SUSS MicroTec and Surface Technology Systems (STS), providers of MEMS manufacturing solutions worldwide, announced a US-based roadshow called "MEMS Technology: Embracing the Future," scheduled to debut in Boston, MA on April 20th.
"MEMS Technology: Embracing the Future" will include presentations on the latest critical manufacturing processes in MEMS today. Talks will cover high aspect ratio lithography and plasma etching, wafer bonding, dry release processing, and wafer level test.
In addition, speakers will discuss the key manufacturing issues critical for advanced MEMS device fabrication today. SUSS and STS have invited representatives from Primaxx Inc. and XACTIX Inc. to join the roadshow, creating a unique opportunity to listen to industry experts cover most of the key MEMS technologies used today.
John Saunders, CEO of STS, explained: "We are very excited to have the opportunity to co-host this roadshow and share our experience and vision for the future of MEMS manufacturing. Like SUSS, we are committed to advancing technology and enabling customers to manage the complexities of MEMS chip fabrication today."
"We work every day with MEMS customers who are pushing the technology envelope," said Michael Kipp, president, Wafer Bonder Division, SUSS MicroTec, Waterbury, VT. "By coming together with companies like STS who do the same, we are in a unique position to help the industry develop strategies for handling rapidly changing technology and MEMS manufacturing challenges."
The "MEMS Technology: Embracing the Future" roadshow will begin in Boston on April 20th and in the following weeks will move on to geographic technology centers including Austin, TX and San Jose, CA. Presenters will provide an overview of the leading-edge technologies currently available to support the most advanced MEMS processes. More detailed information is available at www.memsroadshow.com.