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RF Micro Devices Inc. (RFMD), a leader in the design and manufacture of high-performance RF components and compound semiconductor technologies, announced the industry’s first 1.2 GHz broadband transmission products, enabling enhanced, bandwidth-driven services for CATV operators and their subscribers. The new products provide options for cable operators to upgrade...

Microwave Innovation Group's (MiG) WASP-NET® combines unparalleled efficiency now with unlimited flexibility. WASP-NET version 8.0 features convenient 3D data file import and 3D structure editors, by which users can create arbitrary, user-defined geometries. WASP-NET’s unique hybrid MM/FE/MoM/FD CAD engine yields EM CAD precision in seconds for general 3D microwave...

CMOS power amplifiers (PA) are prevalent in today's WiFi and Bluetooth markets, yet extensive industry-wide development efforts for CMOS PAs for 2G and 3G mobile handsets have so far failed to yield a product that met the performance of incumbent GaAs PAs. However, a new CMOS PA from Javelin...

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Aeroflex Test Solutions and 7 layers have signed an agreement to provide LTE testing services in support of the commercialization of LTE mobile phone networks in Japan. Aeroflex will install its 7100 LTE digital radio test set in the 7 layers’ laboratory in Yokohama, Japan, greatly expanding the company’s...

BAE Systems has opened its new engineering hub in Melbourne, Australia, that will integrate the company’s aerospace, autonomous systems and guided weapons research into a single facility. The new engineering centre on River Boulevard, at Richmond, will accommodate more than 300 employees. The company will initially lease approximately 3000...

NEC Corp. has been selected as the development and manufacturing vendor for NTT DOCOMO Inc. 's 1.5 GHz remote radio equipment (RRE) for LTE base stations. The company’s RRE provide a compact and low electricity consumption solution by adopting a specially developed miniature low-loss dielectric filter and a high...

Infineon Technologies and Fairchild Semiconductor have announced a packaging partnership for their power MOSFETs in the Infineon PowerStage 3x3 or Fairchild MLP 3x3 (Power33™) packages. The compatibility agreement is in response to the need for supply security while balancing the drive towards best-in-class efficiency and thermal performance in DC-DC...

The comprehensive LYNX 311 series of waveguide-to-coaxial adaptors is available from RF and microwave component specialist Link Microtek . The adaptors are aimed at engineers looking to source competitively priced, non-ITAR products for their microwave system designs. The waveguide-to-coaxial adaptors are available in rectangular waveguide sizes from WR137 to...

“Despite ash clouds over Europe, handset shipments globally for 1Q-2010 powered ahead to 303 million, up 19 percent Year-on-Year,” said Jake Saunders, VP for Forecasting at ABI Research. “This bodes well for 2010 as a whole; shipments could well reach 1.3 billion. It is also notable that 3G handset...