RF & Microwave Industry News

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RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD’s FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world’s leading WiFi chipset providers.

AR Modular RF announced the addition of Joe Reminder to its U.S. sales staff as the east coast regional sales manager.

Vishay Intertechnology Inc. introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) offering high self resonance,a high Q factor of ≥ 2000, and a low dissipation factor of ≤ 0.05% for operation in high-frequency commercial applications.

The Broadband and ICTs for smart, inclusive and sustainable societies event, organised by the International Telecommunication Union (ITU) and the Ministry of Communication of Brazil, outlined the critical role of broadband-enabled services and applications as facilitators for long-term sustainable economic development.

The French defence procurement agency (DGA) has awarded Thales the development contract for the CONTACT programme, which is designed to equip the majority of the French forces’ platforms with next-generation tactical radios incorporating innovative software-defined radio technology.

NEC Corporation announced that Mobile TeleSystems OJSC, the leading telecommunications provider in Russia and the CIS, together with NEC Neva Communications Systems, a subsidiary of NEC Europe, is providing a new femtocell service in Siberia.

Astrium continues to drive the implementation of the European Data Relay System (EDRS). As prime contractor, Astrium Services has contracted the German Aerospace Centre (DLR) to implement and operate major parts of the ground network.

Rogers Corp.s High Performance Foams Division has introduced a new problem-solving material for handheld mobile devices — Condux Plus™ electrically conductive foam. Even in the most complex, compact handheld electronic designs, Condux Plus materials feature excellent electrical conductivity, consistent mechanical properties, and outstanding electromagnetic (EM) shielding capabilities, allowing them to serve as reliable grounding pads for handheld devices in need of enhanced conductivity and shielding performance.

Agilent Technologies Inc. announced that its long-term relationship with AMCAD Engineering has been extended to include a technology partnership for services related to nonlinear design and measurement of new electronic devices.