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Amphenol RF announced the expansion of their cable assembly portfolio with MCX straight and right-angle plug configurations that feature rugged IP67 bulkhead SMA, TNC, RP-TNC and N-Type straight jacks.
Broadcom Inc. announced the launch of its next-generation BCM4918 accelerated processing unit (APU) and two new dual-band Wi-Fi 8 devices, the BCM6714 and BCM6719.
YINCAE Advanced Materials
will showcase its latest wafer-level packaging solutions at the Wafer-Level Packaging Symposium, taking place February 17–19, 2026, in San Francisco, Calif., USA.
Sony Semiconductor Israel (Sony) announced its long-term vision for 5G IoT connectivity, positioning eRedCap (enhanced Reduced Capability) as the foundation for the next generation of global, long-life connected Altair devices.
Professor André Vander Vorst passed away peacefully on December 25, 2025, after a long and distinguished life devoted to science, education and service to the international microwave community.
Researchers from the University of Glasgow’s James Watt School of Engineering have developed a new method of interfacial imprinting ultra-thin nanowires onto bendable, transparent polymeric substrates.
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