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Industry News / Semiconductors / Integrated Circuits / Test and Measurement

e2v Launches Assembly and Test Services for Semiconductors

January 11, 2010
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e2v, a designer and manufacturer of specialized semiconductor components, has launched a complete semiconductor Assembly and Test service dedicated to the high-end electronics industry. From material sourcing and package development through high reliability manufacturing, test and ultimately obsolescence management, the new assembly and test capability is geared to support the manufacture of products for 20 years or more.

The facility is made up of a 600 m2 Class 100 clean room, wafer probe low/high temperature handlers/probes (-55° to +200°C), legacy IC and state-of-the-art digital and RF IC and mixed signal IC automatic test equipment (ATE), for packaged IC testing over extended temperatures (-55° to +150°C), and the largest capacity IC burn-in chambers in Europe.

Coupled with this extensive ‘in-house’ assembly and test facility, e2v provides package development (design, thermal, electric simulation and test), package assembly, including hermetic, ceramic packages (DIL, CHIP-CARRIER, CPGA, CQFP, CBGA), Hi-TCE Flip-Chip assembly on ceramic substrate (CBGA) and Multi-chip modules. Assembly and manufacturing capabilities include automated die and component pick-and-place, gold and aluminum wire bonding, automated epoxy attach, reflow ovens and x-ray analysis.

The Assembly and Test services are certified to MIL-PRF-38535 QML level Q and V, and the AS/EN9100 aerospace standard; providing best-in-class manufacturing capability to support a wide range of high reliability applications such as space payloads and platforms, military rugged computers, radar, avionics, flight computers and engine control; alongside industrial applications including transportation, down-hole drilling and industrial computers.

Applications include multi-year programs secured through e2v’s ability to offer an obsolescence management program incorporating long-term semiconductor die availability (die banking to 10 years and more), foundry transfer and product re-engineering options, and the resources to commit to long-term availability of ATE and IC test programs. Specific screening requests can also be accommodated.


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