Remcom announces a new electrostatic solver for XFdtd® electromagnetic simulation software. The electrostatic solver enables the use of XFdtd’s capacitance matrix simulation, a critical feature for designing electronics with Touchscreen Panel (TSP) technology.
NI (formerly AWR Corp.) announces that AWR Connected™ for AMCAD will be on display at the International Microwave Symposium 2015 (IMS 2015), May 18 to 22, in Phoenix in NI Booth #2431. AWR Connected for AMCAD provides ready access between NI AWR Design Environment™ V12 software and AMCAD Engineering stability analysis (STAN) software.
Keysight Technologies Inc. announced it will demonstrate the latest RF, microwave and mmWave design and measurement solutions for R&D, manufacturing and service at the IEEE MTT-S International Microwave Symposium, Booth 739, Phoenix, May 17-22.
ANSYS, a global leader in engineering simulation software, will host a special information session at the IEEE MTT-S International Microwave Symposium (IMS2015) in room 102 BC of the Phoenix convention center on Thursday, May 21. The one hour session entitled, “Leveraging Protected IP with Encrypted 3D HFSS Components for Next Generation Wireless Design & Integration” will highlight a new patent pending capability for sharing high-fidelity electrical models used in high-frequency circuit and system simulations.
Tech-X Corp. will be at IMS this year presenting their software solutions for electromagnetic and particle modeling. For 10 years Tech-X has been the industry leader in microwave device simulations with their flagship software tool, VSim.