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An IFM Receiver on a Single PCB Anaren Microwave Inc. East Syracuse, NY Instantaneous frequency measurement (IFM) devices traditionally have been large, cumbersome assemblies comprising multiple PCBs with the RF sections, and analog and digital circuitry located on separate boards. This configuration is both complicated and costly, and results...

Ultraminiature, High Reliability RF Bypass Relays Teledyne Relays Hawthorne, CA Double-pole double-throw (DPDT) relays have long been used as the switching mechanism for applications such as attenuators, circuit and component bypassing and other specialized circuits such as selecting between unity and a preset amplifier gain. These applications are all...

Increased Speed and Performance from an RF VNA Hewlett-Packard Co. (HP), Microwave Instruments Division Santa Rosa, CA The introduction of the original model HP 8753A vector network analyzer (VNA) in 1986 marked the first offering of a compact VNA with an integrated synthesized source and comprehensive capabilities such as...

1998 Wireless/Portable by Design Exhibition Showcase S-Parameter Disk American Technical Ceramics (ATC) Wireless Exhibition      633, 635 This new S-Parameter disk contains files with two-port descriptions for the company's multilayer capacitors. Each S-Parameter file corresponds to a specific capacitance value within a given series. All files are in a...

1998 Wireless Symposium/Portable by Design Show Guide Following is a listing of the workshops and papers composing the technical program of the 1998 Wireless Symposium & Exhibition, sponsored by Microwaves & RF and Wireless Systems Design magazines, to be held February 9–13 in Santa Clara, CA. A listing of...

1998 Wireless/Portable by Design Exhibitor List Following is a listing of booth numbers of companies that will be displaying products and services at the Wireless and Portable by Design exhibitions. The list is complete as of press time but may not include all companies. AARID Thermal Technologies 2016 Advanced...

An AlGaAs/GaAs HBT PA-LNA Transceiver MMIC Chip for 1.9 GHz PHS Digital Cordless Telephones The first results of a GaAs heterojunction bipolar transistor (HBT) power amplifier (PA)-low noise amplifier (LNA) integrated MMIC transceiver, developed for the Japanese 1.9 GHz personal handyphone system (PHS) digital cordless telephone, are reported. The...

A Review of the 1997 Wireless Workshop Frank Bashore Microwave Journal Staff The 1997 Wireless Workshop was held October 26–29 to serve as a technical forum for approximately 85 engineering and technical representatives of leading companies involved in the design and manufacturing of materials and circuits for today's wireless...

A Quadrafilar Helical Antenna for Low Elevation GPS Applications This article presents a low cost implementation of a quadrafilar helical antenna for Global Positioning System (GPS) applications. The antenna is designed to produce a right-hand circularly polarized (RHCP), elevated omnidirectional radiation pattern with constant azimuth gain at low elevation...

Ball Grid Arrays: A DC to 31.5 GHz Low Cost Packaging Solution for Microwave and mm-wave MMICs The VIA/PAK™ ball grid array (VBGA) surface-mount packaging technology for high frequency RF and mm-wave applications is described in this article. The package was developed for the frequency range from DC to...