Semiconductors / Integrated Circuits

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GLOBALFOUNDRIES (GF) announced that the company’s mobile-optimized 8SW RF SOI technology platform has delivered more than a billion dollars of client design win revenue since its launch in September 2017.

Soitec and Shanghai Simgui Technology Co. Ltd. jointly announced an enhanced partnership and an increase in annual production capacity of 200 mm SOI wafers from 180,000 to 360,000 at Simgui's manufacturing facility in Shanghai, China, to better serve the growing global market for RF-SOI in mobile and Power-SOI products.

Targeting power electronics applications, pure-play semiconductor foundry Sanan Integrated Circuit Company has released a 6-inch SiC process to its foundry services portfolio, following full process qualification for commercial release.

Palomar Technologies announced new epoxy die attach capabilities for silver sintering. The silver jet dispensing process is an enhancement to the already wide breadth of Palomar Technologies' solutions for the telecom and datacom markets.

Copper Mountain Technologies (CMT) and Compass Technology Group (CTG) are pleased to announce their new Epsilometer solution for measuring the dielectric properties of materials.

EpiGaN has selected Aixtron’s G5+C MOCVD system to boost its manufacturing capability of large diameter GaN on Si and GaN on SiC epiwafers.

HRL Laboratories was awarded a $9.2 million cost-plus-fixed-fee contract from the Defense Advanced Research Projects Agency (DARPA) for a millimeter wave GaN maturation program.

II-VI Inc. announced a strategic collaboration with Sumitomo Electric Device Innovations Inc. (SEDI) to establish a vertically integrated 150 mm wafer fabrication platform to manufacture GaN on SiC HEMT devices for 5G wireless networks.