Aerospace and Defense Channel - Technical Articles, Product Innovations, Resources & Technologies

Emerson & Cuming Microwave Products to attend IMS 2012

Laird Technologies Inc., a designer and supplier of customized performance-critical components and systems for advanced electronics and wireless products, announced it will be attending the 2012 International Microwave Symposium and Exhibition. The event is taking place at the Palais des Congrès de Montréal in Montreal, Canada, June 19-21, 2012. Emerson & Cuming Microwave Products, a unit of Laird Technologies can be found at booth #2308.


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ASC Signal introduces redundancy technology

ASC Signal released new redundancy technology and product options designed to provide simplified, seamless switching of virtually any active radio frequency component on the company’s fixed and transportable Earth station antennas. Additionally, these new capabilities support virtually any antenna system, regardless of manufacturer, when used in conjunction with ASC’s antenna controller products.


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Mercury Computer Systems to acquire Micronetics

Mercury Computer Systems Inc. (www.mc.com), a trusted provider of commercially developed application-ready ISR and EW subsystems for defense prime contractors, announced that it has signed a definitive agreement to acquire Micronetics Inc. (www.micronetics.com), a leading designer and manufacturer of microwave and radio frequency (RF) subsystems and components for defense and commercial customers.


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UltraSource Inc. releases new thin film microcircuit CopperVia

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.


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