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UltraSource, Inc. a supplier of custom thin film circuits and ceramic interconnect devices, today announced the release of a new brochure which details their road to Lean Manufacturing.
Company Uniquely Positioned to Deliver All Key RFIC Building Blocks; Patent-Pending Filter Complements Leadership Power Amplifier Portfolio and World-Class Packaging Capabilities
Although the first mobile radio networks were upgraded to high speed packet access (HSPA) only a short time ago, the next advance in UMTS – UMTS long-term evolution (LTE) – is already around the corner.