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Articles Tagged with ''technology''

Intercept Technology intros the next level in design reuse: virtual blocks

Software/EDA

Intercept Technology Inc., a leading provider of PCB, RF, Hybrid, and high-speed design software, recently released a version of its Mozaix schematic design software that no longer requires top level sheets and block symbols to build hierarchy in a schematic. 


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Dr. Song Junde to give keynote speech at EDI CON 2014 as conference chairman emeritus

EDI CON 2014 has announced that Dr. Song Junde, professor at the Beijing University of Posts and Telecommunications, will serve as the chairman emeritus of the second annual technical conference and trade exposition focused on RF, microwave and high-speed digital design. Junde, who held the role of honorary chair for the inaugural EDI CON in March of 2013, will once again provide guidance to the event organizers and technical program planning committee in the development of a technical conference focused on advancing microwave technology and the communications industry in China. 


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Boeing transmits protected government signal through military satellite

Boeing has applied new anti-jamming technology to an existing military satellite for the first time, expanding the military's potential to access secure communications more affordably.


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EJL Wireless Research announces its 2014 predictions for wireless RAN technology

EJL Wireless Research is unveiling its predictions for wireless RAN technology for 2014 in a new white paper.


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CEA-Leti signs agreement with Qualcomm to assess sequential 3D technology

CEA-Leti announced an agreement with Qualcomm Technologies Inc., a subsidiary of Qualcomm Inc., to assess the feasibility and the value of Leti’s sequential 3D technology.


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DARPA selects Rockwell Collins to develop prototype for next gen SDRs

Aerospace & Defense

A Rockwell Collins receiverRockwell Collins has been selected by the Defense Advanced Research Projects Agency to develop a direct conversion digital receiver based on photonic technology. The three-year contract for the DISARMER program is valued up to $8.5 million.


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Ball Aerospace Green Propellant Mission to test new thermal insulation

NASA’s Green Propellant Infusion Mission (GPIM) has been selected to test an advanced form of thermal insulation, called integrated multi-layer insulation (IMLI) that could become standard on future satellites and cryogenic subsystems. Validating this new insulation in space will help NASA build the technology required for long human spaceflight missions. Under a subcontract from Ball Aerospace & Technologies Corp., Quest Thermal Group LLC will manufacture the new insulation that will fly aboard the 2015 GPIM mission.


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FCC seeks comment on IEEE-USA petition for spectrum to spur new technologies

The Federal Communications Commission is soliciting public comments on an IEEE-USA petition asking the federal government to classify frequency spectrum above 95 GHz as “a new technology or service.”


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High-tech tractors cultivate a sustainable future

The face of traditional farming is rapidly changing to incorporate sophisticated technologies aimed at producing more food with less environmental impact. To support the influx of technology, product development firm Cambridge Consultants is using its expertise to design innovative, low-cost solutions for the farming industry. Its latest device draws on its background in advanced radar technology for a detection system to help agricultural vehicles avoid collisions.


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Peregrine and GLOBALFOUNDRIES collaborate to advance RF SOI technology

Peregrine Semiconductor Corp., founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, and GLOBALFOUNDRIES, a leading provider of semiconductor manufacturing technology, are sampling the first RF Switches built on Peregrine’s new UltraCMOS 10 RF SOI technologies. This partnership unites Peregrine’s 25 years of RF SOI experience with a tier-one foundry.


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