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The breakthrough MAX77655 single-inductor multiple output (SIMO) power management IC (PMIC) from Maxim Integrated Products, Inc. provides the highest density power solution for extremely compact next-generation devices.
The LoRa Alliance® announced the release of Regional Parameters RP2-1.0.2, which includes support for all versions of the LoRaWAN® Layer 2 Specification.
The LoRa Alliance®, the global association of companies backing the open LoRaWAN® standard for internet of things (IoT) low-power wide-area networks (LPWANs), announced that it published the LoRaWAN TS1-1.0.4 Link Layer (L2) Specification.
EvoNexus and GLOBALFOUNDRIES® (GF®) announced their collaboration to accelerate the growth of semiconductor startups developing breakthrough products in wireless and the Internet of Things (IoT).
NXP Semiconductors has introduced two ultra-wideband ICs for IoT applications requiring fine range, high precision location sensing, such as smart locks and real-time location system tags.
NXP Semiconductors N.V. announced its family of 2x2 Wi-Fi 6 (802.11ax) Dual Band + Bluetooth/BLE solutions that are driving a new phase of connectivity innovation for advanced gaming, audio, industrial and IoT markets.
Insight SIP is launching the 1907-HT RF module, which offers a huge range of capabilities in a tiny package, ideal for smart lighting/smart building applications, and includes Bluetooth Mesh, Zigbee and Thread protocols to enable multimode networks.