Six Sigma Microelectronics has been performing Column Attach services since 1998 and has attached over 150 million solder columns for aerospace applications. Six Sigma Micro is the column attach supplier for the majority of domestic FPGA and ASIC manufacturers used in space applications. For over 25 years, Six Sigma Micro has also been the near-sole supplier for solder columns on PowerPCs for numerous non-space applications such as M1A2 tanks, F-16’s, F-18’s, TOW missiles, UAVs, etc. Six Sigma Microelectronics has been performing Ball Attach and Reballing services since 1997 and has processed over 3 million BGA devices. Six Sigma Micro offers three methods of BGA reballing based on volume: Pre-form Method (Low-volume), Tooling Method (Mid-volume), and Automated Method (High-volume). Six Sigma Micro can also reball different solder alloy compositions: Sn63-Pb37, Sn10-Pb90, Pb-free (SAC305, SAC105, SAC405), specialty alloys typically provided by the customer (SACX), etc. Six Sigma Microelectronics is the industry leader in hot solder dipping of devices. This method is used to change the termination finish of devices from lead-containing to lead-free or vice versa. It is currently one of the strategies being used to mitigate tin whiskers, which can form when pure tin plating is used.