching power supplies and power amplifiers.

Real-Time Analysis Techniques for Making Wireless Measurements

Today's complex, signal-rich systems and environments are challenging for RF engineers who are trying to bring advanced products to market quickly. Learn the strengths of using real-time spectrum analysis to measure the agile signals and sophisticated modulation schemes used in wireless. A companion application note is also available that explains how to go beyond making measurements to complete the solution using post-processing analysis, signal replay, and transfer of captured signals to other analysis or simulation tools.

Make the QuarterBack Your First Round Pick

In high frequency applications, consistent mating is required to ensure reliable performance. Generally, this means the use of threaded connectors which require torque wrenches causing problems in high density or hard to reach areas. Standard blind-mate connectors address this issue, but require demating tools that do not ensure a positive mate. The QuarterBack® family of connectors encompasses the best of blind-mate and threaded connector features. With minimal insertion forces due to incorporating the ease of a quarter turn bayonet style coupling nut, the QuarterBack® is the solution for your application.

High Power GaN Transistors in MACOM's Rugged Plastic Packages

This paper addresses a new lineup of high power GaN transistors from M/A-COM Technology Solutions (MACOM) in space-saving, rugged plastic packaging. These new GaN in plastic devices offer comparable reliability and are much lighter-weight than conventional ceramic-packaged GaN devices. By leveraging GaN's thermal, bandwidth and PAE advantages, in combination with MACOM's stringent thermal testing and small size, TRUE SMT™ plastic packaging techniques, these devices help system designers create a new generation of high power, ultra-compact, agile, rugged radar systems for use in traditional and next-generation fixed-installation and mobile radar applications.

Bringing Rapid Prototyping In-House

What follows is a review of two different ways to build prototype RF/microwave PCBs: through an outside PCB fabrication company and by investing in an in-house PCB milling machine. Hundreds of RF/microwave companies have invested in in-house rapid prototyping machines through a leap of faith in what they might mean to their companies, and have reaped the benefits. More fiscally conservative companies balk at such an investment, until they fully understand how it will impact the bottom line and help the company. The cost of a rapid prototyping machine can be considerable compared to the perceived low overhead cost of an outside PCB fabrication facility, but often overlooked are its advantages in terms of market-readiness, product performance, design flexibility, timing, and innovation.

RF and Microwave Fiber Optic Delay Line Techniques

Delay lines are used for developing, qualifying, and calibrating radar systems, radio altimeters, radios, feedforward amplifiers, telemetry and other systems. Traditional RF and microwave delay line technology required long, bulky, electrical transmission lines to delay electrical signals for a precise period of time. Flexible, coaxial cables are commonly used to produce the desired delay. Eastern OptX fiber-optic based systems overcome the disadvantages of the traditional techniques and provide stable broad-band performance in a rugged and compact system.