Articles Tagged with ''product''

Pasternack releases new 2014 RF product guide

 Pasternack Enterprises, Inc., an industry-leading manufacturer and supplier of RF, microwave and millimeter wave products, releases their 2014 RF product guide. The company’s latest 264 page catalog contains thousands of in-stock Pasternack products such as RF cable assemblies, an expanded portfolio of RF amplifiers, 60 GHz systems and modules and hundreds of other passive and active RF components, all available for same-day shipping worldwide. 


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Mentor Graphics launches new Xpedition platform to optimize advanced PCB systems design productivity

Mentor Graphics Corp. announced the first phase of a new systems design enterprise platform to address today’s printed circuit board (PCB) systems challenges of increased complexity, changing team demographics, and systems-aware design requirements. The Mentor Graphics Xpedition™ platform significantly simplifies and accelerates the development of the industry’s most challenging designs. By combining an intuitive design environment with designer-driven automation, the Xpedition platform addresses the changing responsibilities of designers, including global team-based organizations, so that users can perform at expert levels for optimum productivity. The result is shortened product development cycles, minimized design re-spins, and improved product quality. The first phase of the launch announces new Xpedition PCB layout technology.


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Crane Aerospace & Electronics Microwave Solution launches the Ku-Band Iso-Divider product line for space applications

Crane Aerospace & Electronics Microwave Solution launches its new Ku-Band Iso-Divider product line designed for use in satellite applications. This unit combines the functions of high performance power dividers with ferrite isolators to provide a high isolation power divider solution, making the external isolators redundant, for satellite receiver applications, without introducing complex switchbased solutions. Integration of the two functions into a single package provides enhanced product reliability due to fewer external components, interconnects and transitions.


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