Richardson RFPD Inc. announced its sponsorship of the Electronic Design Innovation Conference China (EDI CON) 2016 GaN Panel and Small Cell Workshop events. EDI CON China 2016 will be held from April 19-21 at the China National Convention Center in Beijing, China.
TE Connectivity (TE), a world leader in connectivity and sensors, announced its new CII FC-325 Series relay. Designed for harsh inductive, motor and lamp load applications within the aerospace, defense and marine markets, these hermetically sealed devices are excellent for extreme environments.
Antenova Ltd., manufacturer of antennas and RF antenna modules for M2M, has expanded its design and development facility in Taipei’s technology quarter Nei Hu District, Taiwan. This is in direct response to the increasing demand from customers for antennas for M2M and IoT applications.
NXP Semiconductors introduced the most powerful RF transistor in any technology operating at any frequency. Designed to deliver 1.50 kW CW at 50V, the MRF1K50H can reduce the number of transistors in high-power RF amplifiers, which decreases amplifier size and bill of materials. The MRF1K50H operates up to 500 MHz for a broad range of applications from laser and plasma sources to particle accelerators, industrial welding machines, radio and VHF TV broadcast transmitters, and amateur radio linear amplifiers.
Anritsu Co. and TRX Systems announce they have entered into a partnership whereby Anritsu’s industry leading handheld analyzers are integrated with a 3D Indoor Location and Mapping solution from TRX Systems to create the industry’s first automatically geo-referenced RF signal mapping solutions.
ABI Research, the leader in transformative technology innovation market intelligence, projects that mobile broadband operators will reap 5G revenues of $247 billion in 2025 with North America, Asia-Pacific, and Western Europe being the top markets. Specifically, network operators, vendors, and standards bodies will finalize technical details concerning the millimeter wave by 2020, with rollout ramping up afterward.
Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, and Peraso Technologies, a leading wireless chipset manufacturer, jointly announced their successful collaboration in developing a comprehensive test solution for Peraso’s recently-launched 60 GHz semiconductor products.
Broadcom Ltd. announced a new dual-channel 5GHz Wi-Fi access point platform designed to enable enterprise and public venue operators to optimize performance for all connected devices. The Broadcom® 5G-HD platform is built on the new BCM49408 quad-core CPU, enabling client devices that are 5GHz 11ac-capable to maintain the fastest possible speeds by eliminating performance degradation that occurs when slower client devices share traditional single channel 5GHz Wi-Fi access points.