Master Bond formulates innovative, high quality epoxy adhesives, sealants, coatings and potting/encapsulation compounds for the RF and microwave industries. Each system is designed to meet specific application needs and requirements where electrical performance is critical. Compounds are formulated to be electrically conductive, thermally conductive and electrically insulative as needed. We also have formulations for effective shielding for EMI/RFI applications.
As the miniaturization of electronic devices expands, heat transfer capabilities become increasingly important. Master Bond adhesives offer superior heat transfer properties and low coefficient of thermal expansion for use in applications related to the microwave and RF industries.
Certain products include fillers (such as graphite, nickel and silver) which are used to enhance a variety of performance properties including non-magnetic properties, electrical conductivity, EMI/RFI shielding, electro static discharge (ESD), resistance to thermal cycling, low stress, low volume resistivity and more.
Established in 1976, today Master Bond formulates over 3,000 grades of epoxies, silicones, UV cures and other specialty adhesive systems. We offer a variety of standard and specialty packaging solutions to best meet your specific application. Our technical staff, with years of experience, will provide individual service to determine the best adhesive for your application.
Master Bond Inc. is a leading manufacturer of adhesives, sealants, coatings, potting and encapsulation compounds. We off er an extensive product line consisting of epoxies, silicones, light curing compounds, polysulfi des and other polymer systems for the electronic industry.Download
Thermally conductive adhesives and potting compounds are an important weapon in the war against heat raging within today’s powerful electronic devices. Master Bond’s line-up of thermal interface materials includes one- and two-component epoxies as well as silicones and solvent-based compounds.Download