Hesse & Knipps, a manufacturer of high-speed fine pitch wedge bonders for the back-end semiconductor industry, will be demonstrating the capabilities of the BONDJET BJ820 this week in booth 1149. The BONDJET BJ820 is a high-speed fully automatic wedge bonder that offers the flexibility for both high-speed round wire and deep access ribbon and wire bonding. It handles all challenging fine pitch wire bonding applications in a single platform - including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive - using aluminum or gold wire or ribbon up to 6 wires/second. The looping profiles and height consistencies offered by the BONDJET BJB20 meet and exceed RF/microwave market expectations.
With high repeatability of 1 μm at a balanced encoder resolution of 20 nm, the BJ820 BONDJET offers increased process stability that enables reliable bonding of extremely small bond pads with a larger wire diameter. An efficient 12” x 16.1” work area can serve as two or more smaller stations for efficient handling of smaller products or substrates. Coupled with intelligent automation solutions, these features eliminate significant indexing time, resulting in 60 percent greater throughput than competing machines.
“The BONDJET BJ820 offers very high repeatability for high volume production environments and a large control work area for both wire and ribbon bonding, offering greater throughput than competitive technology,” notes Joseph Bubel, president, Hesse & Knipps Inc. “It offers a cost-effective alternative for ribbon bonding, which is gaining greater popularity for use in high frequency electronics within the microwave market.”