RF & Microwave Industry News

Hesse & Knipps to demo new 3 mil wire bonding capability at IMAPS 2012

Hesse & Knipps Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, leading manufacturer of high speed fine pitch wedge bonders and heavy wire bonders for the backend semiconductor industry, will demo a new 3 mil wire bonding capability on its BJ935 Fully Automatic Heavy Wire Bonder at the upcoming 45th International Symposium on Microelectronics (IMAPS) in Booth No. 210.


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Anaren Receives Contracts in Excess of $11.5 Million

Anaren, Inc. announced today that it has received three contracts totaling in excess of $11.5 million in follow-on orders for passive ranging subsystems to be deployed in airborne applications. These orders from a Defense OEM customer are related to a continuing long-term supply agreement for both domestic and international applications of Anaren's proprietary electronic warfare technology.


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