Articles Tagged with ''laser''

The role of laser technology in the manufacturing of electronic components and products continues to grow. For instance, more than 20 different laser processes are used in the production of smartphones, such as for structuring thin layers, for producing three-dimensional conductor structures on plastic bodies, and for cutting glass and printed circuit boards. For these applications, the importance of short-pulse and ultrashort-pulse lasers is continually rising. The joint project “(U)SP Laser Beam Sources for Industrial Use and System-wide Productivity Improvement for Highly Dynamic Drilling and Cutting Applications” (InBUS) focuses on increasing efficiency, available output power, and flexibility of these laser sources.

EDI CON USA conference attendees are invited to visit Laser Services at Booth #107, September 20-22 to learn about the latest technology surrounding advanced laser ablation, cutting, drilling, scribing, etching and welding for the microwave and RF industry.

Laser Services, an ISO 9001:2008 - AS9100C and ITAR registered laser job shop, will be exhibiting at the 2016 International Microwave Symposium (IMS) in San Francisco, Calif., being held from May 22–27, in booth #1853. They will be discussing their services and techniques for RF and microwave applications.

NXP Semiconductors introduced the most powerful RF transistor in any technology operating at any frequency. Designed to deliver 1.50 kW CW at 50V, the MRF1K50H can reduce the number of transistors in high-power RF amplifiers, which decreases amplifier size and bill of materials. The MRF1K50H operates up to 500 MHz for a broad range of applications from laser and plasma sources to particle accelerators, industrial welding machines, radio and VHF TV broadcast transmitters, and amateur radio linear amplifiers.

Rogers Corp.’s Power Electronics Solutions (PES) group has introduced its latest high-performance cooling material, curamik® CoolPerformance Plus. curamik CoolPerformance Plus is an advanced liquid-cooled material designed to dissipate large amounts of heat and provide reliable thermal management of high-power laser diodes and other heat-generating optical devices.

Electronics manufacturing equipment manufacturer and laser specialist LPKF Laser & Electronics is launching an entirely new laser drilling and cutting system specifically tailored to the needs of the flexible circuit industry. The LPKF MicroLine 5000 is a UV laser based flex drilling system with a large working area of 21" x 24" and is available in two different laser power classes, depending on customer needs.

GigOptix Inc., a lead designer, developer, and global supplier of a broad range of analog, digital, and mixed signal components to enable high-speed information streaming over the telecom networks, datacom infrastructure, and consumer electronics links, today announced its new, highly integrated, low power dissipation, with a small form factor single and quad channel Limiting 28 Gbps Direct Modulated Laser (DML) driver chipset for 25 Gbps and 100 Gbps Ethernet datacenter and cloud computing applications.

Element Six announced the use of its diamond by researchers at MQ Photonics Research Centre to demonstrate a diamond laser 20 times more powerful than previous diamond laser systems.

Cirexx International announced that they have acquired and installed a second Excellon laser. The new machine is the Cobra-II Hybrid Laser equipped with Excellon’s latest laser technology. It will drill holes, rout boards and micro-machine fine features.

Attendees of the 2015 International Microwave Symposium (IEEE-IMS) Exhibition will have the opportunity to see printed circuit boards made in-person by visiting LPKF Laser & Electronics in Booth #2218. LPKF will be bringing back the versatile milling/laser hybrid Rapid Prototyping system, the ProtoMat D104.