Executive Interviews

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Chuck Davo, Owner and CEO at MECA Electronics, Inc. talks about his company’s products and engineering expertise, current trends for RF/Microwave components in both the commercial and military markets and the company’s 50 year history.

NXP's John Croteau, Senior Vice President and General Manager, Business Line high Performance RF, discusses the RF Semiconductor market, the advantages of various semiconductor technologies and his company's product roadmap.

Professor J. David Rhodes, Engineering Emeritus Professor at the University of Leeds is the plenary session speaker at the IEEE MTT-S 2011 International Microwave Symposium (IMS). He elaborates on his eminent research and development work on both sides of the Atlantic, his founding of Filtronic plc, the company’s subsequent expansion, and his ongoing interests.

Davin Lee, CEO of Scintera, talks about this company's history providing semiconductors for wireless communications, their approach to power amplifier linearization and how linearity performance requirements are shaping the market

Larry Pendergrass, Director of Engineering, Sources/Analyzers Product Line, Tektronix, talks about the expanding role of test & measurement instruments in the military and aerospace arena and how today's test solutions are helping to reduce the mission risk

Dr. Alexander Chenakin of Phase Matrix talks about the technology behind the company's state-of-the-art frequency synthesizers and the specific market requirements addressed by these high performance products.

Professor Dr. Peter Waldow is co-founder of IMST GmbH and managing director of its general business operations. He brings comprehensive experience as a senior manager and has coordinated the transfer of EU-/BMBF research results into new products and start-up companies. From 2003 to 2009, Waldow was elected onto the board of the German Association of Electrical, Electronic and Information Technologies (ITG-VDE). He is also a lecturer of electromagnetic field theory at the University of Duisburg-Essen.

Nik Chavannes received his MS and PhD degrees in electrical engineering from the Swiss Federal Institute of Technology (ETH), Zurich, Switzerland. In 1996, he joined the Bioelectromagnetics/EMC Group (BIOEM/EMC) at ETH Zurich where he was involved in computational electrodynamics and related dosimetric applications. From 1998 to 2002, he was with the Laboratory for Electromagnetic Fields and Microwave Electronics (IFH) as well as the Laboratory for Integrated Systems (IIS) at ETH Zurich. There, his research activities focused on the development of FDTD local refinement techniques and their application to numerical near-field analysis. He joined the Foundation for Research on Information Technologies in Society (IT'IS) in late 1999 at the time of its formation. He is currently leading the software and numerics efforts at IT'IS, including computational electromagnetics (CEM) and the simulation platform SEMCAD X.

Dale Wildes has over 21 years of wireless technical and management experience. He is currently Executive Vice President for KMW Communications, a leading RF technology and infrastructure provider. Wildes is responsible for leading sales, product management and customer support for KMW America and Europe. Wildes started his career in 1989 with Pacific Telecom Cellular as an RF engineer, designing and implementing new cellular networks. He graduated from the Milwaukee School of Engineering (BSEET), while also serving in the US National Guard, specializing in wire line and wireless communications. Prior to joining KMW Communications, Wildes has held engineering management, customer support and business development positions with companies specializing in designing and implementing Smart Antenna Systems, Distributed Antenna Systems, Amplifier Systems, Turnkey Solutions and now leading-edge antenna, filter and integrated RF products with KMW Communications.

John Titizian is the President and one of the co-founders of Integra Technologies as well as a founder of M/A-COM PHI in Torrance, CA. He has previously held management positions in product development, chip development, wafer fabrication and application support.