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Integrated Device Technology (IDT) and RFMW have announced a distribution agreement, where RFMW will represent IDT's RF and RF timing products globally.
imec announced it has demonstrated — for the first time — a low-cost, impingement-based solution for cooling ICs at the package level. This is an important innovation to tackle the ever-increasing cooling demands of high performance 3D chips and systems.
Anokiwave announced the next product in a new family of 5G-Gen 2 silicon quad core ICs that enable 3GPP compliant base stations, with the worldwide release of the 24/26 GHz AWMF-0139.
For 5G applications, Sivers IMA and Uppsala University will develop a 24 to 29.5 GHz IC with an antenna integrated in the package. Vinnova, Sweden's government agency for innovation, is funding the project with SEK4 million (approximately $450,000).
Cadence Design Systems Inc. and NI announced a broad-ranging collaboration to improve the overall semiconductor development and test process for next-generation wireless, automotive and mobile ICs and modules.
Continuing to redefine the traditional single function gain block, Anokiwave is releasing two new ICs in a family of multi-function microwave and mmWave silicon ICs, offering transmit/receive functionality with active gain and phase control.
Integra Technologies has announced a new, fully-matched, GaN on SiC RF power transistor developed for C-Band applications. It is rated for CW operation.
Analog Devices Inc. (ADI) introduced a highly integrated, active antenna beamforming chip that allows designers to quickly replace bulky, mechanically-steered antenna platforms with a compact, solid-state solution for phased array radar and communications systems.
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