Items Tagged with 'heavy'

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Hesse Mechatronics to demonstrate wedge wire bonding capabilities at Productronica

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.


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Hesse launches heavy wire and ribbon bonding services for product development

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder.


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Hesse & Knipps to demo new 3 mil wire bonding capability at IMAPS 2012

Hesse & Knipps Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, leading manufacturer of high speed fine pitch wedge bonders and heavy wire bonders for the backend semiconductor industry, will demo a new 3 mil wire bonding capability on its BJ935 Fully Automatic Heavy Wire Bonder at the upcoming 45th International Symposium on Microelectronics (IMAPS) in Booth No. 210.


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