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Freescale Semiconductor , a supplier of 802.15.4 chipsets, announced it has shipped more than seven million IEEE® 802.15.4 and ZigBee® units in 2008 for the wireless sensor networks used in smart energy, industrial control and home entertainment applications. A recent study by In-Stat, “802.15.4 – A New Sense of...

Laird Technologies Inc. , a designer and manufacturer of customized, performance-critical components for wireless systems and other advanced electronics applications, announced the availability of its new SM24513P3 Dual-band MIMO Internal Antenna. Specifically designed to enhance the latest generation of Wireless LAN (WLAN) technology systems, the SM24513P3 embedded antenna makes...

M/A-COM Technology Solutions Inc. , a provider of microwave and RF design solutions and products, announced the release of a new MESFET 50 to 1000 MHz Intermediate Frequency (IF) amplifier. The MAAM-009116 is a single-stage High Dynamic Range IF Amplifier in an industry standard SOT-89 package, ideally suited for...

Freescale Semiconductor has introduced its next generation of laterally diffused metal oxide semiconductor (LDMOS) RF power transistors to meet growing demand for reduced power consumption in cellular transmitters. Building on its legacy of RF power transistor leadership, Freescale’s eighth generation high voltage (HV8) RF Power LDMOS technology is engineered...

With 3G Long Term Evolution (LTE) fast becoming a global phenomenon, Aeroflex has announced that it is to dramatically accelerate the roll out of the major new features planned for 2009 for its recently launched Aeroflex 7100 Digital Radio Test Set for LTE mobile device test. “LTE is fast...

Herley Industries Inc. announced that it has received an option award exceeding $4.7 M to supply Tactical Instrument Landing Systems (TILS) for both the F/A-18E/F/G and E-2D Naval aircraft. The AN/ARA-63 TILS is a microwave landing system that provides precise elevation and azimuth guidance information necessary for critical aircraft...

RF Micro Devices Inc. (RFMD), a leader in the design and manufacture of high performance semiconductor components, announced the company's RF7168 dual-band GSM/GPRS transmit module (TxM) has been selected to support multiple MediaTek GSM/GPRS handset platforms based on MediaTek's MT6139 and Othello®-G transceivers. MediaTek is a provider of GSM/GPRS...

RF Micro Devices Inc. (RFMD), a leader in the design and manufacture of high performance semiconductor components, announced it is targeting the CDMA components market with the introduction of multiple compelling new CDMA front-end products. In calendar year 2009, RFMD® plans a major refresh of its CDMA product portfolio,...

The 50/50 joint venture that united the wireless semiconductor division of STMicroelectronics and the mobile platform division of Ericsson will move forward as ST-Ericsson . This announcement follows the recent closing of the agreement to merge Ericsson Mobile Platforms and ST-NXP Wireless. As a result, ST-Ericsson takes center-stage as...

MST.factory dortmund , a renowned center of competence for micro and nanotechnology based in Germany, has purchased the CB8 High Performance Wafer Bonder from SUSS MicroTec , a supplier of innovative process and testing solutions. The CB8 semi-automated 200 mm wafer bonder is being used by MST.factory dortmund to...