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Pasternack has introduced a new line of solderless vertical launch connectors that are ideal for high speed networking, high speed computing and telecommunications applications.

Everything RF has released BuildBot.io, a website platform developed to build powerful websites for electronic component manufacturers.

Rohde & Schwarz is a partner in the Providentia research project on the “proactive video-based use of telecommunications technologies in innovative highway scenario.” 

Cliff Electronics has added a panel mounting BNC connector with a molded plastic body to its very popular range of FeedThrough (FT) connectors.

TANAKA Precious Metals announced that it has invented new packaging to increase the storage life of Power Bonding Wire.

Anritsu Co. introduces two software packages (MX887019A and MV887019A) for its Universal Wireless Test Set MT8870A to support 3GPP-compliant tests on 5G sub-6 GHz New Radio (NR) chipsets, devices and systems.

Barry Industries announces the introduction of a RoHS-compliant flange mount RF termination especially suited for 5800 MHz industrial, scientific and medical (ISM) applications.

pSemi Corp., formerly Peregrine Semiconductor and a Murata company, introduces the world’s first monolithic SOI, 2.4 GHz Wi-Fi front-end module — the PE561221.

Pentek, Inc. introduced a system on a module for high performance signal processing applications. The model 6001 Quartz eXpress Module (QuartzXM™) uses the Xilinx Zynq UltraScale+ RF system on a chip FPGA, adding all external circuitry to maximize the performance of the RFSoC.

China Mobile Hong Kong is the first network provider in Hong Kong to successfully complete end-to-end 5G network testing (client terminal to application).