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Articles Tagged with ''assembly''

EMC Technology debuts 150 W AlN SMT termination

January 18, 2012
EMC Technology has added another SMT termination to its broad line of surface-mount products.
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Rogers to highlight material solutions spanning RF to digital at the 2012 IPC Midwest Show

August 8, 2012

Rogers Corp. will have a strong presence at the upcoming IPC Midwest Exhibition and Conference, both on the show floor and as part of the technical conference. This key industry event is scheduled for August 22-23 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL, the IPC Midwest Exhibition and Conference (www.ipcmidwestshow.org) is for electronic circuit assembly and printed-circuit-board (PCB) manufacturing professionals.


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SemiGen showcasing PCB assembly capabilities at SMTA

October 9, 2012

SemiGen Inc., (www.semigen.net), an ISO and ITAR certified RF/Microwave assembly and automated PCB manufacturing company, has announced that they will be exhibiting at the SMTA International Conference in Orlando, Florida, October 14th-18th in Booth #251.


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SemiGen acquires 50 GHz network analyzer to improve testing capabilities

November 6, 2012

SemiGen Inc., (www.semigen.net), an ISO and ITAR certified RF/Microwave assembly and automated PCB manufacturing company, has announced that they have purchased a new Agilent 50 GHz PNA network analyzer to augment their RF/Microwave test lab.


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Maury Microwave launches low-profile and TVAC Stability cable assemblies

November 30, 2012

Maury Microwave announces the expansion of its Stability™ family of amplitude- and phase-stable cable assemblies to include Low-Profile (-LP) and Thermal Vacuum (-TVAC) models.


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RFMD introduces 5 GHz WiFi Module for 802.11ac notebooks/mobile equipment

January 7, 2013

RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency components, introduced the highly-integrated RFFM4501E front end module (FEM) for 802.11ac notebook and mobile equipment applications. RFMD's newest WiFi FEM meets or exceeds the system requirements for 802.11ac connectivity in the 5.150GHz — 5.850GHz frequency band and is optimized to support multiple applications, including notebooks, mobile routers, and low-power customer premises systems.


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Photo Stencil to present two papers at IPC APEX 2013

January 30, 2013

Photo Stencil LLC, a leading full-service provider of high-performance stencils and tooling, will present the papers, Printing and Assembly Challenges for QFN Devices and Two Print Stencils Process at IPC APEX 2013. Videos of the presenters describing these papers can be found at www.photostencil.com/apex2013.php.


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Combilent USA announces opening of U.S. facility

March 8, 2013

COMBILENT USA announces the opening of our U.S. facility in the Chicago area to support OEM customers and their channel partners.  The facility is fully operational with distribution, testing, and assembly capabilities.


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Florida RF Labs introduces Lab-Flex AF for harsh environments

May 1, 2013

Lab-Flex® AF, a modified version of the popular Lab-Flex series is now available from Florida RF Labs. This new family of cables has been enhanced to perform in typical harsh environments associated with airborne, shipboard and ground-based applications. Florida RF Labs proprietary cable assembly design utilizes a redundant sealing system to prevent water ingress in both cable and connector interfaces and it employs a very durable dielectric design which is able to withstand crushing or kinking.


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