Materials/Packages/Substrates

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Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K).

Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, 

MasterSil 151S is an addition curing two part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material. 

Master Bond MasterSil 151S is an addition curing two part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material.

EP5G-80 is a one component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80°C for 4 hours. It offers electrical conductivity with a volume resistivity of 5-15 ohm-cm and a thermal conductivity of 2.88-3.46 W/(m•K) at room temperature.

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). 

Master Bond MasterSil 153AO is an addition cured two part silicone with a self priming property. It has a high tensile lap shear strength, especially for a silicone. 

Supreme 17HT possesses high bond strength properties with lap shear strength of 1,900 to 2,100 psi and tensile strength of 7,000 to 8,000 psi.