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Northrop Grumman Corporation and Rohde & Schwarz signed a Memorandum of Understanding (MOU) at the Berlin Security Conference in Germany to collaborate on turn-key solutions for 5th-to-4th generation interoperability.
ATIS’ Next G Alliance and the Bharat 6G Alliance announced they have signed a memorandum of understanding (MoU) to explore collaboration opportunities on 6G wireless technologies.
Infineon Technologies AG and Delta Electronics, Inc. signed a Memorandum of Understanding to provide more efficient and higher-density solutions for the fast-growing market of electric vehicles.
Keysight Technologies, Inc. has announced it has signed a memorandum of understanding (MoU) with Analog Devices, Inc. (ADI) to advance 6G technology design and development.
Babcock has signed a Memorandum of Understanding (MoU) with Israel Aerospace Industries’ (IAI) Group and subsidiary ELTA Systems to provide a deep-find radar solution for the UK Ministry of Defence’s SERPENS programme.
ATIS’ Next G Alliance and the 6G Smart Networks and Services Industry Association announced they have signed a MoU to exchange information regarding their work programs in areas of mutual interest in the field of 6G communication systems and networks.
STMicroelectronics and GlobalFoundries Inc announced they have signed a Memorandum of Understanding to create a new, jointly operated 300 mm semiconductor manufacturing facility.
Sivers Semiconductors AB announced that the company’s future subsidiary MixComm has signed a MoU with the South Korean venture company Kreemo to develop the world's first 5G module optimized for metaverse.