Computer Simulation Technology AG (CST) and Optenni Ltd (Optenni) are collaborating to provide engineers with design tools for MIMO antenna optimization. These tools for multiport matching will be demonstrated at European Microwave Week (EuMW) 2013, booth #103, and in a free webinar on October 24.
CST STUDIO SUITE® 2013 introduced several new features – most notably, the new ribbon-based interface. The company is pleased to say that customer feedback has been positive, and their comments steered the development of Service Pack 3, which is currently being distributed through the Automatic Update System.
Anritsu Co. introduces Wireless Remote Tools for its touchscreen PIM Master™, Site Master™, Spectrum Master™, and VNA Master™ handheld instruments. With the software installed, field technicians and engineers can remotely view screens and control the industry-leading field instruments using a Windows™-based laptop, PC or tablet, simplifying the deployment, installation, and maintenance of 2G/3G/4G wireless networks.
COMSOL Inc., the leader in multiphysics simulation software, announced the release of major new additions to the COMSOL simulation platform. The latest version of COMSOL Multiphysics, version 4.3b, introduces five new application-specific modules and expanded modeling and analysis tools. Release highlights are available at www.comsol.com/4.3b.
CST announces that shipping has begun for CST STUDIO SUITE® 2013, the latest version of their flagship product. CST STUDIO SUITE comprises a range of EM simulation tools, including the industry-leading high-frequency package CST MICROWAVE STUDIO®.
Anritsu Co. introduces multi-band receivers for its Link Master drive test tools that offer field engineers, technicians and consultants a complete drive test system for locating interference and ensuring optimum wireless network operation.
UBM Tech, whose portfolio includes essential business and technical information for design engineers and the electronics industry, announced the 2013 DesignVision Award winners, including industry firms Mentor Graphics, TE Connectivity, ANSYS Inc., Upverter, MicroSemi, Teledyne LeCroy and Averna.