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Almost every manufacturing process and product design must consider the effect of thermal fluctuations. The Heat Transfer Module provides a combination of simulation capabilities to model heat transfer via conduction, convection, and radiation, as well as the ability to couple these to other physics.
The Heat Transfer Module has modeling interfaces that are specifically written for the user interested in free and forced convection, process design, phase change modeling, radiative heat transfer through both transparent and semi-transparent participating media, as well as couplings between all of these effects. Specialized formulations are included for users who are interested in the heating of living tissue. With boundary conditions for describing convective and radiative effects, contact resistance, as well as thin highly-conductive shells, you can simulate anything from a simple "back of the envelope" model to a full model with all effects explicitly described.
Since all material properties are functions of temperature, you can conceivably couple a thermal model to any other physical model, while COMSOL also allows you to include heat generation from any other physics into a thermal model.
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