- Buyers Guide
Articles Tagged with ''assembly''
Rogers Corp. will be promoting its industry-leading printed circuit board (PCB) materials at the IPC APEX EXPO, being held March 25-27, 2014 at the Mandalay Bay Resort & Convention Center (Las Vegas, NV). The IPC APEX EXPO, with more than 400 exhibiting companies and thousands of attendees, is a leading industry event for professionals involved in PCB design and manufacturing and electronic assembly and test.
San-tron Inc., a leading manufacturer of RF coaxial connectors and cable assemblies, has announced that they have rehired Vincent Caputo as senior product line manager for Cable Assemblies. Caputo brings over 16 years of RF/microwave experience to the position and first came to San-ton as a sales associate in 2004, and more recently served as eastern regional sales manager.
Indium Corp. announces that Glen Thomas has been named product manager for PCB assembly solder paste.
Indium Corp. was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.
Indium Corp. introduces a new, high-reliability, low-voiding flux coating for solder preforms. LV1000 reduces false failures while increasing productivity, throughput yields, and component performance. This new halide-free (ROL0) material is especially suited for assembly processes in which the components don’t allow for proper outgassing of volatized flux.
Isola Group S.à.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs), announced TerraGreen, the company’s new halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations, internet infrastructure and cloud computing.
M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, today announced the newest entry in its portfolio of GaN in Plastic packaged power products. Optimized for L-Band commercial air traffic control, military radar, and long range perimeter monitoring applications at 1.2 to 1.4 GHz, MACOM’s new 2-stage, fully matched GaN in Plastic power module scales to peak pulse power levels of 100W in a 14 x 24 mm package size – delivering twice the power of comparably sized competing products.
RFMD, a global leader in the design and manufacture of high-performance radio frequency solutions, announced it has successfully completed a recently announced expansion of its test, tape and reel, and assembly facility, located in
San-tron Inc., a leading RF coaxial connector and cable assembly manufacturer, announces a video describing the features of its high-performance eSMATM connector line.
Fox Electronics, a leading global supplier of frequency control solutions and an IDT company, now offers the FTM Series of surface mount OCXOs that is ideally suited as the timing reference for network synchronization.