Software EDA Channel - Press Releases, Events, and Announcements for the EDA Sector

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Remcom announced a new version of Wireless InSite® 3D Wireless Prediction Software with advanced capabilities including time-based mobility, lunar propagation modeling and wideband ray-tracing with S-parameter outputs.

COMSOL announced that the first stop of its worldwide COMSOL Conference 2025 tour will be held in Boston, Mass., on October 8–10. 

Pico Technology Ltd. has released PicoScope 7.1.50 Test & Measurement — the latest stable version of the software.

Maury Microwave announced the official launch of InsightPro^TM — their next-generation unified software suite designed to accelerate measurement and modeling workflows across R&D, design verification/validation and small-scale production. 

Siemens announced that it has completed the acquisition of Altair Engineering Inc.

Remcom announced the integration of XFdtd® 3D Electromagnetic Simulation Software with Wireless InSite® 3D Wireless Propagation Software through a new Huygens surface capability. 

COMSOL announced the release of COMSOL Multiphysics® version 6.3, which delivers new features and capability updates for efficient physics modeling and simulation app development.

Siemens is to buy U.S. engineering software firm Altair Engineering for $10.6 billion, strengthening its position in the growing market for industrial software.