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Tower Semiconductor and Teramount announced a collaboration based on Teramount's ‘PhotonicPlug’ technology and Tower’s silicon photonic ‘Bump-ready’ wafers.
Optoelectronic industry designers have traditionally used discrete optical devices for transceiver designs. The process requires manual integration of discrete free-space optical components such as lasers, modulator, photo detectors, isolators, MUX/DE-MUX, lenses in the form of optical gold box sub-assemblies such as transmit optical sub-assembly (TOSA).
University of Glasgow engineers have scaled up the established processes for making flexible silicon chips to the size required for delivering high-performance bendable systems.
Analog Devices Inc. (ADI) introduced a high power (44 W peak) single-pole, double-throw (SPDT) silicon switch that enables designers to reduce hardware size and bias power consumption in cellular radio systems.
MACOM Technology Solutions Inc. (MACOM) will showcase its industry leading GaN on Silicon portfolio and other high-performance products at IEEE’s International Microwave Symposium (IMS) 2016 in San Francisco, Calif., May 24 - 26. MACOM’s booth will feature new product solutions optimized for commercial, industrial, scientific and medical RF applications.
Coupling Wave Solutions S.A. (CWS), a leader in solutions for interference analysis in complex chip designs incorporating RF and analog blocks, announced the availability of a new productivity tool called SiPEX. SiPEX models the silicon substrate on insulators much faster than any other tools in its class and allows radio frequency (RF) silicon-on-insulator (SOI) designers to increase the number of design iterations—including spice simulation—up to 10 times in the same time frame.
Advancing semiconductor technology, X-FAB Silicon Foundries is putting itself at the vanguard of wideband gap semiconductor production by announcing the availability of its silicon carbide (SiC) offering from its wafer fab in Lubbock, Texas.
Keysight Technologies Inc., in collaboration with The University of California San Diego (UCSD), has demonstrated the world’s first 64 (8 x 8) and 256-element (16 x 16), 60 GHz silicon wafer-scale phased-array transmitter with integrated high-efficiency antennas for Gbps communications at 100 to 200 meters.
Analog Devices Inc. (ADI) introduced a high power (44 W peak) single-pole, double-throw (SPDT) silicon switch that enables designers to reduce hardware size and bias power consumption in cellular radio systems.
Advancing semiconductor technology, X-FAB Silicon Foundries is putting itself at the vanguard of wideband gap semiconductor production by announcing the availability of its silicon carbide (SiC) offering from its wafer fab in Lubbock, Texas.
Keysight Technologies Inc., in collaboration with The University of California San Diego (UCSD), has demonstrated the world’s first 64 (8 x 8) and 256-element (16 x 16), 60 GHz silicon wafer-scale phased-array transmitter with integrated high-efficiency antennas for Gbps communications at 100 to 200 meters.