Co-developed by Yole Développement & CITC

Packaging technologies are expanding the boundaries of RF and power applications

Yole Développement, a renowned market research company, and CITC, an innovation center with extensive technical and market experience, invite you to take part in two collaborative online forums covering power packaging and RF packaging. Challenges have emerged for both applications concerning the integration of devices and systems – and to ensure these applications’ continued evolution and activity development, packaging is the strategic answer.

With increased functionalities, companies must refine their ability to integrate more and more components on the same die while proposing an exceptionally reliable final product.

More information, full program and registration: https://www.i-micronews.com/event/power-and-rf-packaging-virtual-forums-by-yole-developpement-and-citc?utm_source=Partner&utm_medium=email&utm_campaign=MicrowaveJournal_CITC_YOLE_Q4-2020