Articles Tagged with ''chip''

Florida RF Labs has added broadband resistive power dividers to the HybriX® line of signal distribution products. The new RPD series offers significant advantages over on-board multi-resistor design by providing excellent broadband frequency response, highly repeatable performance, and streamlined assembly process in a monolithic surface-mountable chip package.

Vishay Intertechnology Inc. introduced the industry's first wirebondable thin film chip resistors with compact 40 x 40 mil (1 x 1 mm) footprints to feature high resistance to 100 MΩ. The new CS44 <http://www.vishay.com/doc?60114> series features low TCR down to ± 50 ppm/°C and tolerances to ± 0.5 %.

Sumitomo Electric Device Innovations USA Inc. (SEDU), a provider of advanced wireless and optical communications solutions, will showcase its E-band MMICs for radio link applications at IMS 2012 in Montreal.

Researchers at MIT have found a new way of making complex three-dimensional structures using self-assembling polymer materials that form tiny wires and junctions. The work has the potential to usher in a new generation of microchips and other devices made up of submicroscopic features.