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According to a recently published report from Dell’Oro Group, the Mobile Core Network (MCN) market skyrocketed to 32 percent year-over-year (Y/Y) growth in 1Q 2025.
The 71st annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers in all areas of microelectronics research and development, under the theme “100 Years of FETs: Shaping the Future of Device Innovations.”
Rohde & Schwarz announced the launch of the next generation of ARDRONIS Wi-Fi, a cutting-edge system for detecting, locating and mitigating Wi-Fi-controlled drones.
Insight SIP announced it has signed a distribution agreement with New Yorker Electronics, a broad-line distributor serving the North American markets headquartered in Northvale, N.J.
IDTechEx's report "In-Cabin Sensing 2025-2035: Technologies, Opportunities, and Markets" provides an overview of Tesla's in-cabin radar activation, Seeing Machines' 3D camera technology and LG's AI-powered solution, exploring their implications for safety, cost and market trends, supported by industry projections.
Amphenol RF introduces the new high performance 2.4 mm plug or jack to 2.92 mm jack adapters into their extensive and all-encompassing adapter portfolio.
This article examines the tariff landscape, Southeast Asia’s role in PCBA production and why partnering with Naprotek is a strategic move to de-risk supply chains.
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